Sung Yi

Person

Gyunggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a capacitor-embedded printed circuit board
- Patent number 8,943,685
- Issue date Feb 3, 2015
- Samsung Electro-Mechanics Co., Ltd.
- Young Do Kweon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a chip embedded printed circuit board
- Patent number 8,893,380
- Issue date Nov 25, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Hong Won Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component package and manufacturing method thereof
- Patent number 8,779,580
- Issue date Jul 15, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Seok Kang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical disc drive having a tray for loading a disc using supportin...
- Patent number 8,713,587
- Issue date Apr 29, 2014
- Toshiba Samsung Storage Technology Korea Corporation
- Young-sun Jung
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic component-embedded printed circuit board
- Patent number 8,552,305
- Issue date Oct 8, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Jin Seon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a chip embedded printed circuit board
- Patent number 8,351,215
- Issue date Jan 8, 2013
- Samsung Electro-Mechanics Co., Ltd.
- Hong Won Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing capacitor-embedded PCB
- Patent number 8,302,270
- Issue date Nov 6, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer Level package for heat dissipation and method of manufacturin...
- Patent number 8,283,768
- Issue date Oct 9, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Joon Seok Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level package
- Patent number 8,283,251
- Issue date Oct 9, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Seung Seoup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package with removable chip protecting layer
- Patent number 8,110,914
- Issue date Feb 7, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Joon Seok Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and printed circuit board
- Patent number 8,064,215
- Issue date Nov 22, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Yul-Kyo Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die package and method of manufacturing the same
- Patent number 8,026,590
- Issue date Sep 27, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Joon Seok Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB and manufacturing method thereof
- Patent number 7,992,296
- Issue date Aug 9, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level packaging image sensor module having lens actuator and...
- Patent number 7,982,982
- Issue date Jul 19, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Seung Seoup Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of manufacturing capacitor-embedded PCB
- Patent number 7,886,414
- Issue date Feb 15, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing component-embedded printed circuit board
- Patent number 7,730,612
- Issue date Jun 8, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Hwa-Sun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a wafer level package that uses the same se...
- Patent number 7,727,877
- Issue date Jun 1, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Seok Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package and manufacturing method thereof
- Patent number 7,663,250
- Issue date Feb 16, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Hyung Jin Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wafer level package
- Patent number 7,632,709
- Issue date Dec 15, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Hyung-Jin Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT PACKAGE
- Publication number 20140313676
- Publication date Oct 23, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Package For Heat Dissipation And Method Of Manufacturin...
- Publication number 20130005089
- Publication date Jan 3, 2013
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Joon Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE FOR CAPACITOR-EMBEDDED PRINTED CI...
- Publication number 20120152886
- Publication date Jun 21, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING WAFER LEVEL PACKAGE
- Publication number 20120129297
- Publication date May 24, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Joon Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing wafer level package
- Publication number 20120015500
- Publication date Jan 19, 2012
- Samsung Electro-Mechanics Co., Ltd.
- Seung Seoup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing capacitor-embedded PCB
- Publication number 20110099779
- Publication date May 5, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110042799
- Publication date Feb 24, 2011
- Joon Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a capacitor-embedded printed circuit board
- Publication number 20110035938
- Publication date Feb 17, 2011
- Samsung Electro-Mechanics Co., Ltd.
- Young Do Kweon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LASER PROCESSING DEVICE
- Publication number 20100288739
- Publication date Nov 18, 2010
- Samsung Electro-Mechanics CO., LTD.
- Jae-Kwang Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component-Embedded Printed Circuit Board
- Publication number 20100236821
- Publication date Sep 23, 2010
- Jin Seon Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20100214719
- Publication date Aug 26, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE FOR HEAT DISSIPATION AND METHOD OF MANUFACTURIN...
- Publication number 20100193932
- Publication date Aug 5, 2010
- Joon Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITOR
- Publication number 20100142116
- Publication date Jun 10, 2010
- Samsung Electro-Mechanics CO., LTD.
- Woon-Chun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip embedded printed circuit board and manufacturing method thereof
- Publication number 20100142170
- Publication date Jun 10, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Hong Won Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wafer level package and method of manufacturing the same and method...
- Publication number 20100133680
- Publication date Jun 3, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Joon Seok KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip embedded printed circuit board and manufacturing method thereof
- Publication number 20100134991
- Publication date Jun 3, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Hong Won Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL DISC DRIVE HAVING TRAY FOR LOADING DISC
- Publication number 20100125860
- Publication date May 20, 2010
- Young-sun Jung
- G11 - INFORMATION STORAGE
Information Patent Application
Wafer level packaging image sensor module having lens actuator and...
- Publication number 20100084726
- Publication date Apr 8, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seung Seoup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level package and method of manufacturing the same
- Publication number 20100052164
- Publication date Mar 4, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Seung Seoup Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20090309216
- Publication date Dec 17, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Hyung Jin Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer level package and method of manufacturing the same
- Publication number 20090308640
- Publication date Dec 17, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Won Kyu Jeung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit board comprising semiconductor chip and method of m...
- Publication number 20090302468
- Publication date Dec 10, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Jong Hwan Baek
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Fuel cell and method for manufacturing the same
- Publication number 20090305105
- Publication date Dec 10, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Won-Kyu Jeung
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Substrate for capacitor-embedded printed circuit board, capacitor-e...
- Publication number 20090244864
- Publication date Oct 1, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PCB AND MANUFACTURING METHOD THEREOF
- Publication number 20090178840
- Publication date Jul 16, 2009
- SAMSUNG ELECTRO-MECHANICS CO.,LTD.
- Woon-Chun Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of manufacturing a wafer level package
- Publication number 20090124075
- Publication date May 14, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Joon-Seok Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing wafer level package
- Publication number 20090087951
- Publication date Apr 2, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Hyung-Jin Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package and printed circuit board
- Publication number 20090073667
- Publication date Mar 19, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Yul-Kyo Chung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Image sensor package
- Publication number 20090072335
- Publication date Mar 19, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Yul-Kyo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing component-embedded printed circuit board
- Publication number 20090049686
- Publication date Feb 26, 2009
- Samsung Electro-Mechanics Co., Ltd.
- Hwa-Sun Park
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Method of manufacturing a capacitor-embedded printed circuit board

Method of manufacturing a chip embedded printed circuit board

Electronic component package and manufacturing method thereof

Optical disc drive having a tray for loading a disc using supportin...

Electronic component-embedded printed circuit board

Method of manufacturing a chip embedded printed circuit board

Method of manufacturing capacitor-embedded PCB

Wafer Level package for heat dissipation and method of manufacturin...

Method of manufacturing wafer level package

Wafer level package with removable chip protecting layer

Semiconductor chip package and printed circuit board

Die package and method of manufacturing the same

PCB and manufacturing method thereof

Wafer level packaging image sensor module having lens actuator and...

Method of manufacturing capacitor-embedded PCB

Method of manufacturing component-embedded printed circuit board

Method of manufacturing a wafer level package that uses the same se...

Wafer level package and manufacturing method thereof

Method of manufacturing wafer level package

Patents Applicationslast 30 patents

ELECTRONIC COMPONENT PACKAGE

Wafer Level Package For Heat Dissipation And Method Of Manufacturin...

METHOD OF MANUFACTURING SUBSTRATE FOR CAPACITOR-EMBEDDED PRINTED CI...

METHOD OF MANUFACTURING WAFER LEVEL PACKAGE

Method of manufacturing wafer level package

Method of manufacturing capacitor-embedded PCB

DIE PACKAGE AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing a capacitor-embedded printed circuit board

LASER PROCESSING DEVICE

Electronic Component-Embedded Printed Circuit Board

CAPACITOR AND METHOD OF MANUFACTURING THE SAME

WAFER LEVEL PACKAGE FOR HEAT DISSIPATION AND METHOD OF MANUFACTURIN...

CAPACITOR

Chip embedded printed circuit board and manufacturing method thereof

Wafer level package and method of manufacturing the same and method...

Chip embedded printed circuit board and manufacturing method thereof

OPTICAL DISC DRIVE HAVING TRAY FOR LOADING DISC

Wafer level packaging image sensor module having lens actuator and...

Wafer level package and method of manufacturing the same

WAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF

Wafer level package and method of manufacturing the same

Printed circuit board comprising semiconductor chip and method of m...

Fuel cell and method for manufacturing the same

Substrate for capacitor-embedded printed circuit board, capacitor-e...

PCB AND MANUFACTURING METHOD THEREOF

Method of manufacturing a wafer level package

Method of manufacturing wafer level package

Semiconductor chip package and printed circuit board

Image sensor package

Method of manufacturing component-embedded printed circuit board