Suangwu Huang

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Multiple chip semiconductor package
- Patent number 7,553,697
- Issue date Jun 30, 2009
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multichip wafer level packages and computing syste...
- Patent number 7,485,562
- Issue date Feb 3, 2009
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 7,173,330
- Issue date Feb 6, 2007
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip wafer level packages and computing systems incorporating...
- Patent number 7,087,992
- Issue date Aug 8, 2006
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package and method of fabricating same
- Patent number 6,987,031
- Issue date Jan 17, 2006
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip wafer level system packages and methods of forming same
- Patent number 6,964,881
- Issue date Nov 15, 2005
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip semiconductor package
- Patent number 6,958,537
- Issue date Oct 25, 2005
- Micron Technology, Inc.
- Meow Koon Eng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip wafer level packages and computing systems incorporating...
- Patent number 6,825,553
- Issue date Nov 30, 2004
- Micron Technology, Inc.
- Swee Kwang Chua
- H01 - BASIC ELECTRIC ELEMENTS

Suangwu Huang

Person

Patents Grantslast 30 patents

Multiple chip semiconductor package

Method of making multichip wafer level packages and computing syste...

Multiple chip semiconductor package

Multichip wafer level packages and computing systems incorporating...

Multiple chip semiconductor package and method of fabricating same

Multi-chip wafer level system packages and methods of forming same

Multiple chip semiconductor package

Multichip wafer level packages and computing systems incorporating...