Sudipto Neogi

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
IC package pressure release apparatus and method
- Patent number 7,242,088
- Issue date Jul 10, 2007
- Intel Corporation
- Sudipto Neogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Windowed package for electronic circuitry
- Patent number 7,220,624
- Issue date May 22, 2007
- Intel Corporation
- Sudipto Neogi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Windowed package for electronic circuitry
- Publication number 20050253254
- Publication date Nov 17, 2005
- Sudipto Neogi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IC package pressure release apparatus and method
- Publication number 20020084532
- Publication date Jul 4, 2002
- Sudipto Neogi
- H01 - BASIC ELECTRIC ELEMENTS