Sung-won Moon

Person

Phoenix, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Controlling thermal interface material bleed out
- Patent number 8,951,846
- Issue date Feb 10, 2015
- Intel Corporation
- Gopi Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill material dispenser
- Patent number 8,534,574
- Issue date Sep 17, 2013
- Intel Corporation
- Bogdan M Simion
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Passive thermal solution for hand-held devices
- Patent number 7,595,468
- Issue date Sep 29, 2009
- Intel Corporation
- Sung-won Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multiple-dice packages using elements between dice to control appli...
- Patent number 7,589,395
- Issue date Sep 15, 2009
- Intel Corporation
- Ajit V. Sathe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL...
- Publication number 20150060527
- Publication date Mar 5, 2015
- Weihua Tang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTROLLING THERMAL INTERFACE MATERIAL BLEED OUT
- Publication number 20140027899
- Publication date Jan 30, 2014
- Gopi Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL MATERIAL DISPENSER
- Publication number 20110248046
- Publication date Oct 13, 2011
- Bogdan M. Simion
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive thermal solution for hand-held devices
- Publication number 20100008047
- Publication date Jan 14, 2010
- Sung-won Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTIPLE-DICE PACKAGES WITH CONTROLLED UNDERFILL AND METHODS OF MAN...
- Publication number 20080001310
- Publication date Jan 3, 2008
- Ajit V. Sathe
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Passive thermal solution for hand-held devices
- Publication number 20070103849
- Publication date May 10, 2007
- Sung-won Moon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked die package with thermally conductive block embedded in sub...
- Publication number 20070090517
- Publication date Apr 26, 2007
- Sung-won Moon
- H01 - BASIC ELECTRIC ELEMENTS

Sung-won Moon

Person

Patents Grantslast 30 patents

Controlling thermal interface material bleed out

Underfill material dispenser

Passive thermal solution for hand-held devices

Multiple-dice packages using elements between dice to control appli...

Patents Applicationslast 30 patents

NON-UNIFORM HEATER FOR REDUCED TEMPERATURE GRADIENT DURING THERMAL...

CONTROLLING THERMAL INTERFACE MATERIAL BLEED OUT

UNDERFILL MATERIAL DISPENSER

Passive thermal solution for hand-held devices

MULTIPLE-DICE PACKAGES WITH CONTROLLED UNDERFILL AND METHODS OF MAN...

Passive thermal solution for hand-held devices

Stacked die package with thermally conductive block embedded in sub...