Sungjun Chun

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Vertically transitioning between substrate integrated waveguides (S...
- Patent number 11,658,378
- Issue date May 23, 2023
- International Business Machines Corporation
- Joshua C. Myers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PCB with substrate integrated waveguides using multi-band monopole...
- Patent number 11,399,428
- Issue date Jul 26, 2022
- International Business Machines Corporation
- Pavel Roy Paladhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Signal via positioning in a multi-layer circuit board
- Patent number 10,657,308
- Issue date May 19, 2020
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Crosstalk reduction between signal layers in a multilayered package...
- Patent number 10,375,820
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal via positioning in a multi-layer circuit board using a genet...
- Patent number 10,223,490
- Issue date Mar 5, 2019
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal via positioning in a multi-layer circuit board using a genet...
- Patent number 10,216,884
- Issue date Feb 26, 2019
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for fabricating a hybrid land grid array connector
- Patent number 10,135,162
- Issue date Nov 20, 2018
- International Business Machines Corporation
- Jose A. Hejase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector having a body with a conductive layer common to top and b...
- Patent number 10,128,593
- Issue date Nov 13, 2018
- International Business Machines Corporation
- Jose A. Hejase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a printed circuit board copper plane repair
- Patent number 9,980,382
- Issue date May 22, 2018
- International Business Machines Corporation
- Mahesh Bohra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crosstalk reduction between signal layers in a multilayered package...
- Patent number 9,955,567
- Issue date Apr 24, 2018
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal via positioning in a multi-layer circuit board
- Patent number 9,940,426
- Issue date Apr 10, 2018
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal via positioning in a multi-layer circuit board
- Patent number 9,916,410
- Issue date Mar 13, 2018
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal via positioning in a multi-layer circuit board using a genet...
- Patent number 9,881,115
- Issue date Jan 30, 2018
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Signal via positioning in a multi-layer circuit board using a genet...
- Patent number 9,875,331
- Issue date Jan 23, 2018
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board copper plane repair
- Patent number 9,485,866
- Issue date Nov 1, 2016
- International Business Machines Corporation
- Mahesh Bohra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Managing interconnect electromigration effects
- Patent number 9,477,568
- Issue date Oct 25, 2016
- International Business Machines Corporation
- Malcolm S. Allen-Ware
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Printed circuit board copper plane repair
- Patent number 9,374,910
- Issue date Jun 21, 2016
- International Business Machines Corporation
- Mahesh Bohra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
276-pin buffered memory card with enhanced memory system interconnect
- Patent number 9,357,649
- Issue date May 31, 2016
- Inernational Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit substrate fabrication method providing improved...
- Patent number 8,962,475
- Issue date Feb 24, 2015
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Crosstalk reduction between signal layers in a multilayered package...
- Patent number 8,927,879
- Issue date Jan 6, 2015
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System for designing substrates having reference plane voids with s...
- Patent number 8,813,000
- Issue date Aug 19, 2014
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Noise coupling reduction and impedance discontinuity control in hig...
- Patent number 8,645,889
- Issue date Feb 4, 2014
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit manufacturing and design techniques for reference plane voi...
- Patent number 8,638,567
- Issue date Jan 28, 2014
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer circuit substrate fabrication and design methods provid...
- Patent number 8,624,297
- Issue date Jan 7, 2014
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit manufacturing and design techniques for reference plane voi...
- Patent number 8,625,300
- Issue date Jan 7, 2014
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reducing crosstalk in the design of module nets
- Patent number 8,407,644
- Issue date Mar 26, 2013
- International Business Machines Corporation
- Dulce M. Altabella Cabrera
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Circuit manufacturing and design techniques for reference plane voi...
- Patent number 8,325,490
- Issue date Dec 4, 2012
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Noise coupling reduction and impedance discontinuity control in hig...
- Patent number 8,288,657
- Issue date Oct 16, 2012
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Redundant clock channel for high reliability connectors
- Patent number 8,257,092
- Issue date Sep 4, 2012
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of reducing crosstalk induced noise in circuitry designs
- Patent number 7,945,881
- Issue date May 17, 2011
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION...
- Publication number 20240321802
- Publication date Sep 26, 2024
- International Business Machines Corporation
- JUNYAN TANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY
- Publication number 20240234284
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Francesco PREDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST
- Publication number 20240213217
- Publication date Jun 27, 2024
- International Business Machines Corporation
- David Michael Audette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY
- Publication number 20240136270
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Francesco PREDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICOMPONENT MODULE DESIGN AND FABRICATION
- Publication number 20220308564
- Publication date Sep 29, 2022
- International Business Machines Corporation
- Kirk D. Peterson
- G05 - CONTROLLING REGULATING
Information Patent Application
PCB WITH SUBSTRATE INTEGRATED WAVEGUIDES USING MULTI-BAND MONOPOLE...
- Publication number 20210112655
- Publication date Apr 15, 2021
- International Business Machines Corporation
- PAVEL ROY PALADHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY TRANSITIONING BETWEEN SUBSTRATE INTEGRATED WAVEGUIDES (S...
- Publication number 20210111472
- Publication date Apr 15, 2021
- International Business Machines Corporation
- JOSHUA C. MYERS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...
- Publication number 20180213636
- Publication date Jul 26, 2018
- JINWOO CHOI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD USING A GENET...
- Publication number 20180075180
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD USING A GENET...
- Publication number 20180068048
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD
- Publication number 20180060478
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD USING A GENET...
- Publication number 20170316139
- Publication date Nov 2, 2017
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD USING A GENET...
- Publication number 20170316141
- Publication date Nov 2, 2017
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD
- Publication number 20160371417
- Publication date Dec 22, 2016
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD
- Publication number 20160371416
- Publication date Dec 22, 2016
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PRINTED CIRCUIT BOARD COPPER PLANE REPAIR
- Publication number 20160150647
- Publication date May 26, 2016
- International Business Machines Corporation
- Mahesh Bohra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD COPPER PLANE REPAIR
- Publication number 20150282331
- Publication date Oct 1, 2015
- International Business Machines Corporation
- Mahesh Bohra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED CIRCUIT BOARD COPPER PLANE REPAIR
- Publication number 20150189754
- Publication date Jul 2, 2015
- International Business Machines Corporation
- Mahesh Bohra
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Managing Interconnect Electromigration Effects
- Publication number 20150094995
- Publication date Apr 2, 2015
- International Business Machines Corporation
- Malcolm S. Allen-Ware
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...
- Publication number 20140331482
- Publication date Nov 13, 2014
- JINWOO CHOI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER CIRCUIT SUBSTRATE FABRICATION METHOD PROVIDING IMPROVED...
- Publication number 20140080300
- Publication date Mar 20, 2014
- International Business Machines Corporation
- Sungjun Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM FOR DESIGNING SUBSTRATES HAVING REFERENCE PLANE VOIDS WITH S...
- Publication number 20140033146
- Publication date Jan 30, 2014
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
276-PIN BUFFERED MEMORY CARD WITH ENHANCED MEMORY SYSTEM INTERCONNECT
- Publication number 20130301207
- Publication date Nov 14, 2013
- International Business Machines Corporation
- Sungjun Chun
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MANUFACTURING AND DESIGN TECHNIQUES FOR REFERENCE PLANE VOI...
- Publication number 20120331429
- Publication date Dec 27, 2012
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT MANUFACTURING AND DESIGN TECHNIQUES FOR REFERENCE PLANE VOI...
- Publication number 20120331430
- Publication date Dec 27, 2012
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Noise Coupling Reduction and Impedance Discontinuity Control in Hig...
- Publication number 20120204141
- Publication date Aug 9, 2012
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...
- Publication number 20120125677
- Publication date May 24, 2012
- International Business Machines Corporation
- Jinwoo Choi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUNDANT CLOCK CHANNEL FOR HIGH RELIABILITY CONNECTORS
- Publication number 20120120577
- Publication date May 17, 2012
- International Business Machines Corporation
- Sungjun Chun
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Noise Coupling Reduction and Impedance Discontinuity Control in Hig...
- Publication number 20110083888
- Publication date Apr 14, 2011
- International Business Machines Corporation
- Jinwoo Choi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Reducing Crosstalk In The Design Of Module Nets
- Publication number 20110031627
- Publication date Feb 10, 2011
- International Business Machines Corporation
- Dulce M. Altabella Cabrera
- G06 - COMPUTING CALCULATING COUNTING

Sungjun Chun

Person

Patents Grantslast 30 patents

Vertically transitioning between substrate integrated waveguides (S...

PCB with substrate integrated waveguides using multi-band monopole...

Signal via positioning in a multi-layer circuit board

Crosstalk reduction between signal layers in a multilayered package...

Signal via positioning in a multi-layer circuit board using a genet...

Signal via positioning in a multi-layer circuit board using a genet...

Method for fabricating a hybrid land grid array connector

Connector having a body with a conductive layer common to top and b...

Method of making a printed circuit board copper plane repair

Crosstalk reduction between signal layers in a multilayered package...

Signal via positioning in a multi-layer circuit board

Signal via positioning in a multi-layer circuit board

Signal via positioning in a multi-layer circuit board using a genet...

Signal via positioning in a multi-layer circuit board using a genet...

Printed circuit board copper plane repair

Managing interconnect electromigration effects

Printed circuit board copper plane repair

276-pin buffered memory card with enhanced memory system interconnect

Multi-layer circuit substrate fabrication method providing improved...

Crosstalk reduction between signal layers in a multilayered package...

System for designing substrates having reference plane voids with s...

Noise coupling reduction and impedance discontinuity control in hig...

Circuit manufacturing and design techniques for reference plane voi...

Multi-layer circuit substrate fabrication and design methods provid...

Circuit manufacturing and design techniques for reference plane voi...

Reducing crosstalk in the design of module nets

Circuit manufacturing and design techniques for reference plane voi...

Noise coupling reduction and impedance discontinuity control in hig...

Redundant clock channel for high reliability connectors

Method of reducing crosstalk induced noise in circuitry designs

Patents Applicationslast 30 patents

PROCESSOR PACKAGE SUBSTRATE WITH HIGH-SPEED TOP-SURFACE CONNECTION...

DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

CLUSTERING FINE PITCH MICRO-BUMPS FOR PACKAGING AND TEST

DENSE VIA PITCH INTERCONNECT TO INCREASE WIRING DENSITY

MULTICOMPONENT MODULE DESIGN AND FABRICATION

PCB WITH SUBSTRATE INTEGRATED WAVEGUIDES USING MULTI-BAND MONOPOLE...

VERTICALLY TRANSITIONING BETWEEN SUBSTRATE INTEGRATED WAVEGUIDES (S...

CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...

SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD USING A GENET...

SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD USING A GENET...

SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD

SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD USING A GENET...

SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD USING A GENET...

SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD

SIGNAL VIA POSITIONING IN A MULTI-LAYER CIRCUIT BOARD

PRINTED CIRCUIT BOARD COPPER PLANE REPAIR

PRINTED CIRCUIT BOARD COPPER PLANE REPAIR

PRINTED CIRCUIT BOARD COPPER PLANE REPAIR

Managing Interconnect Electromigration Effects

CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...

MULTI-LAYER CIRCUIT SUBSTRATE FABRICATION METHOD PROVIDING IMPROVED...

SYSTEM FOR DESIGNING SUBSTRATES HAVING REFERENCE PLANE VOIDS WITH S...

276-PIN BUFFERED MEMORY CARD WITH ENHANCED MEMORY SYSTEM INTERCONNECT

CIRCUIT MANUFACTURING AND DESIGN TECHNIQUES FOR REFERENCE PLANE VOI...

CIRCUIT MANUFACTURING AND DESIGN TECHNIQUES FOR REFERENCE PLANE VOI...

Noise Coupling Reduction and Impedance Discontinuity Control in Hig...

CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE...

REDUNDANT CLOCK CHANNEL FOR HIGH RELIABILITY CONNECTORS

Noise Coupling Reduction and Impedance Discontinuity Control in Hig...

Reducing Crosstalk In The Design Of Module Nets