Subhas Bothra

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fully differential, high Q, on-chip, impedance matching section
- Patent number 8,274,353
- Issue date Sep 25, 2012
- Broadcom Corporation
- Carol Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method allowing for safe use of a headset
- Patent number 8,270,629
- Issue date Sep 18, 2012
- Broadcom Corporation
- Subhas Bothra
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Fully differential, high Q, on-chip, impedance matching section
- Patent number 7,911,310
- Issue date Mar 22, 2011
- Broadcom Corporation
- Carol Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to implement metal fill during integrated circuit design and...
- Patent number 7,614,024
- Issue date Nov 3, 2009
- Broadcom Corporation
- Subhas Bothra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fully differential, high Q, on-chip, impedance matching section
- Patent number 7,489,221
- Issue date Feb 10, 2009
- Broadcom Corporation
- Carol Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
I/O driver power distribution method for reducing silicon area
- Patent number 7,434,189
- Issue date Oct 7, 2008
- Broadcom Corporation
- Donald Baumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully differential, high Q, on-chip, impedance matching section
- Patent number 7,095,307
- Issue date Aug 22, 2006
- Broadcom Corporation
- Carol Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad metallization over active circuitry
- Patent number 6,787,908
- Issue date Sep 7, 2004
- Koninklijke Philips Electronics N.V.
- Steven L Skala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor inductor and methods for making the same
- Patent number 6,717,232
- Issue date Apr 6, 2004
- Koninklijke Philips Electronics N.V.
- Subhas Bothra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to increase density of MIM capacitors between adjacent me...
- Patent number 6,710,425
- Issue date Mar 23, 2004
- Zeevo, Inc.
- Subhas Bothra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for making semiconductor inductor
- Patent number 6,573,148
- Issue date Jun 3, 2003
- Koninklljke Philips Electronics N.V.
- Subhas Bothra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming co-axial interconnect lines in a CMOS process f...
- Patent number 6,569,757
- Issue date May 27, 2003
- Philips Electronics North America Corporation
- Milind Weling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for implementing co-axial interconnect lines in a CMOS proc...
- Patent number 6,545,338
- Issue date Apr 8, 2003
- Koninklijke Philips Electronics N.V.
- Subhas Bothra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring structure for IC containing integrated digital/RF/analog...
- Patent number 6,492,716
- Issue date Dec 10, 2002
- Zeevo, Inc.
- Subhas Bothra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Waveguide structures integrated with standard CMOS circuitry and me...
- Patent number 6,387,720
- Issue date May 14, 2002
- Phillips Electronics North America Corporation
- Michael Misheloff
- G02 - OPTICS
Information Patent Grant
Programmable integrated circuit structures and methods for making t...
- Patent number 6,355,969
- Issue date Mar 12, 2002
- Philips Electronics North America Corporation
- Stephen L. Skala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intelligent gate-level fill methods for reducing global pattern den...
- Patent number 6,323,113
- Issue date Nov 27, 2001
- Philips Electronics North America Corporation
- Calvin T. Gabriel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap dielectric in self-aligned via structures
- Patent number 6,281,585
- Issue date Aug 28, 2001
- Philips Electronics North America Corporation
- Subhas Bothra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad metallization over active circuitry
- Patent number 6,261,939
- Issue date Jul 17, 2001
- Philips Semiconductors, Inc.
- Stephen L. Skala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin capacitive structures and methods for making the same
- Patent number 6,229,685
- Issue date May 8, 2001
- Philips Electronics North America Corp.
- Subhas Bothra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of gate and diffusion contacts in self-aligned contact...
- Patent number 6,159,844
- Issue date Dec 12, 2000
- Philips Electronics North America Corp.
- Subhas Bothra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration bonding process and system
- Patent number 6,156,626
- Issue date Dec 5, 2000
- Philips Electronics North America Corp.
- Subhas Bothra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating gate and diffusion contacts in self-aligned...
- Patent number 6,080,661
- Issue date Jun 27, 2000
- Philips Electronics North America Corp.
- Subhas Bothra
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fully Differential, High Q, On-Chip, Impedance Matching Section
- Publication number 20110163831
- Publication date Jul 7, 2011
- BROADCOM CORPORATION
- Carol Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fully Differential, High Q, On-Chip, Impedance Matching Section
- Publication number 20090127654
- Publication date May 21, 2009
- BROADCOM CORPORATION
- Carol Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power supply integration for low power single chip RF CMOS solution...
- Publication number 20070210775
- Publication date Sep 13, 2007
- BROADCOM CORPORATION
- Subhas Bothra
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
I/O driver power distribution method for reducing silicon area
- Publication number 20070090401
- Publication date Apr 26, 2007
- Donald Baumann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method allowing for safe use of a headset
- Publication number 20070092087
- Publication date Apr 26, 2007
- BROADCOM CORPORATION
- Subhas Bothra
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Method to implement metal fill during integrated circuit design and...
- Publication number 20070083833
- Publication date Apr 12, 2007
- Subhas Bothra
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Fully differential, high Q, on-chip, impedance matching section
- Publication number 20060273874
- Publication date Dec 7, 2006
- BROADCOM CORPORATION
- Carol Barrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor inductor and methods for making the same
- Publication number 20030170989
- Publication date Sep 11, 2003
- PHILIPS ELECTRONICS NORTH AMERICA CORP.
- Subhas Bothra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and method to increase density of MIM capacitors in damas...
- Publication number 20020192919
- Publication date Dec 19, 2002
- Subhas Bothra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pad metallization over active circuitry
- Publication number 20010026018
- Publication date Oct 4, 2001
- Philips Semiconductors, Inc.
- Stephen L. Skala
- H01 - BASIC ELECTRIC ELEMENTS

Subhas Bothra

Person

Patents Grantslast 30 patents

Fully differential, high Q, on-chip, impedance matching section

System and method allowing for safe use of a headset

Fully differential, high Q, on-chip, impedance matching section

Method to implement metal fill during integrated circuit design and...

Fully differential, high Q, on-chip, impedance matching section

I/O driver power distribution method for reducing silicon area

Fully differential, high Q, on-chip, impedance matching section

Pad metallization over active circuitry

Semiconductor inductor and methods for making the same

Structure to increase density of MIM capacitors between adjacent me...

Methods for making semiconductor inductor

Methods for forming co-axial interconnect lines in a CMOS process f...

Methods for implementing co-axial interconnect lines in a CMOS proc...

Seal ring structure for IC containing integrated digital/RF/analog...

Waveguide structures integrated with standard CMOS circuitry and me...

Programmable integrated circuit structures and methods for making t...

Intelligent gate-level fill methods for reducing global pattern den...

Air gap dielectric in self-aligned via structures

Pad metallization over active circuitry

Thin capacitive structures and methods for making the same

Fabrication of gate and diffusion contacts in self-aligned contact...

Electromigration bonding process and system

Methods for fabricating gate and diffusion contacts in self-aligned...

Patents Applicationslast 30 patents

Fully Differential, High Q, On-Chip, Impedance Matching Section

Fully Differential, High Q, On-Chip, Impedance Matching Section

Power supply integration for low power single chip RF CMOS solution...

I/O driver power distribution method for reducing silicon area

System and method allowing for safe use of a headset

Method to implement metal fill during integrated circuit design and...

Fully differential, high Q, on-chip, impedance matching section

Semiconductor inductor and methods for making the same

Structure and method to increase density of MIM capacitors in damas...

Pad metallization over active circuitry