Sure NGO

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Dublin, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Multi-layer dielectric stack for plasma damage protection
- Patent number 9,391,024
- Issue date Jul 12, 2016
- Applied Materials, Inc.
- Bo Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Post treatment for dielectric constant reduction with pore generati...
- Patent number 9,324,571
- Issue date Apr 26, 2016
- Applied Materials, Inc.
- Kang Sub Yim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesion layer to minimize dielectric constant increase with good a...
- Patent number 9,165,998
- Issue date Oct 20, 2015
- Applied Materials, Inc.
- Kang Sub Yim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Microelectronic structure including a low k dielectric and a method...
- Patent number 8,349,746
- Issue date Jan 8, 2013
- Applied Materials, Inc.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS
- Publication number 20220084815
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Bo Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CLEANING LOW-K DEPOSITION CHAMBERS
- Publication number 20220081765
- Publication date Mar 17, 2022
- Applied Materials, Inc.
- Bo Xie
- B08 - CLEANING
Information Patent Application
MULTI-LAYER DIELECTRIC STACK FOR PLASMA DAMAGE PROTECTION
- Publication number 20160111373
- Publication date Apr 21, 2016
- Applied Materials, Inc.
- Bo XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POST TREATMENT FOR DIELECTRIC CONSTANT REDUCTION WITH PORE GENERATI...
- Publication number 20150380265
- Publication date Dec 31, 2015
- Applied Materials, Inc.
- Kang Sub YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESION LAYER TO MINIMIZE DIELECTRIC CONSTANT INCREASE WITH GOOD A...
- Publication number 20140264780
- Publication date Sep 18, 2014
- Applied Materials, Inc.
- Kang Sub YIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
IN-SITU LOW-K CAPPING TO IMPROVE INTEGRATION DAMAGE RESISTANCE
- Publication number 20120156890
- Publication date Jun 21, 2012
- Applied Materials, Inc.
- KANG SUB YIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Microelectronic structure including a low K dielectric and a method...
- Publication number 20110204492
- Publication date Aug 25, 2011
- APPLIED MATERIALS, INC.
- Bo Xie
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Multi-layer dielectric stack for plasma damage protection

Post treatment for dielectric constant reduction with pore generati...

Adhesion layer to minimize dielectric constant increase with good a...

Microelectronic structure including a low k dielectric and a method...

Patents Applicationslast 30 patents

SYSTEMS AND METHODS FOR DEPOSITING LOW-K DIELECTRIC FILMS

SYSTEMS AND METHODS FOR CLEANING LOW-K DEPOSITION CHAMBERS

MULTI-LAYER DIELECTRIC STACK FOR PLASMA DAMAGE PROTECTION

POST TREATMENT FOR DIELECTRIC CONSTANT REDUCTION WITH PORE GENERATI...

ADHESION LAYER TO MINIMIZE DIELECTRIC CONSTANT INCREASE WITH GOOD A...

IN-SITU LOW-K CAPPING TO IMPROVE INTEGRATION DAMAGE RESISTANCE

Microelectronic structure including a low K dielectric and a method...