Sukru YEMENICIOGLU

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit structure with front side signal lines and backs...
- Patent number 12,051,692
- Issue date Jul 30, 2024
- Intel Corporation
- Quan Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically spaced intra-level interconnect line metallization for i...
- Patent number 11,948,874
- Issue date Apr 2, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal space centered standard cell architecture to enable higher ce...
- Patent number 11,764,219
- Issue date Sep 19, 2023
- Intel Corporation
- Harshitha Vishwanath
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
N-TYPE TRANSISTOR FABRICATION IN COMPLEMENTARY FET (CFET) DEVICES
- Publication number 20250006812
- Publication date Jan 2, 2025
- Intel Corporation
- Sudipto Naskar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CELL ROWS WITH MIXED HEIGHTS AND MIXED NANORIBBON WIDTHS
- Publication number 20250006721
- Publication date Jan 2, 2025
- Intel Corporation
- Sukru Yemenicioglu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STAGGERED VIA ARCHITECTURE ACROSS UNIT CELLS
- Publication number 20240429161
- Publication date Dec 26, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORKSHEET DEVICES WITH DIELECTRIC SPINE AT CELL BOUNDARY
- Publication number 20240429276
- Publication date Dec 26, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH FRONT SIDE SIGNAL LINES AND BACKS...
- Publication number 20240355819
- Publication date Oct 24, 2024
- Intel Corporation
- Quan SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT COMPONENTS WITH HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL
- Publication number 20240332285
- Publication date Oct 3, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH HETEROGENOUS TRANSISTORS
- Publication number 20240332299
- Publication date Oct 3, 2024
- Intel Corporation
- Abhishek Anil Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VARACTOR COMPRISING HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL
- Publication number 20240332432
- Publication date Oct 3, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARCHITECTURES AND METHODS FOR COMPUTATION IN MEMORY (CIM) WITH BACK...
- Publication number 20240324167
- Publication date Sep 26, 2024
- Intel Corporation
- Sudipto Naskar
Information Patent Application
VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR I...
- Publication number 20240243052
- Publication date Jul 18, 2024
- Intel Corporation
- Kevin L. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH HYBRID METAL LINES
- Publication number 20240203869
- Publication date Jun 20, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS RECESSED...
- Publication number 20240113111
- Publication date Apr 4, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SOURCE OR DRAIN CONTACT FLYOVER
- Publication number 20240113177
- Publication date Apr 4, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORKSHEET TRANSISTOR STRUCTURES WITH GATE CUT SPINE
- Publication number 20240113104
- Publication date Apr 4, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WALL THAT INCLUDES A GAS BETWEEN METAL GATES OF A SEMICONDUCTOR DEVICE
- Publication number 20240113108
- Publication date Apr 4, 2024
- Intel Corporation
- Sukru YEMENICIOGLU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT, WITH ASYMMETRICAL CHANNEL TO GATE CUT SPACING
- Publication number 20240113107
- Publication date Apr 4, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEG...
- Publication number 20240113019
- Publication date Apr 4, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCH STOP LAYER FOR METAL GATE CUT
- Publication number 20240113106
- Publication date Apr 4, 2024
- Intel Corporation
- Sukru Yemenicioglu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WALL COUPLED WITH TWO STACKS OF NANORIBBONS TO ELECTRICAL ISOLATE G...
- Publication number 20240113233
- Publication date Apr 4, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE WITH METAL LAYER INCLUDING STAGGERED...
- Publication number 20240105589
- Publication date Mar 28, 2024
- Intel Corporation
- Shao Ming Koh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH GATE VOLUME REDUCTION
- Publication number 20240105801
- Publication date Mar 28, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORM GRID METAL GATE AND TR...
- Publication number 20240105716
- Publication date Mar 28, 2024
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY FOR MULTI...
- Publication number 20240063210
- Publication date Feb 22, 2024
- Intel Corporation
- Nischal ARKALI RADHAKRISHNA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER STAPLE
- Publication number 20230420512
- Publication date Dec 28, 2023
- Intel Corporation
- Sukru YEMENICIOGLU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH RECESSED SELF-ALIGNED DEEP BOUNDA...
- Publication number 20230420360
- Publication date Dec 28, 2023
- Intel Corporation
- Mohit HARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL ROUTING THAT OVERLAPS NMOS AND PMOS REGIONS OF A TRANSISTOR
- Publication number 20230317602
- Publication date Oct 5, 2023
- Intel Corporation
- Sukru YEMENICIOGLU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING CONDUCTIVE STRUCTURES IN FIN I...
- Publication number 20230317731
- Publication date Oct 5, 2023
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED CHANNEL SIZING
- Publication number 20230317808
- Publication date Oct 5, 2023
- Intel Corporation
- Rishabh MEHANDRU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH PRE-EPITAXIAL DEEP VIA STRUCTURE
- Publication number 20230317595
- Publication date Oct 5, 2023
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE GATE TIE-DOWN
- Publication number 20230317787
- Publication date Oct 5, 2023
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS

Sukru YEMENICIOGLU

Person

Patents Grantslast 30 patents

Integrated circuit structure with front side signal lines and backs...

Vertically spaced intra-level interconnect line metallization for i...

Metal space centered standard cell architecture to enable higher ce...

Patents Applicationslast 30 patents

N-TYPE TRANSISTOR FABRICATION IN COMPLEMENTARY FET (CFET) DEVICES

CELL ROWS WITH MIXED HEIGHTS AND MIXED NANORIBBON WIDTHS

STAGGERED VIA ARCHITECTURE ACROSS UNIT CELLS

FORKSHEET DEVICES WITH DIELECTRIC SPINE AT CELL BOUNDARY

INTEGRATED CIRCUIT STRUCTURE WITH FRONT SIDE SIGNAL LINES AND BACKS...

CIRCUIT COMPONENTS WITH HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL

INTEGRATED CIRCUIT DEVICE WITH HETEROGENOUS TRANSISTORS

VARACTOR COMPRISING HIGH PERFORMANCE THIN FILM TRANSISTOR MATERIAL

ARCHITECTURES AND METHODS FOR COMPUTATION IN MEMORY (CIM) WITH BACK...

VERTICALLY SPACED INTRA-LEVEL INTERCONNECT LINE METALLIZATION FOR I...

INTEGRATED CIRCUIT DEVICES WITH HYBRID METAL LINES

INTEGRATED CIRCUIT STRUCTURES HAVING FIN ISOLATION REGIONS RECESSED...

STACKED SOURCE OR DRAIN CONTACT FLYOVER

FORKSHEET TRANSISTOR STRUCTURES WITH GATE CUT SPINE

WALL THAT INCLUDES A GAS BETWEEN METAL GATES OF A SEMICONDUCTOR DEVICE

GATE CUT, WITH ASYMMETRICAL CHANNEL TO GATE CUT SPACING

SPLIT VIA STRUCTURES COUPLED TO CONDUCTIVE LINES FOR ADVANCED INTEG...

ETCH STOP LAYER FOR METAL GATE CUT

WALL COUPLED WITH TWO STACKS OF NANORIBBONS TO ELECTRICAL ISOLATE G...

INTEGRATED CIRCUIT (IC) DEVICE WITH METAL LAYER INCLUDING STAGGERED...

INTEGRATED CIRCUIT STRUCTURES WITH GATE VOLUME REDUCTION

INTEGRATED CIRCUIT STRUCTURES HAVING UNIFORM GRID METAL GATE AND TR...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY FOR MULTI...

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER STAPLE

INTEGRATED CIRCUIT STRUCTURE WITH RECESSED SELF-ALIGNED DEEP BOUNDA...

METAL ROUTING THAT OVERLAPS NMOS AND PMOS REGIONS OF A TRANSISTOR

INTEGRATED CIRCUIT STRUCTURES HAVING CONDUCTIVE STRUCTURES IN FIN I...

INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIATED CHANNEL SIZING

INTEGRATED CIRCUIT STRUCTURES WITH PRE-EPITAXIAL DEEP VIA STRUCTURE

INTEGRATED CIRCUIT STRUCTURES HAVING BACKSIDE GATE TIE-DOWN