SUSUMU SAWADA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Tactile sensor that includes two sheets each having at least either...
- Patent number 10,365,172
- Issue date Jul 30, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Tomita
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Flexible touch sensor and method of manufacturing the same
- Patent number 10,228,806
- Issue date Mar 12, 2019
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Tomita
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible substrate including stretchable sheet
- Patent number 9,844,133
- Issue date Dec 12, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihiro Tomita
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component package and method for manufacturing the same
- Patent number 9,825,209
- Issue date Nov 21, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Kazuma Mima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible optical substrate
- Patent number 9,678,272
- Issue date Jun 13, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Susumu Sawada
- G02 - OPTICS
Information Patent Grant
Light-emitting device and method for manufacturing the same
- Patent number 9,627,583
- Issue date Apr 18, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Susumu Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for manufacturing same
- Patent number 9,595,651
- Issue date Mar 14, 2017
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Yoshihisa Yamashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,449,937
- Issue date Sep 20, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for manufacturing same
- Patent number 9,449,944
- Issue date Sep 20, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Susumu Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method for manufacturing the same
- Patent number 9,425,122
- Issue date Aug 23, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic part package
- Patent number 9,373,762
- Issue date Jun 21, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Susumu Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component package and method of manufacturing same
- Patent number 9,368,469
- Issue date Jun 14, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate composite and method for manufacturing ceramic su...
- Patent number 9,320,155
- Issue date Apr 19, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Taiji Kuroiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Built-up substrate, method for manufacturing same, and semiconducto...
- Patent number 9,236,338
- Issue date Jan 12, 2016
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Seiichi Nakatani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for connecting between substrates, flip-chip mounting struct...
- Patent number 8,501,583
- Issue date Aug 6, 2013
- Panasonic Corporation
- Takashi Kitae
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump forming method using self-assembling resin and a wall surface
- Patent number 8,297,488
- Issue date Oct 30, 2012
- Panasonic Corporation
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having semiconductor elements formed inside a...
- Patent number 8,288,778
- Issue date Oct 16, 2012
- Panasonic Corporation
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor having an organic semiconductor with a hollow space
- Patent number 8,193,526
- Issue date Jun 5, 2012
- Panasonic Corporation
- Seiichi Nakatani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Flip chip connection structure having powder-like conductive substa...
- Patent number 8,097,958
- Issue date Jan 17, 2012
- Panasonic Corporation
- Susumu Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Parallel differential transmission lines having an opposing groundi...
- Patent number 8,040,200
- Issue date Oct 18, 2011
- Panasonic Corporation
- Akira Minegishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mutually connecting substrates, flip chip mounting body,...
- Patent number 7,919,357
- Issue date Apr 5, 2011
- Panasonic Corporation
- Susumu Sawada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive resin composition, connection method between electrodes...
- Patent number 7,714,444
- Issue date May 11, 2010
- Panasonic Corporation
- Seiichi Nakatani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive resin composition, connection method between electrodes...
- Patent number 7,537,961
- Issue date May 26, 2009
- Panasonic Corporation
- Seiichi Nakatani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
TACTILE SENSOR THAT INCLUDES TWO SHEETS EACH HAVING AT LEAST EITHER...
- Publication number 20180356301
- Publication date Dec 13, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- YOSHIHIRO TOMITA
- G01 - MEASURING TESTING
Information Patent Application
BIOLOGICAL SENSOR FOR OBTAINING INFORMATION ON LIVING BODY
- Publication number 20180338719
- Publication date Nov 29, 2018
- Panasonic Intellectual Property Management Co., Ltd.
- YOSHIHIRO TOMITA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
FLEXIBLE TOUCH SENSOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170300147
- Publication date Oct 19, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- Yoshihiro TOMITA
- G01 - MEASURING TESTING
Information Patent Application
SUBSTRATE INCLUDING STRETCHABLE SHEET
- Publication number 20170181276
- Publication date Jun 22, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- SUSUMU SAWADA
- B32 - LAYERED PRODUCTS
Information Patent Application
FLEXIBLE SUBSTRATE INCLUDING STRETCHABLE SHEET
- Publication number 20170181277
- Publication date Jun 22, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- YOSHIHIRO TOMITA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL CONTENT DISPLAY SYSTEM
- Publication number 20170090848
- Publication date Mar 30, 2017
- Panasonic Intellectual Property Management Co., Ltd.
- YOSHIHIRO TOMITA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FLEXIBLE OPTICAL SUBSTRATE
- Publication number 20160356957
- Publication date Dec 8, 2016
- Panasonic Intellectual Property Management Co., Ltd.
- SUSUMU SAWADA
- G02 - OPTICS
Information Patent Application
ELECTRONIC PART PACKAGE
- Publication number 20150364661
- Publication date Dec 17, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- SUSUMU SAWADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, AND BODY HAVI...
- Publication number 20150280093
- Publication date Oct 1, 2015
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO, LTD
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150236233
- Publication date Aug 20, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Yoshihisa Yamashita
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME
- Publication number 20150228619
- Publication date Aug 13, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Susumu Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR PRODUCING SAME
- Publication number 20150221842
- Publication date Aug 6, 2015
- Panasonic Intellectual Property Management Co., Lt
- Kazuma Mima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150214129
- Publication date Jul 30, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME
- Publication number 20150155251
- Publication date Jun 4, 2015
- Panasonic Intellectual Property Management Co., Ltd.
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME
- Publication number 20150084080
- Publication date Mar 26, 2015
- PANASONIC CORPORATION
- Koji Kawakita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20150076545
- Publication date Mar 19, 2015
- Panasonic Intellectual Property Management Co., Lt
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150008467
- Publication date Jan 8, 2015
- Susumu Sawada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBSTRATE COMPOSITE AND METHOD FOR MANUFACTURING CERAMIC SU...
- Publication number 20140131076
- Publication date May 15, 2014
- PANASONIC CORPORATION
- Taiji Kuroiwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUILT-UP SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTO...
- Publication number 20140124777
- Publication date May 8, 2014
- PANASONIC CORPORATION
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE D...
- Publication number 20110204366
- Publication date Aug 25, 2011
- PANASONIC CORPORATION
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE D...
- Publication number 20110204367
- Publication date Aug 25, 2011
- PANASONIC CORPORATION
- Seiichi Nakatani
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR CONNECTING BETWEEN SUBSTRATES, FLIP-CHIP MOUNTING STRUCT...
- Publication number 20100007033
- Publication date Jan 14, 2010
- Takashi KITAE
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...
- Publication number 20100001411
- Publication date Jan 7, 2010
- Susumu SAWADA
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
DIFFERENTIAL TRANSMISSION LINE INCLUDING TWO TRANSMISSION LINES PAR...
- Publication number 20090315649
- Publication date Dec 24, 2009
- Akira MINEGISHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES...
- Publication number 20090200522
- Publication date Aug 13, 2009
- PANASONIC CORPORATION
- Seiichi NAKATANI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME
- Publication number 20090102064
- Publication date Apr 23, 2009
- PANASONIC CORPORATION
- Susumu Sawada
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
- Publication number 20090078746
- Publication date Mar 26, 2009
- Seiji Karashima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Component Mounted Body, Electronic Component with Solder...
- Publication number 20090008776
- Publication date Jan 8, 2009
- Takashi Kitae
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES...
- Publication number 20070216023
- Publication date Sep 20, 2007
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

SUSUMU SAWADA

Person

Patents Grantslast 30 patents

Tactile sensor that includes two sheets each having at least either...

Flexible touch sensor and method of manufacturing the same

Flexible substrate including stretchable sheet

Electronic component package and method for manufacturing the same

Flexible optical substrate

Light-emitting device and method for manufacturing the same

Electronic component package and method for manufacturing same

Semiconductor device and method for manufacturing the same

Electronic component package and method for manufacturing same

Electronic component package and method for manufacturing the same

Electronic part package

Electronic component package and method of manufacturing same

Ceramic substrate composite and method for manufacturing ceramic su...

Built-up substrate, method for manufacturing same, and semiconducto...

Method for connecting between substrates, flip-chip mounting struct...

Bump forming method using self-assembling resin and a wall surface

Semiconductor device having semiconductor elements formed inside a...

Transistor having an organic semiconductor with a hollow space

Flip chip connection structure having powder-like conductive substa...

Parallel differential transmission lines having an opposing groundi...

Method for mutually connecting substrates, flip chip mounting body,...

Conductive resin composition, connection method between electrodes...

Conductive resin composition, connection method between electrodes...

Patents Applicationslast 30 patents

TACTILE SENSOR THAT INCLUDES TWO SHEETS EACH HAVING AT LEAST EITHER...

BIOLOGICAL SENSOR FOR OBTAINING INFORMATION ON LIVING BODY

FLEXIBLE TOUCH SENSOR AND METHOD OF MANUFACTURING THE SAME

SUBSTRATE INCLUDING STRETCHABLE SHEET

FLEXIBLE SUBSTRATE INCLUDING STRETCHABLE SHEET

OPTICAL CONTENT DISPLAY SYSTEM

FLEXIBLE OPTICAL SUBSTRATE

ELECTRONIC PART PACKAGE

LIGHT EMITTING DEVICE, METHOD FOR MANUFACTURING SAME, AND BODY HAVI...

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR PRODUCING SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME

LIGHT EMITTING APPARATUS AND METHOD FOR MANUFACTURING SAME

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING SAME

LIGHT-EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME

CERAMIC SUBSTRATE COMPOSITE AND METHOD FOR MANUFACTURING CERAMIC SU...

BUILT-UP SUBSTRATE, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTO...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE D...

SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME AND IMAGE D...

METHOD FOR CONNECTING BETWEEN SUBSTRATES, FLIP-CHIP MOUNTING STRUCT...

METHOD FOR MUTUALLY CONNECTING SUBSTRATES, FLIP CHIP MOUNTING BODY,...

DIFFERENTIAL TRANSMISSION LINE INCLUDING TWO TRANSMISSION LINES PAR...

CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES...

CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME

BUMP FORMING METHOD AND BUMP FORMING APPARATUS

Electronic Component Mounted Body, Electronic Component with Solder...

CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES...