Suku Kim

Person

South Jordan, UT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods and designs for localized wafer thinning
- Patent number 8,624,393
- Issue date Jan 7, 2014
- Fairchild Semiconductor Corporation
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice with backside trenches filled with elastic mater...
- Patent number 8,598,035
- Issue date Dec 3, 2013
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for dividing a substrate into individual devices
- Patent number 8,343,852
- Issue date Jan 1, 2013
- Fairchild Semiconductor Corporation
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and designs for localized wafer thinning
- Patent number 8,158,506
- Issue date Apr 17, 2012
- Fairchild Semiconductor Corporation
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for making the same
- Patent number 8,129,778
- Issue date Mar 6, 2012
- Fairchild Semiconductor Corporation
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die structures for wafer-level chipscale packaging of...
- Patent number 8,058,732
- Issue date Nov 15, 2011
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor dice with backside trenches filled with elastic mater...
- Patent number 7,960,800
- Issue date Jun 14, 2011
- Fairchild Semiconductor Corporation
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for dividing a substrate into individual devices
- Patent number 7,951,688
- Issue date May 31, 2011
- Fairchild Semiconductor Corporation
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS RELATED TO TERMINATION REGIONS OF A SEMICONDU...
- Publication number 20140264569
- Publication date Sep 18, 2014
- Fairchild Semiconductor Corporation
- Joseph A. YEDINAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH SUPERJUNCTION MOSFET WITH THIN EPI PROCESS
- Publication number 20140103428
- Publication date Apr 17, 2014
- Fairchild Semiconductor Corporation
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE TERMINATION STRUCTURE FOR POWER SEMICONDUCTOR DEVICES
- Publication number 20130087852
- Publication date Apr 11, 2013
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF SUPERJUNCTION MOSFET AND DIODE
- Publication number 20120306009
- Publication date Dec 6, 2012
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and Designs for Localized Wafer Thinning
- Publication number 20120168947
- Publication date Jul 5, 2012
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Trench Superjunction MOSFET with Thin EPI Process
- Publication number 20120018800
- Publication date Jan 26, 2012
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DICE WITH BACKSIDE TRENCHES FILLED WITH ELASTIC MATER...
- Publication number 20110230046
- Publication date Sep 22, 2011
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES CONTAINING TRENCH MOSFETS WITH SUPERJUNCTIONS
- Publication number 20110198689
- Publication date Aug 18, 2011
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR DIVIDING A SUBSTRATE INTO INDIVIDUAL DEVICES
- Publication number 20110201179
- Publication date Aug 18, 2011
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Devices and Methods for Making the Same
- Publication number 20110127601
- Publication date Jun 2, 2011
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NICKEL-TITANUM CONTACT LAYERS IN SEMICONDUCTOR DEVICES
- Publication number 20110006409
- Publication date Jan 13, 2011
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D CHANNEL ARCHITECTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20100308402
- Publication date Dec 9, 2010
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Dice with Backside Trenches Filled With Elastic Mater...
- Publication number 20100148325
- Publication date Jun 17, 2010
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Structures for Wafer-Level Chipscale Packaging of...
- Publication number 20100123225
- Publication date May 20, 2010
- Michael D. Gruenhagen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DESIGNS FOR LOCALIZED WAFER THINNING
- Publication number 20090273082
- Publication date Nov 5, 2009
- Suku Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Structure for Dividing a Substrate into Individual Devices
- Publication number 20090181520
- Publication date Jul 16, 2009
- Minhua Li
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Methods and designs for localized wafer thinning

Semiconductor dice with backside trenches filled with elastic mater...

Method and structure for dividing a substrate into individual devices

Methods and designs for localized wafer thinning

Semiconductor devices and methods for making the same

Semiconductor die structures for wafer-level chipscale packaging of...

Semiconductor dice with backside trenches filled with elastic mater...

Method and structure for dividing a substrate into individual devices

Patents Applicationslast 30 patents

METHODS AND APPARATUS RELATED TO TERMINATION REGIONS OF A SEMICONDU...

TRENCH SUPERJUNCTION MOSFET WITH THIN EPI PROCESS

EDGE TERMINATION STRUCTURE FOR POWER SEMICONDUCTOR DEVICES

INTEGRATION OF SUPERJUNCTION MOSFET AND DIODE

Methods and Designs for Localized Wafer Thinning

Trench Superjunction MOSFET with Thin EPI Process

SEMICONDUCTOR DICE WITH BACKSIDE TRENCHES FILLED WITH ELASTIC MATER...

SEMICONDUCTOR DEVICES CONTAINING TRENCH MOSFETS WITH SUPERJUNCTIONS

METHOD AND STRUCTURE FOR DIVIDING A SUBSTRATE INTO INDIVIDUAL DEVICES

Semiconductor Devices and Methods for Making the Same

NICKEL-TITANUM CONTACT LAYERS IN SEMICONDUCTOR DEVICES

3D CHANNEL ARCHITECTURE FOR SEMICONDUCTOR DEVICES

Semiconductor Dice with Backside Trenches Filled With Elastic Mater...

Semiconductor Die Structures for Wafer-Level Chipscale Packaging of...

METHODS AND DESIGNS FOR LOCALIZED WAFER THINNING

Method and Structure for Dividing a Substrate into Individual Devices