Suresh Ramalingam

Person

Fremont, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package with near-die integrated passive device
- Patent number 12,136,613
- Issue date Nov 5, 2024
- Xilinx, Inc.
- Li-Sheng Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fanout integration for stacked silicon package assembly
- Patent number 12,027,493
- Issue date Jul 2, 2024
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous integration module comprising thermal management appa...
- Patent number 11,769,710
- Issue date Sep 26, 2023
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radome with integrated passive cooling
- Patent number 11,605,886
- Issue date Mar 14, 2023
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package assembly having vertical thermal management
- Patent number 11,488,936
- Issue date Nov 1, 2022
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enablement of dies with impurity gettering
- Patent number 11,488,887
- Issue date Nov 1, 2022
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote active cooling heat exchanger and antenna system with the same
- Patent number 11,476,556
- Issue date Oct 18, 2022
- Xilinx, Inc.
- Mohsen H. Mardi
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Package integration for laterally mounted IC dies with dissimilar s...
- Patent number 11,373,989
- Issue date Jun 28, 2022
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal heat spreader plate for electronic device
- Patent number 11,373,929
- Issue date Jun 28, 2022
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package assembly having thermal management
- Patent number 11,355,412
- Issue date Jun 7, 2022
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional thermal management apparatuses for electronic dev...
- Patent number 11,328,976
- Issue date May 10, 2022
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Force balanced package mounting
- Patent number 11,330,738
- Issue date May 10, 2022
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly with enhanced solder resist crack resistance
- Patent number 11,315,858
- Issue date Apr 26, 2022
- Xilinx, Inc.
- Yu Hsiang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Modular stacked silicon package assembly
- Patent number 11,302,674
- Issue date Apr 12, 2022
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly with stress decoupled interconnect layer
- Patent number 11,282,775
- Issue date Mar 22, 2022
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro device with through PCB cooling
- Patent number 11,246,211
- Issue date Feb 8, 2022
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip package assembly with enhanced interconnects and method for fa...
- Patent number 11,217,550
- Issue date Jan 4, 2022
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package assembly having thermal management using ph...
- Patent number 11,195,780
- Issue date Dec 7, 2021
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package assembly having thermal management
- Patent number 11,145,566
- Issue date Oct 12, 2021
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated electrical/optical interface with two-tiered packaging
- Patent number 11,107,770
- Issue date Aug 31, 2021
- Xilinx, Inc.
- Suresh Ramalingam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of package enabled ESD protection
- Patent number 11,043,484
- Issue date Jun 22, 2021
- Xilinx, Inc.
- Hong Shi
- G01 - MEASURING TESTING
Information Patent Grant
Chip scale package (CSP) including shim die
- Patent number 10,770,364
- Issue date Sep 8, 2020
- Xilinx, Inc.
- Hong Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device apparatus with multiple thermally conductive path...
- Patent number 10,720,377
- Issue date Jul 21, 2020
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die with in-chip heat sink
- Patent number 10,629,512
- Issue date Apr 21, 2020
- Xilinx, Inc.
- Hong-Tsz Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of interconnect for high density 2.5D and 3D integration
- Patent number 10,593,638
- Issue date Mar 17, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing system for lid-less integrated circuit packages
- Patent number 10,527,670
- Issue date Jan 7, 2020
- Xilinx, Inc.
- Gamal Refai-Ahmed
- G01 - MEASURING TESTING
Information Patent Grant
Methods and apparatus for thermal interface material (TIM) bond lin...
- Patent number 10,529,645
- Issue date Jan 7, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip silicon substrate-less chip packaging
- Patent number 10,468,351
- Issue date Nov 5, 2019
- Xilinx, Inc.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package assembly with enhanced interconnects and method for fa...
- Patent number 10,319,606
- Issue date Jun 11, 2019
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon package having a thermal capacitance element
- Patent number 10,262,920
- Issue date Apr 16, 2019
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEVICES, SYSTEMS, AND METHODS FOR A PROGRAMMABLE THREE-DIMENSIONAL...
- Publication number 20250096136
- Publication date Mar 20, 2025
- ADVANCED MICRO DEVICES, INC.
- Divya Madapusi Srinivas Prasad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN NOISE REDUCTION
- Publication number 20250069579
- Publication date Feb 27, 2025
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
PROTECTION APPARATUS FOR A PHOTONIC DEVICE
- Publication number 20240329329
- Publication date Oct 3, 2024
- Xilinx, Inc.
- Gamal REFAI-AHMED
- G02 - OPTICS
Information Patent Application
FRAME FOR COUPLING OF A THERMAL MANAGEMENT DEVICE TO A PRINTED CIRC...
- Publication number 20240314934
- Publication date Sep 19, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE
- Publication number 20240290686
- Publication date Aug 29, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOATING HEAT SPREADER WITH GUIDED MECHANISM
- Publication number 20240258190
- Publication date Aug 1, 2024
- ADVANCED MICRO DEVICES, INC.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED DEVICES
- Publication number 20240055359
- Publication date Feb 15, 2024
- Xilinx, Inc.
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH PASS THROUGH HEAT SPREADER
- Publication number 20230420335
- Publication date Dec 28, 2023
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH DECOUPLED THERMAL MANAGEMENT
- Publication number 20230282547
- Publication date Sep 7, 2023
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE
- Publication number 20230253380
- Publication date Aug 10, 2023
- Xilinx, Inc.
- Li-Sheng WENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADER FOR A SEMICONDUCTOR PACKAGE
- Publication number 20230207422
- Publication date Jun 29, 2023
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULAR STACKED SILICON PACKAGE ASSEMBLY
- Publication number 20210366873
- Publication date Nov 25, 2021
- Xilinx, Inc.
- Jaspreet Singh GANDHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS INTEGRATION MODULE COMPRISING THERMAL MANAGEMENT APPA...
- Publication number 20210305127
- Publication date Sep 30, 2021
- Xilinx, Inc.
- Gamal REFAI-AHMED
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING THERMAL MANAGEMENT
- Publication number 20210249328
- Publication date Aug 12, 2021
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING VERTICAL THERMAL MANAGEMENT
- Publication number 20210193620
- Publication date Jun 24, 2021
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FANOUT INTEGRATION FOR STACKED SILICON PACKAGE ASSEMBLY
- Publication number 20210134757
- Publication date May 6, 2021
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE APPARATUS WITH MULTIPLE THERMALLY CONDUCTIVE PATH...
- Publication number 20200152546
- Publication date May 14, 2020
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING THERMAL MANAGEMENT
- Publication number 20200105642
- Publication date Apr 2, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE ASSEMBLY WITH ENHANCED INTERCONNECTS AND METHOD FOR FA...
- Publication number 20200035635
- Publication date Jan 30, 2020
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DIE WITH IN-CHIP HEAT SINK
- Publication number 20200006186
- Publication date Jan 2, 2020
- Xilinx, Inc.
- Hong-Tsz Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE (CSP) INCLUDING SHIM DIE
- Publication number 20190318975
- Publication date Oct 17, 2019
- Xilinx, Inc.
- Hong Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...
- Publication number 20180358280
- Publication date Dec 13, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC MOUNTING THERMAL MANAGEMENT FOR DEVICES ON BOARD
- Publication number 20180308783
- Publication date Oct 25, 2018
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
TESTING SYSTEM FOR LID-LESS INTEGRATED CIRCUIT PACKAGES
- Publication number 20180284187
- Publication date Oct 4, 2018
- Xilinx, Inc.
- Gamal Refai-Ahmed
- G01 - MEASURING TESTING
Information Patent Application
METHODS OF INTERCONNECT FOR HIGH DENSITY 2.5D AND 3D INTEGRATION
- Publication number 20180286826
- Publication date Oct 4, 2018
- Xilinx, Inc.
- Jaspreet Singh Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR ASSEMBLING AND TESTING A MULTI-INTEGRATED...
- Publication number 20180144963
- Publication date May 24, 2018
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED SILICON PACKAGE ASSEMBLY HAVING AN ENHANCED LID
- Publication number 20170092619
- Publication date Mar 30, 2017
- Xilinx, Inc.
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SILICON SUBSTRATE-LESS CHIP PACKAGING
- Publication number 20160064328
- Publication date Mar 3, 2016
- Xilinx, Inc.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CORE ORGANIC PACKAGE SUBSTRATE
- Publication number 20140262440
- Publication date Sep 18, 2014
- Xilinx, Inc.
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE-LESS INTERPOSER TECHNOLOGY FOR A STACKED SILICON INTERCON...
- Publication number 20140252599
- Publication date Sep 11, 2014
- Xilinx, Inc.
- Woon-Seong Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Suresh Ramalingam

Person

Patents Grantslast 30 patents

Chip package with near-die integrated passive device

Fanout integration for stacked silicon package assembly

Heterogeneous integration module comprising thermal management appa...

Radome with integrated passive cooling

Stacked silicon package assembly having vertical thermal management

Thermal enablement of dies with impurity gettering

Remote active cooling heat exchanger and antenna system with the same

Package integration for laterally mounted IC dies with dissimilar s...

Thermal heat spreader plate for electronic device

Stacked silicon package assembly having thermal management

Three-dimensional thermal management apparatuses for electronic dev...

Force balanced package mounting

Chip package assembly with enhanced solder resist crack resistance

Modular stacked silicon package assembly

Chip package assembly with stress decoupled interconnect layer

Micro device with through PCB cooling

Chip package assembly with enhanced interconnects and method for fa...

Stacked silicon package assembly having thermal management using ph...

Stacked silicon package assembly having thermal management

Integrated electrical/optical interface with two-tiered packaging

Method and apparatus of package enabled ESD protection

Chip scale package (CSP) including shim die

Electronic device apparatus with multiple thermally conductive path...

Integrated circuit die with in-chip heat sink

Methods of interconnect for high density 2.5D and 3D integration

Testing system for lid-less integrated circuit packages

Methods and apparatus for thermal interface material (TIM) bond lin...

Multi-chip silicon substrate-less chip packaging

Chip package assembly with enhanced interconnects and method for fa...

Stacked silicon package having a thermal capacitance element

Patents Applicationslast 30 patents

DEVICES, SYSTEMS, AND METHODS FOR A PROGRAMMABLE THREE-DIMENSIONAL...

FAN NOISE REDUCTION

PROTECTION APPARATUS FOR A PHOTONIC DEVICE

FRAME FOR COUPLING OF A THERMAL MANAGEMENT DEVICE TO A PRINTED CIRC...

THERMAL MANAGEMENT SYSTEM FOR ELECTRONIC DEVICE

FLOATING HEAT SPREADER WITH GUIDED MECHANISM

CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED DEVICES

CHIP PACKAGE WITH PASS THROUGH HEAT SPREADER

CHIP PACKAGE WITH DECOUPLED THERMAL MANAGEMENT

CHIP PACKAGE WITH NEAR-DIE INTEGRATED PASSIVE DEVICE

HEAT SPREADER FOR A SEMICONDUCTOR PACKAGE

MODULAR STACKED SILICON PACKAGE ASSEMBLY

HETEROGENEOUS INTEGRATION MODULE COMPRISING THERMAL MANAGEMENT APPA...

STACKED SILICON PACKAGE ASSEMBLY HAVING THERMAL MANAGEMENT

STACKED SILICON PACKAGE ASSEMBLY HAVING VERTICAL THERMAL MANAGEMENT

FANOUT INTEGRATION FOR STACKED SILICON PACKAGE ASSEMBLY

ELECTRONIC DEVICE APPARATUS WITH MULTIPLE THERMALLY CONDUCTIVE PATH...

STACKED SILICON PACKAGE ASSEMBLY HAVING THERMAL MANAGEMENT

CHIP PACKAGE ASSEMBLY WITH ENHANCED INTERCONNECTS AND METHOD FOR FA...

INTEGRATED CIRCUIT DIE WITH IN-CHIP HEAT SINK

CHIP SCALE PACKAGE (CSP) INCLUDING SHIM DIE

METHODS AND APPARATUS FOR THERMAL INTERFACE MATERIAL (TIM) BOND LIN...

DYNAMIC MOUNTING THERMAL MANAGEMENT FOR DEVICES ON BOARD

TESTING SYSTEM FOR LID-LESS INTEGRATED CIRCUIT PACKAGES

METHODS OF INTERCONNECT FOR HIGH DENSITY 2.5D AND 3D INTEGRATION

METHOD AND APPARATUS FOR ASSEMBLING AND TESTING A MULTI-INTEGRATED...

STACKED SILICON PACKAGE ASSEMBLY HAVING AN ENHANCED LID

MULTI-CHIP SILICON SUBSTRATE-LESS CHIP PACKAGING

MULTI-LAYER CORE ORGANIC PACKAGE SUBSTRATE

SUBSTRATE-LESS INTERPOSER TECHNOLOGY FOR A STACKED SILICON INTERCON...