Sukwon Hong

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods, apparatus and system for local isolation formation for fin...
- Patent number 10,014,209
- Issue date Jul 3, 2018
- GLOBALFOUNDRIES Inc.
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating integrated circuits using flowable chemical...
- Patent number 9,831,098
- Issue date Nov 28, 2017
- GLOBALFOUNDRIES, INC.
- Xinyuan Dou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure including middle of line (MOL) metal layer l...
- Patent number 9,786,607
- Issue date Oct 10, 2017
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure including middle of line (MOL) metal layer l...
- Patent number 9,728,456
- Issue date Aug 8, 2017
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods, apparatus and system for local isolation formation for fin...
- Patent number 9,722,053
- Issue date Aug 1, 2017
- GLOBALFOUNDRIES Inc.
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Block level patterning process
- Patent number 9,646,884
- Issue date May 9, 2017
- GLOBALFOUNDRIES Inc.
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure including middle of line (MOL) metal layer l...
- Patent number 9,583,442
- Issue date Feb 28, 2017
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET structures having uniform channel size and methods of fabric...
- Patent number 9,324,799
- Issue date Apr 26, 2016
- GLOBALFOUNDRIES Inc.
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating fin structures of uniform height
- Patent number 9,236,308
- Issue date Jan 12, 2016
- GlobalFoundries Inc.
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low shrinkage dielectric films
- Patent number 9,018,108
- Issue date Apr 28, 2015
- Applied Materials, Inc.
- Sukwon Hong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods of reducing substrate dislocation during gapfill processing
- Patent number 8,975,152
- Issue date Mar 10, 2015
- Applied Materials, Inc.
- Sukwon Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of curing non-carbon flowable CVD films
- Patent number 8,449,942
- Issue date May 28, 2013
- Applied Materials, Inc.
- Jingmei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Low temperature silicon oxide conversion
- Patent number 8,445,078
- Issue date May 21, 2013
- Applied Materials, Inc.
- Jingmei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHODS, APPARATUS AND SYSTEM FOR LOCAL ISOLATION FORMATION FOR FIN...
- Publication number 20170294338
- Publication date Oct 12, 2017
- GLOBALFOUNDRIES INC.
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING MIDDLE OF LINE (MOL) METAL LAYER L...
- Publication number 20170140984
- Publication date May 18, 2017
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING MIDDLE OF LINE (MOL) METAL LAYER L...
- Publication number 20170018459
- Publication date Jan 19, 2017
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS USING FLOWABLE CHEMICAL...
- Publication number 20170018452
- Publication date Jan 19, 2017
- GLOBALFOUNDRIES, Inc.
- Xinyuan Dou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE INCLUDING MIDDLE OF LINE (MOL) METAL LAYER L...
- Publication number 20160379932
- Publication date Dec 29, 2016
- International Business Machines Corporation
- Su Chen Fan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BLOCK LEVEL PATTERNING PROCESS
- Publication number 20160322260
- Publication date Nov 3, 2016
- GLOBALFOUNDRIES INC.
- Chanro PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET STRUCTURES HAVING UNIFORM CHANNEL SIZE AND METHODS OF FABRIC...
- Publication number 20160204265
- Publication date Jul 14, 2016
- GLOBALFOUNDRIES INC.
- Min Gyu SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINFET STRUCTURES HAVING UNIFORM CHANNEL SIZE AND METHODS OF FABRIC...
- Publication number 20160071932
- Publication date Mar 10, 2016
- GLOBALFOUNDRIES INC.
- Min Gyu SUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING INTEGRATED CIRCUITS WITH AN INSULTATING LAYER
- Publication number 20150340274
- Publication date Nov 26, 2015
- GLOBALFOUNDRIES, Inc.
- Errol Todd Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW TEMPERATURE FLOWABLE CURING FOR STRESS ACCOMMODATION
- Publication number 20140329027
- Publication date Nov 6, 2014
- Applied Materials, Inc.
- Jingmei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW SHRINKAGE DIELECTRIC FILMS
- Publication number 20140213070
- Publication date Jul 31, 2014
- Applied Materials, Inc.
- Sukwon Hong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF REDUCING SUBSTRATE DISLOCATION DURING GAPFILL PROCESSING
- Publication number 20130309870
- Publication date Nov 21, 2013
- Applied Materials, Inc.
- Sukwon Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSIFICATION FOR FLOWABLE FILMS
- Publication number 20130288485
- Publication date Oct 31, 2013
- Applied Materials, Inc.
- Jingmei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW TEMPERATURE SILICON OXIDE CONVERSION
- Publication number 20120269989
- Publication date Oct 25, 2012
- Applied Materials, Inc.
- Jingmei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CURING NON-CARBON FLOWABLE CVD FILMS
- Publication number 20110111137
- Publication date May 12, 2011
- Applied Materials, Inc.
- Jingmei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Sukwon Hong

Person

Patents Grantslast 30 patents

Methods, apparatus and system for local isolation formation for fin...

Methods for fabricating integrated circuits using flowable chemical...

Interconnect structure including middle of line (MOL) metal layer l...

Interconnect structure including middle of line (MOL) metal layer l...

Methods, apparatus and system for local isolation formation for fin...

Block level patterning process

Interconnect structure including middle of line (MOL) metal layer l...

FinFET structures having uniform channel size and methods of fabric...

Methods of fabricating fin structures of uniform height

Low shrinkage dielectric films

Methods of reducing substrate dislocation during gapfill processing

Methods of curing non-carbon flowable CVD films

Low temperature silicon oxide conversion

Patents Applicationslast 30 patents

METHODS, APPARATUS AND SYSTEM FOR LOCAL ISOLATION FORMATION FOR FIN...

INTERCONNECT STRUCTURE INCLUDING MIDDLE OF LINE (MOL) METAL LAYER L...

INTERCONNECT STRUCTURE INCLUDING MIDDLE OF LINE (MOL) METAL LAYER L...

METHODS FOR FABRICATING INTEGRATED CIRCUITS USING FLOWABLE CHEMICAL...

INTERCONNECT STRUCTURE INCLUDING MIDDLE OF LINE (MOL) METAL LAYER L...

BLOCK LEVEL PATTERNING PROCESS

FINFET STRUCTURES HAVING UNIFORM CHANNEL SIZE AND METHODS OF FABRIC...

FINFET STRUCTURES HAVING UNIFORM CHANNEL SIZE AND METHODS OF FABRIC...

METHODS FOR PRODUCING INTEGRATED CIRCUITS WITH AN INSULTATING LAYER

LOW TEMPERATURE FLOWABLE CURING FOR STRESS ACCOMMODATION

LOW SHRINKAGE DIELECTRIC FILMS

METHODS OF REDUCING SUBSTRATE DISLOCATION DURING GAPFILL PROCESSING

DENSIFICATION FOR FLOWABLE FILMS

LOW TEMPERATURE SILICON OXIDE CONVERSION

CURING NON-CARBON FLOWABLE CVD FILMS