Sujatha Sankaran

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Device and methodology for reducing effective dielectric constant i...
- Patent number 8,343,868
- Issue date Jan 1, 2013
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Capping of copper interconnect lines in integrated circuit devices
- Patent number 8,298,948
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing effective dielectric constant in semiconductor devices
- Patent number 8,129,286
- Issue date Mar 6, 2012
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Interconnect structure for integrated circuits having improved elec...
- Patent number 8,056,039
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an embedded barrier layer for protection from che...
- Patent number 7,968,456
- Issue date Jun 28, 2011
- International Business Machines Corporation
- Paul S. McLaughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics structures using a sacrificial multi-layer hardmask scheme
- Patent number 7,947,907
- Issue date May 24, 2011
- International Business Machines Corporation
- Matthew Earl Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and methodology for reducing effective dielectric constant i...
- Patent number 7,892,940
- Issue date Feb 22, 2011
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Reliability of wide interconnects
- Patent number 7,776,737
- Issue date Aug 17, 2010
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method of forming electrically blown metal fuses for...
- Patent number 7,737,528
- Issue date Jun 15, 2010
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test structure for determining optimal seed and liner layer thickne...
- Patent number 7,671,362
- Issue date Mar 2, 2010
- International Business Machines Corporation
- Tibor Bolom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etchback of interconnect contacts
- Patent number 7,645,700
- Issue date Jan 12, 2010
- International Business Machines Corporation
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and methodology for reducing effective dielectric constant i...
- Patent number 7,592,685
- Issue date Sep 22, 2009
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and process of making the same
- Patent number 7,488,679
- Issue date Feb 10, 2009
- International Business Machines Corporation
- Theodorus Eduardus Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device and methodology for reducing effective dielectric constant i...
- Patent number 7,405,147
- Issue date Jul 29, 2008
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded barrier for dielectric encapsulation
- Patent number 7,394,154
- Issue date Jul 1, 2008
- International Business Machines Corporation
- Paul S. McLaughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for preparing electronics structures using a sacrificial mu...
- Patent number 7,371,684
- Issue date May 13, 2008
- International Business Machines Corporation
- Matthew Earl Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry etchback of interconnect contacts
- Patent number 7,323,410
- Issue date Jan 29, 2008
- International Business Machines Corporation
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Capping of Copper Interconnect Lines in Integrated Circuit Devices
- Publication number 20110108990
- Publication date May 12, 2011
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20110111590
- Publication date May 12, 2011
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Application
RELIABILITY OF WIDE INTERCONNECTS
- Publication number 20100038790
- Publication date Feb 18, 2010
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF FORMING ELECTRICALLY BLOWN METAL FUSES FOR...
- Publication number 20090294901
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Griselda Bonilla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING IMPROVED ELEC...
- Publication number 20090294973
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Kaushik Chanda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCTURE FOR DETERMINING OPTIMAL SEED AND LINER LAYER THICKNE...
- Publication number 20090146143
- Publication date Jun 11, 2009
- International Business Machines Corporation
- Tibor Bolom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20080254630
- Publication date Oct 16, 2008
- International Business Machines Corporation
- Daniel C. EDELSTEIN
- B82 - NANO-TECHNOLOGY
Information Patent Application
Electronics Structures Using a Sacrificial Multi-Layer Hardmask Scheme
- Publication number 20080251284
- Publication date Oct 16, 2008
- International Business Machines Corporation
- Matthew Earl Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BARRIER FOR DIELECTRIC ENCAPSULATION
- Publication number 20080217777
- Publication date Sep 11, 2008
- International Business Machines Corporation
- Paul S. McLaughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCHBACK OF INTERCONNECT CONTACTS
- Publication number 20080088027
- Publication date Apr 17, 2008
- International Business Machines Corporation
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20080038915
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20080038923
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Application
INTERCONNECT STRUCTURE AND PROCESS OF MAKING THE SAME
- Publication number 20080026568
- Publication date Jan 31, 2008
- International Business Machines Corporation
- Theodorus Eduardus Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Damascene interconnection having a SiCOH low k layer
- Publication number 20070232048
- Publication date Oct 4, 2007
- Koji Miyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded barrier for dielectric encapsulation
- Publication number 20070057374
- Publication date Mar 15, 2007
- International Business Machines Corporation
- Paul S. McLaughlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY ETCHBACK OF INTERCONNECT CONTACTS
- Publication number 20070032055
- Publication date Feb 8, 2007
- International Business Machines Corporation
- Theodorus E. Standaert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for preparing electronics structures using a sacrificial mu...
- Publication number 20060258159
- Publication date Nov 16, 2006
- International Business Machines Corporation
- Matthew Earl Colburn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20050167838
- Publication date Aug 4, 2005
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY

Sujatha Sankaran

Person

Patents Grantslast 30 patents

Device and methodology for reducing effective dielectric constant i...

Capping of copper interconnect lines in integrated circuit devices

Reducing effective dielectric constant in semiconductor devices

Interconnect structure for integrated circuits having improved elec...

Method of forming an embedded barrier layer for protection from che...

Electronics structures using a sacrificial multi-layer hardmask scheme

Device and methodology for reducing effective dielectric constant i...

Reliability of wide interconnects

Structure and method of forming electrically blown metal fuses for...

Test structure for determining optimal seed and liner layer thickne...

Dry etchback of interconnect contacts

Device and methodology for reducing effective dielectric constant i...

Interconnect structure and process of making the same

Device and methodology for reducing effective dielectric constant i...

Embedded barrier for dielectric encapsulation

Process for preparing electronics structures using a sacrificial mu...

Dry etchback of interconnect contacts

Patents Applicationslast 30 patents

Capping of Copper Interconnect Lines in Integrated Circuit Devices

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...

RELIABILITY OF WIDE INTERCONNECTS

STRUCTURE AND METHOD OF FORMING ELECTRICALLY BLOWN METAL FUSES FOR...

INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING IMPROVED ELEC...

TEST STRUCTURE FOR DETERMINING OPTIMAL SEED AND LINER LAYER THICKNE...

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...

Electronics Structures Using a Sacrificial Multi-Layer Hardmask Scheme

EMBEDDED BARRIER FOR DIELECTRIC ENCAPSULATION

DRY ETCHBACK OF INTERCONNECT CONTACTS

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...

INTERCONNECT STRUCTURE AND PROCESS OF MAKING THE SAME

Damascene interconnection having a SiCOH low k layer

Embedded barrier for dielectric encapsulation

DRY ETCHBACK OF INTERCONNECT CONTACTS

Process for preparing electronics structures using a sacrificial mu...

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...