This application is based on and claims priority under 35 U.S.C. § 119 to Korean Patent Application No. 10-2021-0175208, filed on Dec. 8, 2021, in the Korean Intellectual Property Office, the disclosure of which is incorporated by reference herein in its entirety.
The inventive concepts relate to semiconductor devices, semiconductor packages, and/or methods of manufacturing the semiconductor device, and more particularly, to semiconductor devices which quickly process data and have low power consumption, semiconductor packages, and/or a methods of manufacturing the semiconductor device.
As 3-dimensional (3D) packages where a plurality of semiconductor chips are stacked in one semiconductor package are actively developed, through-silicon-via (TSV) technology where an electrical connection is vertically formed via a substrate or a die is being very significantly recognized. In order to enhance the performance of 3D packages, a data speed and power consumption have to be improved.
The inventive concepts provide semiconductor devices which quickly process data and have low power consumption.
The inventive concepts provide semiconductor packages which quickly process data and have low power consumption.
According to an aspect of the inventive concepts, a semiconductor device includes a semiconductor substrate, an interlayer insulation layer on the semiconductor substrate, a first via structure passing through the semiconductor substrate and the interlayer insulation layer, the first via structure having a first diameter, and a second via structure passing through the semiconductor substrate and the interlayer insulation layer, the second via structure having a second diameter, is the second diameter being greater than the first diameter, at a same vertical level. A sidewall of the first via structure includes at least one undercut region horizontally protruding toward a center of the first via structure, and an outer sidewall of the second via structure is in contact with either the semiconductor substrate or the interlayer insulation layer an area above the undercut region.
According to another aspect of the inventive concepts, a semiconductor device includes a semiconductor substrate, an interlayer insulation layer on the semiconductor substrate, a signal via structure passing through the semiconductor substrate and the interlayer insulation layer, and a power via structure passing through the semiconductor substrate and the interlayer insulation layer. A sidewall of the signal via structure includes at least one undercut region horizontally protruding toward a horizontal center of the signal via structure, a height of the signal via structure is same as a height of the power via structure, the signal via structure has a first diameter and the power via structure has a second diameter, the second diameter being greater than the first diameter at a same vertical level, and an outer sidewall of the power via structure is in contact with the semiconductor substrate or the interlayer insulation layer at an area above the undercut region.
According to another aspect of the inventive concepts, a semiconductor package includes a first semiconductor device including a cell region and a peripheral region and a second semiconductor device stacked on the first semiconductor device and electrically connected to the first semiconductor device. The first semiconductor device includes a semiconductor substrate and an interlayer insulation layer on the semiconductor substrate, the first semiconductor device further includes a first via structure and a second via structure disposed in the peripheral region, the first via structure passing through the semiconductor substrate and the interlayer insulation layer and having a first diameter in the peripheral region, and the second via structure passing through the semiconductor substrate and the interlayer insulation layer and having a second diameter which is greater than the first diameter, a sidewall of the first via structure includes at least one undercut region horizontally protruding toward a center of the first via structure, and a height of the first via structure is same as a height of the second via structure, and an outer sidewall of the second via structure is in contact with either the semiconductor substrate or the interlayer insulation layer at an area above the undercut region.
According to another aspect of the inventive concepts, a method of manufacturing a semiconductor device includes forming an interlayer insulation layer on a semiconductor substrate, forming a mask material layer on the interlayer insulation layer, removing a portion of the mask material layer on an upper surface of the mask material layer at each of a first position for forming a first via structure having a first diameter and a second position for forming a second via structure having a second diameter, removing both the interlayer insulation layer and a portion of the semiconductor substrate at the first position to form a first preliminary recess, removing at least a portion of the interlayer insulation layer at the second position to form a second preliminary recess, simultaneously etching portions of the semiconductor substrate at positions of the first and second preliminary recesses to form a first via hole and a second via hole, forming the first via structure and the second via structure in the first via hole and the second via hole, respectively, and forming external connection terminals electrically connected to the first via structure and the second via structure, wherein a depth of the first preliminary recess is greater than a depth of the second preliminary recess, a diameter of the first preliminary recess is smaller than a diameter of the second preliminary recess, and the removing the portion of the mask material layer at the second position includes performing exposure on the mask material layer by using a reticle including a scattering bar, the scattering bar being disposed on the upper surface of the mask material layer at the second position.
Some example embodiments of the inventive concepts will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which:
Hereinafter, some example embodiments will be described in detail with reference to the accompanying drawings. Like reference numerals refer to like elements, and their repeated descriptions are omitted.
While the term “same,” “equal” or “identical” is used in description of example embodiments, it should be understood that some imprecisions may exist. Thus, when one element is referred to as being the same as another element, it should be understood that an element or a value is the same as another element within a desired manufacturing or operational tolerance range (e.g., ±10%).
When the terms “about” or “substantially” are used in this specification in connection with a numerical value, it is intended that the associated numerical value includes a manufacturing or operational tolerance (e.g., ±10%) around the stated numerical value. Moreover, when the words “about” and “substantially” are used in connection with geometric shapes, it is intended that precision of the geometric shape is not required but that latitude for the shape is within the scope of the disclosure. Further, regardless of whether numerical values or shapes are modified as “about” or “substantially,” it will be understood that these values and shapes should be construed as including a manufacturing or operational tolerance (e.g., ±10%) around the stated numerical values or shapes.
Referring to
The TSV region 20 may be disposed at an approximate center portion of the memory semiconductor chip 12. A plurality of TSV structures 30 may be arranged in the TSV region 20. The number and shape of TSV structures 30 illustrated in
The I/O buffer included in the memory semiconductor chip 12 may receive a signal from the outside through the TSV structure 30, or may transmit a signal to the outside through the TSV structure 30.
The TSV region 20 may include a plurality of first to fourth TSV unit regions 22, 24, 26, and 28. The plurality of first to fourth TSV unit regions 22, 24, 26, and 28 may include a first TSV unit region 22, a second TSV unit region 24, a third TSV unit region 26, and a fourth TSV unit region 28. In
Referring to
The second via structure 120 may have a relatively lower resistance because of having a relatively larger diameter and may be a power transfer path for more efficiently supplying power. The first via structure 110 may have a relatively lower capacitance because of having a relatively smaller diameter and may be a signal transfer path for providing a high data transfer speed.
In some example embodiments, a plurality of first via structures 110 each corresponding to a signal transfer path may be arranged in a lattice form, and a plurality of second via structures 120 each corresponding to a power transfer path may be arranged in a 1-shaped form (e.g., a line form). However, the inventive concepts are not limited to such arrangement.
Referring to
The semiconductor substrate 101 may include a semiconductor such as silicon (Si) or germanium (Ge) or a compound semiconductor such as silicon carbide (SiC), gallium arsenide (GaAs), indium arsenide (InAs), or indium phosphide (InP). In at least one example embodiment, the semiconductor substrate 101 may have a silicon on insulator (SOI) structure. For example, the semiconductor substrate 101 may include a buried oxide (BOX) layer. In some example embodiments, the semiconductor substrate 101 may include a conductive region (e.g., an impurity-doped well) or an impurity-doped structure. Also, the semiconductor substrate 101 may include various isolation layers (not shown) such as a shallow trench isolation (STI) structure.
The interlayer insulation layer 134 may be configured as a single material layer, or may be configured as a multi material layer where two or more material layers are stacked. In some example embodiments, the interlayer insulation layer 134 may include a tetraethylorthosilicate (TEOS) film, a high density plasma (HDP) film, a boro-phospho-silicate glass (BPSG) film, a flowable chemical vapor deposition (FCVD) oxide film, or an ultra low K (ULK) film having an ultra low dielectric constant K of about 2.2 to about 2.4. The ULK film may include may include, for example, a SiOC layer or a SiCOH layer. In some example embodiments, the interlayer insulation layer 134 may include a layer including silicon nitride (SiN) or silicon oxynitride (SiON).
Various kinds of a plurality of semiconductor devices 132 may be provided in the interlayer insulation layer 134 and the semiconductor substrate 101. The semiconductor device 132 may include microelectronic devices, and for example, may a metal-oxide-semiconductor field effect transistor (MOSFET) image sensor, system large scale integration (LSI), or a complementary metal oxide semiconductor (CMOS) imaging sensor (CIS), a micro-electro-mechanical system (MEMS), an active element, and/or a passive element. The semiconductor device 132 may be electrically connected to the conductive region of the semiconductor substrate 101. The semiconductor device 132 and the interlayer insulation layer 134, formed before forming a multi wiring structure, may be referred to as a front-end-of-line (FEOL) structure 130. According to other example embodiments, the semiconductor device 132 may be electrically disconnected from other semiconductor devices 132 adjacent thereto by an isolation layer.
The isolation layer may be configured as a single material layer, or may be configured as a multi material layer where two or more material layers are stacked. In some example embodiments, the isolation layer may have an STI structure. In some example embodiments, an upper surface of the isolation layer may be disposed on substantially the same plane as an upper surface 101A of the semiconductor substrate 101. In some example embodiments, the isolation layer may include silicon oxide, silicon nitride, silicon oxynitride, or a combination thereof.
A first via hole 110H may be formed to pass through the semiconductor substrate 101 and the interlayer insulation layer 134. The first via structure 110 may include a first via insulation layer 116 which covers a sidewall of the first via hole 110H, a first barrier layer 114 which covers a sidewall of the first via insulation layer 116, and a first via plug 112 which fills an inner space defined by the first barrier layer 114.
In some example embodiments, the first via insulation layer 116 may conformally cover the sidewall of the first via hole 110H. For example, the first via insulation layer 116 may extend to have a substantially uniform thickness along the sidewall of the first via hole 110H. The first via insulation layer 116 may include oxide, nitride, carbide, a polymer, or a combination thereof. In some example embodiments, the first via insulation layer 116 may be formed by a chemical vapor deposition (CVD) process. In some example embodiments, the first via insulation layer 116 may have a thickness of about 500 Å to about 2,500 Å.
Also, the sidewall of the first via hole 110H may include at least one undercut region UC. The undercut region UC may denote a portion of the sidewall of the first via hole 110H which horizontally protrudes toward a center of the first via hole 110H. The first via hole 110H, as described below, may be formed by a process such as a deep reactive ion etching process, and in this case, a fine concave-convex portion may be formed in the sidewall of the first via hole 110H and the undercut region UC may considerably protrude compared to the fine concave-convex portion.
Also, according to an example embodiment, a range of a height of each of the first and second via structures 110 and 120 may be about 30 um to about 150 um. According to an example embodiment, a distance Ha from the undercut region UC to an upper surface of the first via structure 110 may be less than a distance Hb from the undercut region UC to a lower surface of the first via structure 110. For example, a range of the distance Hb from the undercut region UC to the lower surface of the first via structure 110 may be about 200% to about 500% of the distance Ha from the undercut region UC to the upper surface of the first via structure 110. Also, a range of a distance Hc from a lower surface of the interlayer insulation layer 134 to the undercut region UC may be about 5 um to about 15 um.
In
In some example embodiments, the first barrier layer 114 may extend to have a substantially uniform thickness along the sidewall of the first via insulation layer 116. The first barrier layer 114 may include a conductive layer having a relatively low wiring resistance. For example, the first barrier layer 114 may include a single layer or a multilayer including at least one material selected from among tungsten (W), tungsten nitride (WN), tungsten carbide (WC), titanium (Ti), titanium nitride (TiN), tantalum (Ta), tantalum nitride (TaN), ruthenium (Ru), cobalt (Co), manganese (Mn), nickel (Ni), and nickel boride (NiB). For example, the first barrier layer 114 may include a multilayer including TaN/W, TiN/W, or WN/W. The first barrier layer 114 may have a thickness of about 500 Å to about 1,000 Å. In some example embodiments, the first barrier layer 114 may be formed by a physical vapor deposition (PVD) process, a CVD process, or an atomic layer deposition (ALD) process, but the inventive concepts are not limited thereto.
The second via structure 120 may include a second via insulation layer 126 which covers a sidewall of a second via hole 120H, a second barrier layer 124 which covers a sidewall of the second via insulation layer 126, and a second via plug 122 which fills an inner space defined by the second barrier layer 124.
The second via insulation layer 126, the second barrier layer 124, and the second via plug 122 may be the same as or substantially similar to the first via insulation layer 116, the first barrier layer 114, and the first via plug 112, respectively. The first via insulation layer 116, the first barrier layer 114, and the first via plug 112 have been described above, and thus, detailed descriptions of the second via insulation layer 126, the second barrier layer 124, and the second via plug 122 are omitted.
In some example embodiments, a horizontal cross-sectional surface of each of the first and second via structures 110 and 120 may have, for example, a circular shape, a polygonal shape, or an oval shape, which is planar. However, the inventive concepts are not limited thereto. A width of each of the first and second via structures 110 and 120 in a horizontal direction in the interlayer insulation layer 134 may have a constant change rate. Also, the first and second via structures 110 and 120 may have the same height. A height of the first or second via structure 110 or 120 may denote a vertical-direction (Z-direction) length.
The first via structure 110 may have a first diameter D1, and the second via structure 120 may have a second diameter D2 which is greater than the first diameter D1 at the same vertical level. Each of the first diameter D1 and the second diameter D2 may be a diameter measured on an outer diameter of a corresponding one of the first via insulation layer 116 and the second via insulation layer 126. For example, a range of the first diameter D1 may be about 2 um to about 4 um, and a range of the second diameter D2 may be about 3 um to about 8 um. In some example embodiments, the second diameter D2 may be about 1 um to about 5 um greater than the first diameter D1. For example, a range of a ratio of the second diameter D2 to the first diameter D1 may be about 110% to about 200%.
The first barrier layer 114 of the first via structure 110 may have a first barrier width E1 limited by an outer diameter of the first barrier layer 114, and the second barrier layer 124 of the second via structure 120 may have a second barrier width E2 limited by an outer diameter of the second barrier layer 124. In some example embodiments, the second barrier width E2 may be greater than the first barrier width E1. In some example embodiments, the second barrier width E2 may be about 1 um to about 4 um greater than the first barrier width E1.
One end of each of the first via structure 110 and the second via structure 120 may be electrically connected to a multilayer wiring structure 146 including a plurality of metal wiring layers 142 and a plurality of contact plugs 144. In
In some example embodiments, an upper insulation layer 150 may be formed on the inter-metal-layer insulation layer 148. The upper insulation layer 150 may include silicon oxide, silicon nitride, a polymer, or a combination thereof. A hole 150H exposing a bonding pad 152 connected to the multilayer wiring structure 146 may be formed on the upper insulation layer 150. The bonding pad 152 may be connected to an upper connection terminal 154 through the hole 150H.
The other end of each of the first via structure 110 and the second via structure 120 may be covered by the conductive layer 172. The connection terminal 174 may be electrically connected to the first via structure 110 and the second via structure 120 through the conductive layer 172.
The upper connection terminal 154 and the connection terminal 174 are not limited to a shape illustrated in
Furthermore, the semiconductor device 100 according to an example embodiment may not include an etch delay layer. Therefore, an outer sidewall of each of the first and second via structures 110 and 120 may be in contact with either the semiconductor substrate 101 or the interlayer insulation layer 134 at an area above the undercut region UC. For example, the outer sidewall of each of the first and second via structures 110 and 120 may be in contact with the semiconductor substrate 101 or the interlayer insulation layer 134 at a same vertical level. For example, the outer sidewall of each of the first and second via structures 110 and 120 may be only in contact with the semiconductor substrate 101 and the interlayer insulation layer 134 without being in contact with an etch delay layer. The etch delay layer may be disposed inward from the semiconductor substrate 101, inward from the interlayer insulation layer 134, or between the semiconductor substrate 101 and the interlayer insulation layer 134 and may denote a material forming an etch speed difference between the first via hole 110H and the second via hole 120H, regardless of a name thereof. That is, the etch delay layer may denote a material layer which has an etch selectivity with respect to the semiconductor substrate 101 or has an etch selectivity with respect to the interlayer insulation layer 134. For example, the etch delay layer may include at least one of a SiN-based material, an oxide-based material, a Si-based material (for example, SiGe), a metal-based material, and a carbon-based material.
General semiconductor devices include an etch delay layer inward from a semiconductor substrate or inward from an interlayer insulation layer, so as to induce a diameter difference between first and second via structures. In a case where the etch delay layer is provided, the etch delay layer may contact an outer wall of the first or second via structure after the first and second via structures are formed, and due to this, the reliability of a semiconductor device may be relatively low.
On the other hand, because the semiconductor device 100 according to an example embodiment does not include the etch delay layer, pollutants may not be included in the semiconductor substrate 101 or the interlayer insulation layer 134 in forming the first and second via structures 110 and 120. Accordingly, reliability of the semiconductor device 100 may be relatively high.
Referring to
Referring to
Based on protrusion shapes of the undercut region UC and the scallops SC, the first via insulation layer 116 and the first barrier layer 114 sequentially stacked thereon may have a shape corresponding to the protrusion shapes.
In an interface between the first via insulation layer 116 and the first barrier layer 114, a concave-convex portion of the scallops SC may be reduced compared to a sidewall of the first via hole 110H. In some example embodiments, the interface between the first via insulation layer 116 and the first barrier layer 114 may include an interface to which the concave-convex portion of the scallops SC is not transferred.
Referring to
Referring to
Except for a dimension, the third via plug 182, the third barrier layer 184, and the third via insulation layer 186 may be the same as or substantially similar to the first via plug 112, the first barrier layer 114, and the first via insulation layer 116, and thus, their detailed descriptions are omitted.
The third via structure 180 may have the third diameter D3, and the third diameter D3 may be greater than the second diameter D2 of the second via structure 120. In some example embodiments, the third diameter D3 may be about 1 um to about 5 um greater than the second diameter D2. The third diameter D3 may be a diameter measured on an outer diameter of the third via insulation layer 186.
The third barrier layer 184 of the third via structure 180 may have a third barrier width E3, and the third barrier width E3 may be greater than a second barrier width E2 of the second via structure 120. The third barrier width E3 may be about 1 um to about 4 um greater than the second barrier width E2.
In this case, the first via structure 110 may include two or more first undercut regions UC1 and UC2. Further, the second via structure 120 may include one or more second undercut regions UC3. The second undercut region UC3 may denote a portion of a sidewall of the second via hole 120H which horizontally protrudes toward a center of the second via hole 120H. The first via structure 110 may include more undercut regions UC than the second via structure 120. In some example embodiments, the first via structure 110 may include two first undercut regions UC1 and UC2, and the second via structure 120 may include one second undercut region UC3.
In some example embodiments, a vertical level of the second undercut region UC3 of the second via structure 120 may be between a vertical level of the first undercut region UC1 of the first via structure 110 and a vertical level of the first undercut region UC2 of the first via structure 110. In other words, with respect to a lower surface 101B of the semiconductor substrate 101, a vertical level of a first lower undercut region UC2 of the first via structure 110 may be lowest, a vertical level of a first upper undercut region UC1 of the first via structure 110 may be highest, and a vertical level of the second undercut region UC3 of the second via structure 120 may be therebetween. In other example embodiments, a vertical level of each of the first undercut regions UC1 and UC2 may differ from that of the second undercut region UC3.
In other example embodiments, an isolation layer surrounding the third via structure 180 in a horizontal direction may be provided over a certain height to contact a side surface of the third via structure 180.
Referring to
Referring to
According to an example embodiment, the scattering bar SB may include a line and space pattern, an island pattern, or a combination thereof. Exposure energy passing through the scattering bar SB of the reticle SR may be reduced. Therefore, exposure energy reaching the mask material layer 200 on the upper surface at the second position corresponding to the scattering bar SB may be reduced. Referring to
Referring to
Referring to
According to an example embodiment, the second preliminary recess PRCS2 may be configured to include an opening portion where an opened width thereof is greater than that of an opening portion of the first preliminary recess PRCS1. The first preliminary recess PRCS1 or the second preliminary recess PRCS2 may have, for example, a circular shape, a polygonal shape, or an oval shape, which is planar. However, the inventive concepts are not limited thereto.
In some example embodiments, a deep reactive ion etching (DRIE) process may be performed for forming the first or second preliminary recess PRCS1 or PRCS2 at the first or second position.
Because the semiconductor substrate 101 at the first position and the interlayer insulation layer 134 at the second position have an etch selectivity, the first preliminary recess PRCS1 at the first position may not be etched or may be relatively slightly etched while the interlayer insulation layer 134 at the second position is being etched and removed.
Referring to
The Deep Reactive Ion Etching (DRIE) process described above may be performed for forming the first via hole 110H and the second via hole 120H in operation S131. The first via hole 110H may have the first diameter D1, and the second via hole 120H may have the second diameter D2. The second diameter D2 may be greater than the first diameter DE Because the second diameter D2 is greater than the first diameter D1, an etch speed in the second via hole 120H may be greater than an etch speed in the first via hole 110H. Because an etch speed of the semiconductor substrate 101 in the first via hole 110H is slower than an etch speed of the semiconductor substrate 101 in the second via hole 120H, a depth of the first via hole 110H may be the same as that of the second via hole 120H at a time at which etching ends.
Also, after the first preliminary recess PRCS1 is formed by using the DRIE process in the first via hole 110H, an undercut region UC may be formed in an interface between portions etched by another DRIE process (e.g., by further etching the semiconductor substrate 101 by using the DRIE process) for forming the other portion of the first via hole 110H. In other words, a vertical level of the undercut region UC of the first via hole 110H may correspond to a vertical level of a lower surface of the first preliminary recess PRCS1.
In
Subsequently, a mask pattern 201 may be removed. The mask pattern 201 may be removed by a dissolving process using a solvent or an ashing process at an oxidation atmosphere in operation S135.
Referring to
The via insulation material layer 116m and the barrier material layer 114m may be formed by a PVD process, a CVD process, or an ALD process and a material available thereby has been described above with reference to
Also, a plug material layer 112m filling a space may be formed on the barrier material layer 114m. The plug material layer 112m may be formed by, for example, an electroplating process. For example, a metal seed layer (not shown) may be formed on a surface of the barrier material layer 114, and then a metal layer may be grown from the metal seed layer by an electroplating process, thereby forming the plug material layer 112m, filling the space on the barrier material layer 114m. The metal seed layer may include copper (Cu), a Cu alloy, Co, Ni, Ru, Co/Cu, or Ru/Cu. A PVD process may be used for forming the metal seed layer. A main material of the plug material layer 112m may use Cu or W. In some example embodiments, the plug material layer 112m may include Cu, CuSn, CuMg, CuNi, CuZn, CuPd, CuAu, CuW, W, or a W alloy, but is not limited thereto. The electroplating process may be performed at a temperature of about 10° C. to about 65° C. For example, the electroplating process may be performed at a room temperature. After the plug material layer 112m is formed, a resultant material where the plug material layer 112m is formed may be annealed at a temperature of about 150° C. to about 450° C.
Referring to
An operation of partially removing the plug material layer 112, the barrier material layer 114m, and the via insulation material layer 116m may be performed by, for example, a process such as a chemical mechanical polishing (CMP) process or an etch-back process.
Referring to
Subsequently, an upper insulation layer 150 partially exposing the bonding pads 152 may be formed, and an upper connection terminal 154 may be formed on the bonding pad 152.
Referring to
In some example embodiments, an operation of removing a portion of the semiconductor substrate 101 may be performed by, for example, a CMP process.
Also, a lower insulation layer 160 covering the lower surface 101B of the semiconductor substrate 101 may be formed. The lower insulation layer 160 may be formed to cover the first via structure 110 and the second via structure 120 each protruding from the lower surface 101B of the semiconductor substrate 101. In some example embodiments, the lower insulation layer 160 may be formed by a CVD process. In some example embodiments, the lower insulation layer 160 may include silicon oxide, silicon nitride, or a polymer.
Subsequently, referring to
Subsequently, a conductive layer 172 and a connection terminal 174 connected to the first and second structures 110 and 120 may be formed.
The conductive layer 172 may configure an under bump metallization (UBM) layer and may include layers having various compositions on the basis of a material of the connection terminal 174. In some example embodiments, the conductive layer 172 may include Ti, Cu, Ni, Au, NiV, NiP, TiNi, TiW, TaN, Al, Pd, CrCu, or a combination thereof. For example, the conductive layer 172 may have a stack structure of Cr/Cu/Au, a stack structure of Cr/CrCu/Cu, a TiWCu compound, a stack structure of TiWCu/Cu, a stack structure of Ni/Cu, a stack structure of NiV/Cu, a stack structure of Ti/Ni, a stack structure of Ti/NiP, TiWNiV compound, a stack structure of Al/Ni/Au, a stack structure of Al/NiP/Au, a stack structure of Ti/TiNi/CuNi compound, a stack structure of Ti/Ni/Pd, a stack structure of Ni/Pd/Au, or a stack structure of NiP/Pd/Au.
The connection terminal 174 may include a conductive pad, a solder ball, a solder bump, or a redistribution conductive layer. The connection terminal 174 may be connected to lower surfaces of the first and second via structures 110 and 120 through the conductive layer 172. The connection terminal 174 may include Ni, Cu, Al, or combination thereof, but is not limited thereto.
Referring to
Subsequently, first and second scattering bars SB1 and SB2 of a reticle SR may be disposed on an upper surface at each of a second position and a position (hereinafter referred to as a third position) for forming a third via structure 180. Also, an opened reticle SR may be disposed on an upper surface at the first position. A density of the first scattering bar SB1 disposed on the upper surface at the second position may be less than that of the second scattering bar SB2 disposed on the upper surface at the third position. Also, a removal depth of the mask material layer 200 on the upper surface at the third position may be less than that of the mask material layer 200 on the upper surface at the second position. Subsequently, an exposure process may be performed on the mask material layer 200 on the upper surface at each of the first to third positions.
Referring to
Referring to
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Subsequently, after the first to third via holes 110H to 130H are formed, the semiconductor device 100b of
Referring to
The package substrate 610 may include a flexible printed circuit board, a rigid printed circuit board, or a combination thereof. The package substrate 610 may include a substrate internal wiring 612 and a connection terminal 614. The connection terminal 614 may be formed on one surface of the package substrate 610. A solder ball 616 may be formed on the other surface of the package substrate 610. The connection terminal 614 may be electrically connected to the solder ball 616 through the substrate internal wiring 612. In some example embodiments, the solder ball 616 may be replaced with a conductive bump or a lead grid array (LGA).
The semiconductor package 600 may include via structure units 622 and 632. The via structure units 622 and 632 may be electrically connected to the connection terminal 614 of the package substrate 610 by the connection member 650 such as a bump. In some example embodiments, the via structure unit 632 may be omitted in the control chip 630.
At least one of the plurality of semiconductor chips 620 and the control chip 630 may include at least one of the semiconductor devices 100 described above with reference to
Each of the plurality of semiconductor chips 620 may include system LSI, flash memory, dynamic random access memory (DRAM), static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), phase change random access memory (PRAM), magnetic random access memory (MRAM), or resistance random access memory (RRAM). The control chip 630 may include, for example, logic circuits such as a serializer/deserializer (SER/DES) circuit.
While the inventive concepts have been particularly shown and described with reference to some example embodiments thereof, it will be understood that various changes in form and details may be made therein without departing from the spirit and scope of the following claims.
Number | Date | Country | Kind |
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10-2021-0175208 | Dec 2021 | KR | national |