Susan F. Smith

Person

Olympia, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-surface heat sink suitable for multi-chip packages
- Patent number 11,495,518
- Issue date Nov 8, 2022
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip self adjusting cooling solution
- Patent number 10,141,241
- Issue date Nov 27, 2018
- Intel Corporation
- Jeffory L. Smalley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat sink coupling using flexible heat pipes for multi-surface comp...
- Patent number 9,935,033
- Issue date Apr 3, 2018
- Intel Corporation
- Susan F. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Socket loading element and associated techniques and configurations
- Patent number 9,848,510
- Issue date Dec 19, 2017
- Intel Corporation
- Vijaykumar Krithivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single base multi-floating surface cooling solution
- Patent number 9,806,003
- Issue date Oct 31, 2017
- Intel Corporation
- Jeffory L. Smalley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processor having frequency of operation information for guaranteed...
- Patent number 9,494,996
- Issue date Nov 15, 2016
- Intel Corporation
- Ankush Varma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Transient thermal management systems for semiconductor devices
- Patent number 9,142,482
- Issue date Sep 22, 2015
- Intel Corporation
- Sandeep Ahuja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor-based thermal specification enabling a real-time metric for...
- Patent number 9,116,050
- Issue date Aug 25, 2015
- Intel Corporation
- Sandeep Ahuja
- G01 - MEASURING TESTING
Information Patent Grant
Sensor-based thermal specification enabling a real-time metric for...
- Patent number 8,260,474
- Issue date Sep 4, 2012
- Intel Corporation
- Sandeep Ahuja
- G01 - MEASURING TESTING
Information Patent Grant
Hot plug cartridge assembly
- Patent number 6,195,259
- Issue date Feb 27, 2001
- Intel Corporation
- Brian T. Whitman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-SURFACE HEAT SINK SUITABLE FOR MULTI-CHIP PACKAGES
- Publication number 20200251403
- Publication date Aug 6, 2020
- Intel Corporation
- Shrenik Kothari
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SELF ADJUSTING COOLING SOLUTION
- Publication number 20190067158
- Publication date Feb 28, 2019
- Intel Corporation
- Jeffory L. SMALLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE BASE MULTI-FLOATING SURFACE COOLING SOLUTION
- Publication number 20180040536
- Publication date Feb 8, 2018
- Intel Corporation
- Jeffory L. Smalley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE BASE MULTI-FLOATING SURFACE COOLING SOLUTION
- Publication number 20170221793
- Publication date Aug 3, 2017
- Intel Corporation
- Jeffory L. Smalley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP SELF ADJUSTING COOLING SOLUTION
- Publication number 20160276243
- Publication date Sep 22, 2016
- Jeffory L. SMALLEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET LOADING ELEMENT AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS
- Publication number 20160183375
- Publication date Jun 23, 2016
- Intel Corporation
- Vijaykumar Krithivasan
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Sink Coupling Using Flexible Heat Pipes for Multi-Surface Comp...
- Publication number 20160118315
- Publication date Apr 28, 2016
- Intel Corporation
- Susan F. Smith
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GASKETTED THERMAL INTERFACE
- Publication number 20150184053
- Publication date Jul 2, 2015
- SHANKAR KRISHNAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSOR HAVING FREQUENCY OF OPERATION INFORMATION FOR GUARANTEED...
- Publication number 20140281445
- Publication date Sep 18, 2014
- Ankush Varma
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSIENT THERMAL MANAGEMENT SYSTEMS FOR SEMICONDUCTOR DEVICES
- Publication number 20130329358
- Publication date Dec 12, 2013
- Sandeep Ahuja
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSOR-BASED THERMAL SPECIFICATION ENABLING A REAL-TIME METRIC FOR...
- Publication number 20130060399
- Publication date Mar 7, 2013
- Sandeep Ahuja
- G01 - MEASURING TESTING
Information Patent Application
Sensor-Based Thermal Specification Enabling a Real-Time Metric for...
- Publication number 20110077794
- Publication date Mar 31, 2011
- Sandeep Ahuja
- G01 - MEASURING TESTING

Susan F. Smith

Person

Patents Grantslast 30 patents

Multi-surface heat sink suitable for multi-chip packages

Multi-chip self adjusting cooling solution

Heat sink coupling using flexible heat pipes for multi-surface comp...

Socket loading element and associated techniques and configurations

Single base multi-floating surface cooling solution

Processor having frequency of operation information for guaranteed...

Transient thermal management systems for semiconductor devices

Sensor-based thermal specification enabling a real-time metric for...

Sensor-based thermal specification enabling a real-time metric for...

Hot plug cartridge assembly

Patents Applicationslast 30 patents

MULTI-SURFACE HEAT SINK SUITABLE FOR MULTI-CHIP PACKAGES

MULTI-CHIP SELF ADJUSTING COOLING SOLUTION

SINGLE BASE MULTI-FLOATING SURFACE COOLING SOLUTION

SINGLE BASE MULTI-FLOATING SURFACE COOLING SOLUTION

MULTI-CHIP SELF ADJUSTING COOLING SOLUTION

SOCKET LOADING ELEMENT AND ASSOCIATED TECHNIQUES AND CONFIGURATIONS

Heat Sink Coupling Using Flexible Heat Pipes for Multi-Surface Comp...

GASKETTED THERMAL INTERFACE

PROCESSOR HAVING FREQUENCY OF OPERATION INFORMATION FOR GUARANTEED...

TRANSIENT THERMAL MANAGEMENT SYSTEMS FOR SEMICONDUCTOR DEVICES

SENSOR-BASED THERMAL SPECIFICATION ENABLING A REAL-TIME METRIC FOR...

Sensor-Based Thermal Specification Enabling a Real-Time Metric for...