Suresh K. Chengalva

Person

Carmel, IN, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self circulating heat exchanger
- Patent number 8,797,739
- Issue date Aug 5, 2014
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fluid cooled encapsulated microelectronic package
- Patent number 8,471,380
- Issue date Jun 25, 2013
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooled encapsulated microelectronic package
- Patent number 8,026,597
- Issue date Sep 27, 2011
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat-dissipating component having stair-stepped coolant channels
- Patent number 7,782,616
- Issue date Aug 24, 2010
- Delphi Technologies, Inc.
- Bruce A. Myers
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Fluid cooled encapsulated microelectronic package
- Patent number 7,485,957
- Issue date Feb 3, 2009
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid circulator for fluid cooled electronic device
- Patent number 7,486,515
- Issue date Feb 3, 2009
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink electronic package having compliant pedestal
- Patent number 7,440,282
- Issue date Oct 21, 2008
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an encapsulated microelectronic package having flu...
- Patent number 7,364,684
- Issue date Apr 29, 2008
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Thermal management of surface-mount circuit devices
- Patent number 7,365,273
- Issue date Apr 29, 2008
- Delphi Technologies, Inc.
- Manuel R. Fairchild
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip chip heat sink package and method
- Patent number 7,352,585
- Issue date Apr 1, 2008
- Delphi Technologies, Inc.
- Larry M Mandel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vane integration into motor hub to enhance CD cooling
- Patent number 7,334,243
- Issue date Feb 19, 2008
- Delphi Technologies, Inc.
- Suresh K. Chengalva
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic package and method of cooling electronics
- Patent number 7,307,841
- Issue date Dec 11, 2007
- Delphi Technologies, Inc.
- Carl W. Berlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cooled electronic assembly and method for cooling a printed circuit...
- Patent number 7,230,832
- Issue date Jun 12, 2007
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooled encapsulated microelectronic package
- Patent number 7,205,653
- Issue date Apr 17, 2007
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip heat sink package and method
- Patent number 7,180,745
- Issue date Feb 20, 2007
- Delphi Technologies, Inc.
- Larry M Mandel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board with localized stiffener for enhanced circuit compone...
- Patent number 7,094,975
- Issue date Aug 22, 2006
- Delphi Technologies, Inc.
- Suresh K. Chengalva
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced electronic module with self-aligning heat sink
- Patent number 6,999,317
- Issue date Feb 14, 2006
- Delphi Technologies, Inc.
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with integral leadframe convector and me...
- Patent number 6,979,900
- Issue date Dec 27, 2005
- Delphi Technologies, Inc.
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming an electronic assembly
- Patent number 6,807,731
- Issue date Oct 26, 2004
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SYSTEM
- Publication number 20240074667
- Publication date Mar 7, 2024
- ROCKLEY PHOTINICS LIMITED
- Kyle RICK
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
MINIMALLY INVASIVE DEVICE WITH SPECTROPHOTOMETER
- Publication number 20240041328
- Publication date Feb 8, 2024
- ROCKLEY PHOTONICS LIMITED
- Paul Mannion
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
WEARABLE DEVICE
- Publication number 20230397818
- Publication date Dec 14, 2023
- ROCKLEY PHOTONICS LIMITED
- Todd Andrew NEWHOUSE
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
OPTICAL SENSING MODULE
- Publication number 20230375525
- Publication date Nov 23, 2023
- ROCKLEY PHOTONICS LIMITED
- Sean Merritt
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
SENSING SYSTEM
- Publication number 20220413143
- Publication date Dec 29, 2022
- ROCKLEY PHOTONICS LIMITED
- Roozbeh PARSA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
DRIVER ASSISTANCE SYSTEM
- Publication number 20200023840
- Publication date Jan 23, 2020
- Delphi Technologies, Inc.
- Ronald M. Taylor
- B60 - VEHICLES IN GENERAL
Information Patent Application
Navigation System That Displays Other-Vehicle Information
- Publication number 20160370201
- Publication date Dec 22, 2016
- Delphi Technologies, Inc.
- Devaiah Aiappa Pudiyathanda
- G01 - MEASURING TESTING
Information Patent Application
SELF CIRCULATING HEAT EXCHANGER
- Publication number 20120325441
- Publication date Dec 27, 2012
- Delphi Technologies, Inc.
- SCOTT D. BRANDENBURG
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
FLUID COOLED ENCAPSULATED MICROELECTRONIC PACKAGE
- Publication number 20120001319
- Publication date Jan 5, 2012
- Delphi Technologies, Inc.
- SCOTT D. BRANDENBURG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid cooled encapsulated microelectronic package
- Publication number 20090108439
- Publication date Apr 30, 2009
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid circulator for fluid cooled electronic device
- Publication number 20080192430
- Publication date Aug 14, 2008
- Delphi Technologies, Inc.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sink electronic package having compliant pedestal
- Publication number 20070268671
- Publication date Nov 22, 2007
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fluid cooled encapsulated microelectronic package
- Publication number 20070114656
- Publication date May 24, 2007
- DELPHI TECHNOLOGIES, INC.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip heat sink package and method
- Publication number 20070064399
- Publication date Mar 22, 2007
- DELPHI TECHNOLOGIES, INC.
- Larry M. Mandel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vane integration into motor hub to enhance CD cooling
- Publication number 20070050794
- Publication date Mar 1, 2007
- Suresh K. Chengalva
- G11 - INFORMATION STORAGE
Information Patent Application
Electronic package and method of cooling electronics
- Publication number 20070025081
- Publication date Feb 1, 2007
- Carl W. Berlin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cooled electronic assembly and method for cooling a printed circuit...
- Publication number 20060285300
- Publication date Dec 21, 2006
- DELPHI TECHNOLOGIES, INC.
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly with integral thermal transient suppression
- Publication number 20060209516
- Publication date Sep 21, 2006
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MANAGEMENT OF SURFACE-MOUNT CIRCUIT DEVICES
- Publication number 20060120058
- Publication date Jun 8, 2006
- DELPHI TECHNOLOGIES, INC
- Manuel R. Fairchild
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluid cooled encapsulated microelectronic package
- Publication number 20060038284
- Publication date Feb 23, 2006
- Scott D. Brandenburg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making an encapsulated microelectronic package having flu...
- Publication number 20060033236
- Publication date Feb 16, 2006
- Scott D. Brandenburg
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Surface mounting of components
- Publication number 20050163966
- Publication date Jul 28, 2005
- Mahesh K. Chengalva
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Circuit board with localized stiffener for enhanced circuit compone...
- Publication number 20050109534
- Publication date May 26, 2005
- Suresh K. Chengalva
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Integrated circuit package with integral leadframe convector and me...
- Publication number 20050082660
- Publication date Apr 21, 2005
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming an electronic assembly
- Publication number 20050081377
- Publication date Apr 21, 2005
- DELPHI TECHNOLOGIES, INC.
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flip chip heat sink package and method
- Publication number 20050078456
- Publication date Apr 14, 2005
- Larry M. Mandel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device heat sink package and method
- Publication number 20050077614
- Publication date Apr 14, 2005
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally enhanced electronic module with self-aligning heat sink
- Publication number 20050036292
- Publication date Feb 17, 2005
- Suresh K. Chengalva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnetic interference shield for overmolded packaging of an...
- Publication number 20030184976
- Publication date Oct 2, 2003
- Scott D. Brandenburg
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Suresh K. Chengalva

Person

Patents Grantslast 30 patents

Self circulating heat exchanger

Fluid cooled encapsulated microelectronic package

Fluid cooled encapsulated microelectronic package

Heat-dissipating component having stair-stepped coolant channels

Fluid cooled encapsulated microelectronic package

Fluid circulator for fluid cooled electronic device

Heat sink electronic package having compliant pedestal

Method of making an encapsulated microelectronic package having flu...

Thermal management of surface-mount circuit devices

Flip chip heat sink package and method

Vane integration into motor hub to enhance CD cooling

Electronic package and method of cooling electronics

Cooled electronic assembly and method for cooling a printed circuit...

Fluid cooled encapsulated microelectronic package

Flip chip heat sink package and method

Circuit board with localized stiffener for enhanced circuit compone...

Thermally enhanced electronic module with self-aligning heat sink

Integrated circuit package with integral leadframe convector and me...

Method for forming an electronic assembly

Patents Applicationslast 30 patents

SYSTEM

MINIMALLY INVASIVE DEVICE WITH SPECTROPHOTOMETER

WEARABLE DEVICE

OPTICAL SENSING MODULE

SENSING SYSTEM

DRIVER ASSISTANCE SYSTEM

Navigation System That Displays Other-Vehicle Information

SELF CIRCULATING HEAT EXCHANGER

FLUID COOLED ENCAPSULATED MICROELECTRONIC PACKAGE

Fluid cooled encapsulated microelectronic package

Fluid circulator for fluid cooled electronic device

Heat sink electronic package having compliant pedestal

Fluid cooled encapsulated microelectronic package

Flip chip heat sink package and method

Vane integration into motor hub to enhance CD cooling

Electronic package and method of cooling electronics

Cooled electronic assembly and method for cooling a printed circuit...

Electronic assembly with integral thermal transient suppression

THERMAL MANAGEMENT OF SURFACE-MOUNT CIRCUIT DEVICES

Fluid cooled encapsulated microelectronic package

Method of making an encapsulated microelectronic package having flu...

Surface mounting of components

Circuit board with localized stiffener for enhanced circuit compone...

Integrated circuit package with integral leadframe convector and me...

Method for forming an electronic assembly

Flip chip heat sink package and method

Semiconductor device heat sink package and method

Thermally enhanced electronic module with self-aligning heat sink

Electromagnetic interference shield for overmolded packaging of an...