Susan H. Downey

Person

Austin, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for providing structural support for interconn...
- Patent number 7,626,276
- Issue date Dec 1, 2009
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for providing structural support for interconn...
- Patent number 7,241,636
- Issue date Jul 10, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged IC using insulated wire
- Patent number 7,138,328
- Issue date Nov 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged integrated circuit having wire bonds and method therefor
- Patent number 7,015,585
- Issue date Mar 21, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductive device including bond wires
- Patent number 6,998,952
- Issue date Feb 14, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a bond pad and method therefor
- Patent number 6,921,979
- Issue date Jul 26, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a wire bond pad and method therefor
- Patent number 6,846,717
- Issue date Jan 25, 2005
- FREESCALE SEMICONDUCTOR, INC.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die I/O cells
- Patent number 6,717,270
- Issue date Apr 6, 2004
- Motorola, Inc.
- Harold A. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a wire bond pad and method therefor
- Patent number 6,614,091
- Issue date Sep 2, 2003
- Motorola, Inc.
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flux composition and corresponding soldering method
- Patent number 5,615,827
- Issue date Apr 1, 1997
- International Business Machines Corporation
- Roy L. Arldt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux composition and corresponding soldering method
- Patent number 5,531,838
- Issue date Jul 2, 1996
- International Business Machines Corporation
- Roy L. Arldt
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR PROVIDING STRUCTURAL SUPPORT FOR INTERCONN...
- Publication number 20070210442
- Publication date Sep 13, 2007
- FREESCALE SEMICONDUCTOR, INC.
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for providing structural support for interconn...
- Publication number 20060154469
- Publication date Jul 13, 2006
- Kevin J. Hess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inductive device including bond wires
- Publication number 20050122198
- Publication date Jun 9, 2005
- Yaping Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC using insulated wire
- Publication number 20040217458
- Publication date Nov 4, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged IC using insulated wire
- Publication number 20040119172
- Publication date Jun 24, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged integrated circuit having wire bonds and method therefor
- Publication number 20040119168
- Publication date Jun 24, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a wire bond pad and method therefor
- Publication number 20040036174
- Publication date Feb 26, 2004
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A WIRE BOND PAD AND METHOD THEREFOR
- Publication number 20030173637
- Publication date Sep 18, 2003
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a bond pad and method therefor
- Publication number 20030173668
- Publication date Sep 18, 2003
- Susan H. Downey
- H01 - BASIC ELECTRIC ELEMENTS

Susan H. Downey

Person

Patents Grantslast 30 patents

Method and apparatus for providing structural support for interconn...

Method and apparatus for providing structural support for interconn...

Packaged IC using insulated wire

Packaged integrated circuit having wire bonds and method therefor

Inductive device including bond wires

Semiconductor device having a bond pad and method therefor

Semiconductor device having a wire bond pad and method therefor

Integrated circuit die I/O cells

Semiconductor device having a wire bond pad and method therefor

Flux composition and corresponding soldering method

Flux composition and corresponding soldering method

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR PROVIDING STRUCTURAL SUPPORT FOR INTERCONN...

Method and apparatus for providing structural support for interconn...

Inductive device including bond wires

Packaged IC using insulated wire

Packaged IC using insulated wire

Packaged integrated circuit having wire bonds and method therefor

Semiconductor device having a wire bond pad and method therefor

SEMICONDUCTOR DEVICE HAVING A WIRE BOND PAD AND METHOD THEREFOR

Semiconductor device having a bond pad and method therefor