Suan Zin Boon

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 10,622,308
- Issue date Apr 14, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,396,059
- Issue date Aug 27, 2019
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 10,056,359
- Issue date Aug 21, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 9,911,696
- Issue date Mar 6, 2018
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 9,653,444
- Issue date May 16, 2017
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 9,165,910
- Issue date Oct 20, 2015
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 8,906,744
- Issue date Dec 9, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high-density module with integrated wafer level packages
- Patent number 8,698,295
- Issue date Apr 15, 2014
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging
- Patent number 8,564,106
- Issue date Oct 22, 2013
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging circuits
- Patent number 8,555,495
- Issue date Oct 15, 2013
- Micron Technology, Inc.
- Yong Poo Chia
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 8,536,702
- Issue date Sep 17, 2013
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with leadframes, including leadframe-b...
- Patent number 8,525,320
- Issue date Sep 3, 2013
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for packaged semiconductor devices and methods for ma...
- Patent number 8,445,330
- Issue date May 21, 2013
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies and methods of manufacturing such assembli...
- Patent number 8,362,594
- Issue date Jan 29, 2013
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high-density module with integrated wafer level packages
- Patent number 8,304,894
- Issue date Nov 6, 2012
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 8,232,657
- Issue date Jul 31, 2012
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 8,198,720
- Issue date Jun 12, 2012
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging
- Patent number 8,106,488
- Issue date Jan 31, 2012
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging circuits
- Patent number 8,065,792
- Issue date Nov 29, 2011
- Micron Technology, Inc.
- Yong Poo Chia
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor device assemblies and packages
- Patent number 8,063,493
- Issue date Nov 22, 2011
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level pre-packaged flip chip
- Patent number 7,943,422
- Issue date May 17, 2011
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor assemblies and methods of manufacturing such assembli...
- Patent number 7,915,711
- Issue date Mar 29, 2011
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Super high density module with integrated wafer level packages
- Patent number 7,884,007
- Issue date Feb 8, 2011
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor assemblies and methods for manufacturing suc...
- Patent number 7,855,462
- Issue date Dec 21, 2010
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic die packages with metal leads, including metal lead...
- Patent number 7,843,050
- Issue date Nov 30, 2010
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level packaging
- Patent number 7,820,484
- Issue date Oct 26, 2010
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level pre-packaged flip chip
- Patent number 7,812,447
- Issue date Oct 12, 2010
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level pre-packaged flip chip system
- Patent number 7,808,112
- Issue date Oct 5, 2010
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects for packaged semiconductor devices and methods for ma...
- Patent number 7,791,203
- Issue date Sep 7, 2010
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging circuits and packaged circuits
- Patent number 7,712,211
- Issue date May 11, 2010
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20220013460
- Publication date Jan 13, 2022
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20200243444
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20180323179
- Publication date Nov 8, 2018
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20180158778
- Publication date Jun 7, 2018
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20170207206
- Publication date Jul 20, 2017
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20160099237
- Publication date Apr 7, 2016
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20150091166
- Publication date Apr 2, 2015
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20140124960
- Publication date May 8, 2014
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...
- Publication number 20140015130
- Publication date Jan 16, 2014
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING
- Publication number 20120119263
- Publication date May 17, 2012
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING CIRCUITS
- Publication number 20120064697
- Publication date Mar 15, 2012
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING
- Publication number 20110018143
- Publication date Jan 27, 2011
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING CIRCUITS AND PACKAGED CIRCUITS
- Publication number 20100146780
- Publication date Jun 17, 2010
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES WITH EDGE CONTACTS AND...
- Publication number 20100072603
- Publication date Mar 25, 2010
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...
- Publication number 20090014858
- Publication date Jan 15, 2009
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGING
- Publication number 20080211113
- Publication date Sep 4, 2008
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super High Density Module with Integrated Wafer Level Packages
- Publication number 20070264751
- Publication date Nov 15, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20070152327
- Publication date Jul 5, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Super high density module with integrated wafer level packages
- Publication number 20070145558
- Publication date Jun 28, 2007
- Micron Technology, Inc.
- Yong Poo Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package
- Publication number 20070059862
- Publication date Mar 15, 2007
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level pre-packaged flip chip systems
- Publication number 20060261493
- Publication date Nov 23, 2006
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PRE-PACKAGED FLIP CHIP
- Publication number 20060261475
- Publication date Nov 23, 2006
- Micron Technology, Inc.
- Suan J. Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PRE-PACKAGED FLIP CHIP
- Publication number 20060258052
- Publication date Nov 16, 2006
- Micron Technology, Inc.
- Suan J. Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PRE-PACKAGED FLIP CHIP SYSTEM
- Publication number 20060255475
- Publication date Nov 16, 2006
- Micron Technology, Inc.
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromechanical information browsing device
- Publication number 20060038778
- Publication date Feb 23, 2006
- E-BOOK SYSTEMS PTE LTD
- Suan Zin Boon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor device assemblies and packages with edge contacts and...
- Publication number 20060006521
- Publication date Jan 12, 2006
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Castellation wafer level packaging of integrated circuit chips
- Publication number 20060001143
- Publication date Jan 5, 2006
- Suan Jeung Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multiple chip semiconductor package and method of fabricating same
- Publication number 20050236709
- Publication date Oct 27, 2005
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making multichip wafer level packages and computing syste...
- Publication number 20050116337
- Publication date Jun 2, 2005
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multichip wafer level packages and computing systems incorporating...
- Publication number 20050073029
- Publication date Apr 7, 2005
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS

Suan Zin Boon

Person

Patents Grantslast 30 patents

Packaged semiconductor assemblies and methods for manufacturing suc...

Microelectronic die packages with metal leads, including metal lead...

Microelectronic die packages with metal leads, including metal lead...

Packaged semiconductor assemblies and methods for manufacturing suc...

Microelectronic die packages with metal leads, including metal lead...

Microelectronic die packages with metal leads, including metal lead...

Microelectronic die packages with metal leads, including metal lead...

Super high-density module with integrated wafer level packages

Wafer level packaging

Method for packaging circuits

Microelectronic die packages with metal leads, including metal lead...

Microelectronic die packages with leadframes, including leadframe-b...

Interconnects for packaged semiconductor devices and methods for ma...

Semiconductor assemblies and methods of manufacturing such assembli...

Super high-density module with integrated wafer level packages

Packaged semiconductor assemblies and methods for manufacturing suc...

Microelectronic die packages with metal leads, including metal lead...

Wafer level packaging

Method for packaging circuits

Semiconductor device assemblies and packages

Wafer level pre-packaged flip chip

Semiconductor assemblies and methods of manufacturing such assembli...

Super high density module with integrated wafer level packages

Packaged semiconductor assemblies and methods for manufacturing suc...

Microelectronic die packages with metal leads, including metal lead...

Wafer level packaging

Wafer level pre-packaged flip chip

Wafer level pre-packaged flip chip system

Interconnects for packaged semiconductor devices and methods for ma...

Method for packaging circuits and packaged circuits

Patents Applicationslast 30 patents

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

MICROELECTRONIC DIE PACKAGES WITH METAL LEADS, INCLUDING METAL LEAD...

WAFER LEVEL PACKAGING

METHOD FOR PACKAGING CIRCUITS

WAFER LEVEL PACKAGING

METHOD FOR PACKAGING CIRCUITS AND PACKAGED CIRCUITS

SEMICONDUCTOR DEVICE ASSEMBLIES AND PACKAGES WITH EDGE CONTACTS AND...

PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUC...

WAFER LEVEL PACKAGING

Super High Density Module with Integrated Wafer Level Packages

Super high density module with integrated wafer level packages

Super high density module with integrated wafer level packages

Multiple chip semiconductor package

Wafer level pre-packaged flip chip systems

WAFER LEVEL PRE-PACKAGED FLIP CHIP

WAFER LEVEL PRE-PACKAGED FLIP CHIP

WAFER LEVEL PRE-PACKAGED FLIP CHIP SYSTEM

Electromechanical information browsing device

Semiconductor device assemblies and packages with edge contacts and...

Castellation wafer level packaging of integrated circuit chips

Multiple chip semiconductor package and method of fabricating same

Method of making multichip wafer level packages and computing syste...

Multichip wafer level packages and computing systems incorporating...