Sundar M. Kamath

Person

Hyde Park, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,964,885
- Issue date Nov 15, 2005
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress resistant land grid array (LGA) module and method of forming...
- Patent number 6,703,560
- Issue date Mar 9, 2004
- International Business Machines Corporation
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Isolated flip chip of BGA to minimize interconnect stress due to th...
- Patent number 6,509,529
- Issue date Jan 21, 2003
- Kulicke & Soffa Holdings, Inc.
- Sundar Kamath
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate with thermal insert
- Patent number 6,317,331
- Issue date Nov 13, 2001
- Kulicke & Soffa Holdings, Inc.
- Sundar Kamath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic substrate with anchored pad
- Patent number 6,312,791
- Issue date Nov 6, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Isolated flip chip or BGA to minimize interconnect stress due to th...
- Patent number 6,299,053
- Issue date Oct 9, 2001
- Kulicke & Soffa Holdings, Inc.
- Sundar Kamath
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct deposit thin film single/multi chip module
- Patent number 6,261,467
- Issue date Jul 17, 2001
- International Business Machines Corporation
- Ajay P. Giri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and materials for increasing the strength of crystalline cer...
- Patent number 6,258,191
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic substrate with anchored pad
- Patent number 6,187,418
- Issue date Feb 13, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing ceramic surfaces with easily removable contact...
- Patent number 6,139,666
- Issue date Oct 31, 2000
- International Business Machines Corporation
- Benjamin V. Fasano
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic substrate having a sealed layer
- Patent number 6,136,419
- Issue date Oct 24, 2000
- International Business Machines Corporation
- Benjamin V. Fasano
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Direct deposit thin film single/multi chip module
- Patent number 6,037,044
- Issue date Mar 14, 2000
- International Business Machines Corporation
- Ajay P. Giri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low TCE polyimides as improved insulator in multilayer interconnect...
- Patent number 5,976,710
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Krishna Gandhi Sachdev
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20040141296
- Publication date Jul 22, 2004
- Patrick Anthony Coico
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stress resistant land grid array (LGA) module and method of forming...
- Publication number 20020050398
- Publication date May 2, 2002
- Patrick Anthony Coico
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolated flip chip or BGA to minimize interconnect stress due to th...
- Publication number 20020011353
- Publication date Jan 31, 2002
- Sundar Kamath
- H01 - BASIC ELECTRIC ELEMENTS

Sundar M. Kamath

Person

Patents Grantslast 30 patents

Stress resistant land grid array (LGA) module and method of forming...

Stress resistant land grid array (LGA) module and method of forming...

Isolated flip chip of BGA to minimize interconnect stress due to th...

Wiring substrate with thermal insert

Multilayer ceramic substrate with anchored pad

Isolated flip chip or BGA to minimize interconnect stress due to th...

Direct deposit thin film single/multi chip module

Method and materials for increasing the strength of crystalline cer...

Multilayer ceramic substrate with anchored pad

Method for producing ceramic surfaces with easily removable contact...

Ceramic substrate having a sealed layer

Direct deposit thin film single/multi chip module

Low TCE polyimides as improved insulator in multilayer interconnect...

Patents Applicationslast 30 patents

Stress resistant land grid array (LGA) module and method of forming...

Stress resistant land grid array (LGA) module and method of forming...

Isolated flip chip or BGA to minimize interconnect stress due to th...