Suryanarayana Kaja

Person

Hopewell Junction, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process and apparatus for electroplating microscopic features unifo...
- Patent number 6,669,833
- Issue date Dec 30, 2003
- International Business Machines Corporation
- Suryanarayana Kaja
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device produced by a process of controlling grain growth in metal f...
- Patent number 6,638,374
- Issue date Oct 28, 2003
- International Business Machines Corporation
- Patrick W. DeHaven
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of top-surface-metallurgy plate-up bonding and rewiring for...
- Patent number 6,455,331
- Issue date Sep 24, 2002
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of controlling grain growth in metal films
- Patent number 6,361,627
- Issue date Mar 26, 2002
- International Business Machines Corporation
- Patrick W. DeHaven
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and structure to prevent distortion and expansion of organic...
- Patent number 6,329,609
- Issue date Dec 11, 2001
- International Business Machines Corporation
- Suryanarayana Kaja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density pluggable connector array and process thereof
- Patent number 6,271,111
- Issue date Aug 7, 2001
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top-surface-metallurgy plate-up bonding and rewiring for multilayer...
- Patent number 6,248,599
- Issue date Jun 19, 2001
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electroplating a film onto a substrate
- Patent number 6,241,868
- Issue date Jun 5, 2001
- International Business Machines Corporation
- Glen N. Biggs
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Direct brazing of refractory metal features
- Patent number 6,131,796
- Issue date Oct 17, 2000
- International Business Machines Corporation
- Suryanarayana Kaja
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of controlling grain growth in metal films
- Patent number 6,126,761
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Patrick W. DeHaven
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for making electrical contact to a substrate d...
- Patent number 6,077,405
- Issue date Jun 20, 2000
- International Business Machines Corporation
- Glen N. Biggs
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Top-surface-metallurgy plate-up bonding and rewiring for multilayer...
- Patent number 6,048,741
- Issue date Apr 11, 2000
- International Business Machines Corporation
- Roy Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing processes on features with electricity
- Patent number 5,985,128
- Issue date Nov 16, 1999
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of performing processes on features with electricity
- Patent number 5,935,404
- Issue date Aug 10, 1999
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capped copper electrical interconnects
- Patent number 5,898,222
- Issue date Apr 27, 1999
- International Business Machines Corporation
- Mukta Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of selectively depositing a metallic layer on a ceramic subs...
- Patent number 5,787,578
- Issue date Aug 4, 1998
- International Business Machines Corporation
- Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capped copper electrical interconnects
- Patent number 5,705,857
- Issue date Jan 6, 1998
- International Business Machines Corporation
- Mukta Shaji Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming capped copper electrical interconnects
- Patent number 5,549,808
- Issue date Aug 27, 1996
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capped copper electrical interconnects
- Patent number 5,545,927
- Issue date Aug 13, 1996
- International Business Machines Corporation
- Mukta S. Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module input-output pad having stepped set-back
- Patent number 5,483,105
- Issue date Jan 9, 1996
- International Business Machines Corporation
- Suryanarayana Kaja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer interconnect systems
- Patent number 5,453,642
- Issue date Sep 26, 1995
- International Business Machines Corporation
- Suryanarayana Kaja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating improved multilayer interconnect systems
- Patent number 5,382,447
- Issue date Jan 17, 1995
- International Business Machines Corporation
- Suryanarayana Kaja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium sulfate solution for the selective seeding of the metal i...
- Patent number 5,380,560
- Issue date Jan 10, 1995
- International Business Machines Corporation
- Suryanarayana Kaja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PROCESS AND APPARATUS FOR ELECTROPLATING MICROSCOPIC FEATURES UNIFO...
- Publication number 20030168340
- Publication date Sep 11, 2003
- Suryanarayana Kaja
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Device produced by a process of controlling grain growth in metal f...
- Publication number 20020129879
- Publication date Sep 19, 2002
- Patrick W. DeHaven
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Suryanarayana Kaja

Person

Patents Grantslast 30 patents

Process and apparatus for electroplating microscopic features unifo...

Device produced by a process of controlling grain growth in metal f...

Process of top-surface-metallurgy plate-up bonding and rewiring for...

Process of controlling grain growth in metal films

Method and structure to prevent distortion and expansion of organic...

High density pluggable connector array and process thereof

Top-surface-metallurgy plate-up bonding and rewiring for multilayer...

Method for electroplating a film onto a substrate

Direct brazing of refractory metal features

Process of controlling grain growth in metal films

Method and apparatus for making electrical contact to a substrate d...

Top-surface-metallurgy plate-up bonding and rewiring for multilayer...

Method of performing processes on features with electricity

Method of performing processes on features with electricity

Capped copper electrical interconnects

Method of selectively depositing a metallic layer on a ceramic subs...

Capped copper electrical interconnects

Method for forming capped copper electrical interconnects

Capped copper electrical interconnects

Module input-output pad having stepped set-back

Multilayer interconnect systems

Process for fabricating improved multilayer interconnect systems

Palladium sulfate solution for the selective seeding of the metal i...

Patents Applicationslast 30 patents

PROCESS AND APPARATUS FOR ELECTROPLATING MICROSCOPIC FEATURES UNIFO...

Device produced by a process of controlling grain growth in metal f...