Sungdong CHO

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Device including first structure having peripheral circuit and seco...
- Patent number 11,990,450
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Eunji Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including wiring contact plugs
- Patent number 11,901,297
- Issue date Feb 13, 2024
- Samsung Electronics Co., Ltd.
- Yonghyeok Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including buried dielectric pattern at edge regi...
- Patent number 11,848,285
- Issue date Dec 19, 2023
- Samsung Electronics Co., Ltd.
- Kwangwuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via structures with undercut portion...
- Patent number 11,798,866
- Issue date Oct 24, 2023
- Samsung Electronics Co, Ltd.
- Eunji Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,791,242
- Issue date Oct 17, 2023
- Samsung Electronics Co., Ltd.
- Kwangwuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through via electrode and device isolation structure including oxid...
- Patent number 11,735,498
- Issue date Aug 22, 2023
- Samsung Electronics Co., Ltd.
- Kwangwuk Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,705,379
- Issue date Jul 18, 2023
- Samsung Electronics Co., Ltd.
- Chanho Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory device including wiring contact plugs
- Patent number 11,569,171
- Issue date Jan 31, 2023
- Samsung Electronics Co., Ltd.
- Yonghyeok Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including via structure with head and body por...
- Patent number 11,380,606
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Eunji Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICE INCLUDING FIRST STRUCTURE HAVING PERIPHERAL CIRCUIT AND SECO...
- Publication number 20240282753
- Publication date Aug 22, 2024
- Samsung Electronics Co., Ltd.
- Eunji KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240215229
- Publication date Jun 27, 2024
- Samsung Electronics Co., Ltd.
- MINSUNG KANG
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE INCLUDING WIRING CONTACT PLUGS
- Publication number 20230238331
- Publication date Jul 27, 2023
- Samsung Electronics Co., Ltd.
- Yonghyeok SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACT...
- Publication number 20230178434
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Minyoung KWON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE INCLUDING WIRING CONTACT PLUGS
- Publication number 20230170303
- Publication date Jun 1, 2023
- Samsung Electronics Co., Ltd.
- Yonghyeok SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING BURIED DIELECTRIC PATTERN AT EDGE REGI...
- Publication number 20230044131
- Publication date Feb 9, 2023
- Samsung Electronics Co., Ltd.
- Kwangwuk PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20230019790
- Publication date Jan 19, 2023
- Samsung Electronics Co., Ltd.
- Minsung KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230005853
- Publication date Jan 5, 2023
- Samsung Electronics Co., Ltd.
- Kunsang PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20220336327
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- EUNJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES
- Publication number 20220336365
- Publication date Oct 20, 2022
- Samsung Electronics Co., Ltd.
- Dayoung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP STRUCTURE
- Publication number 20220285208
- Publication date Sep 8, 2022
- Samsung Electronics Co., Ltd.
- Sangjun PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE INCLUDING WIRING CONTACT PLUGS
- Publication number 20220139836
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Yonghyeok SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220139806
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Kwangwuk PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20220020667
- Publication date Jan 20, 2022
- Samsung Electronics Co., Ltd.
- Kwangwuk PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE INCLUDING FIRST STRUCTURE HAVING PERIPHERAL CIRCUIT AND SECO...
- Publication number 20210407968
- Publication date Dec 30, 2021
- Samsung Electronics Co., Ltd.
- Eunji KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20210305114
- Publication date Sep 30, 2021
- Samsung Electronics Co., Ltd.
- CHANHO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20210020545
- Publication date Jan 21, 2021
- Samsung Electronics Co., Ltd.
- EUNJI KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIPS WITH THROUGH-SILICON VIAS, AND SEMICONDUCTOR PA...
- Publication number 20150145124
- Publication date May 28, 2015
- Samsung Electronics Co., Ltd.
- SinWoo KANG
- H01 - BASIC ELECTRIC ELEMENTS

Sungdong CHO

Person

Patents Grantslast 30 patents

Device including first structure having peripheral circuit and seco...

Semiconductor memory device including wiring contact plugs

Semiconductor chip including buried dielectric pattern at edge regi...

Semiconductor device including via structures with undercut portion...

Semiconductor device

Through via electrode and device isolation structure including oxid...

Semiconductor packages

Semiconductor memory device including wiring contact plugs

Semiconductor device including via structure with head and body por...

Patents Applicationslast 30 patents

DEVICE INCLUDING FIRST STRUCTURE HAVING PERIPHERAL CIRCUIT AND SECO...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR MEMORY DEVICE INCLUDING WIRING CONTACT PLUGS

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACT...

SEMICONDUCTOR MEMORY DEVICE INCLUDING WIRING CONTACT PLUGS

SEMICONDUCTOR CHIP INCLUDING BURIED DIELECTRIC PATTERN AT EDGE REGI...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICES

SEMICONDUCTOR CHIP STRUCTURE

SEMICONDUCTOR MEMORY DEVICE INCLUDING WIRING CONTACT PLUGS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

DEVICE INCLUDING FIRST STRUCTURE HAVING PERIPHERAL CIRCUIT AND SECO...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR CHIPS WITH THROUGH-SILICON VIAS, AND SEMICONDUCTOR PA...