Sunguk LEE

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Package substrate and semiconductor package including the same
- Patent number 12,176,308
- Issue date Dec 24, 2024
- Samsung Electronics Co., Ltd.
- Youngkyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate including a redistribution pad extending from a r...
- Patent number 11,756,908
- Issue date Sep 12, 2023
- Samsung Electronics Co., Ltd.
- Youngkyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate including segment grooves arranged in a radial di...
- Patent number 11,302,661
- Issue date Apr 12, 2022
- Samsung Electronics Co., Ltd.
- Youngkyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing connection structure of semiconductor chip...
- Patent number 11,264,339
- Issue date Mar 1, 2022
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...
- Publication number 20250079382
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Jaeean Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE
- Publication number 20250079317
- Publication date Mar 6, 2025
- Samsung Electronics Co., Ltd.
- Changyeon SONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250062252
- Publication date Feb 20, 2025
- Samsung Electronics Co., Ltd.
- Jaeean LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250046728
- Publication date Feb 6, 2025
- Samsung Electronics Co., Ltd.
- Dongwon KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250015043
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Jaeean LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20230411321
- Publication date Dec 21, 2023
- Samsung Electronics Co., Ltd.
- Youngkyu LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20220238469
- Publication date Jul 28, 2022
- Samsung Electronics Co., Ltd.
- Youngkyu LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20210202414
- Publication date Jul 1, 2021
- Samsung Electronics Co., Ltd.
- Youngkyu LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP...
- Publication number 20200273817
- Publication date Aug 27, 2020
- Samsung Electronics Co., Ltd.
- Gyujin CHOI
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package substrate and semiconductor package including the same

Package substrate including a redistribution pad extending from a r...

Package substrate including segment grooves arranged in a radial di...

Method of manufacturing connection structure of semiconductor chip...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PAC...

SEMICONDUCTOR PACKAGE INCLUDING A REDISTRIBUTION STRUCTURE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

METHOD OF MANUFACTURING CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP...