CONDUCTIVE RESIN COMPOSITION, CONNECTION METHOD BETWEEN ELECTRODES USING THE SAME, AND ELECTRIC CONNECTION METHOD BETWEEN ELECTRONIC COMPONENT AND CIRCUIT SUBSTRATE USING THE SAME

Abstract

The present invention provides a conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium includes a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other. Thereby, a flip chip packaging method that can be applied to flip chip packaging of LSI and has high productivity and high reliability is provided.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1C are views explaining states of mixing a conductive resin composition in one example of the present invention in a time series.

FIGS. 2A to 2E are cross-sectional views showing steps of a flip chip packaging method using a conductive resin composition in one example of the present invention.

FIGS. 3A to 3F are cross-sectional views showing steps of a flip chip packaging method in one example of the present invention.

FIG. 4 is a cross-sectional view showing a structure of a flip chip package obtained in one example of the present invention.

FIG. 5 is a cross-sectional view showing a structure of a flip chip package obtained in one example of the present invention.

FIG. 6 is a cross-sectional view showing a structure of a flip chip package obtained in one example of the present invention.

FIG. 7 is a cross-sectional view showing a structure of a flip chip package obtained in one example of the present invention.

Claims

1. A conductive resin composition for connecting electrodes electrically, in which metal particles are dispersed in a flowing medium, wherein the flowing medium comprises a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, andthe first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other.

2. The conductive resin composition according to claim 1, wherein the metal particles are dispersed in the first flowing medium and the second flowing medium when being mixed, the metal particles are dispersed in the first flowing medium in a stationary state, and the first flowing medium and the second flowing medium are in a state of being dispersed.

3. The conductive resin composition according to claim 1, wherein a surface tension of the first flowing medium is higher than a surface tension of the second flowing medium.

4. The conductive resin composition according to claim 1, wherein the first flowing medium is composed of a thermosetting resin, and the metal particles are made of a solder metal and have a melting point that is equal to or lower than a curing temperature of the thermosetting resin.

5. The conductive resin composition according to claim 1, wherein the first flowing medium is composed of a thermoplastic resin, and the second flowing medium is composed of a thermosetting resin.

6. The conductive resin composition according to claim 1, wherein the first flowing medium is composed of a thermosetting resin, and the second flowing medium is composed of a photocurable resin.

7. The conductive resin composition according to claim 1, wherein the first flowing medium or the second flowing medium is a liquid, and a solvent that can be solved in the first flowing medium or the second flowing medium is added.

8. The conductive resin composition according to claim 1, wherein the first flowing medium is oil, and the second flowing medium is water.

9. The conductive resin composition according to claim 1, wherein a content ratio of the metal fine particles, the first flowing medium and the second flowing medium is within ranges of: the metal particles: 4 wt % to 40 wt %;the first flowing medium: 10 wt % to 20 wt %; andthe second flowing medium: 40 wt % to 76 wt %.

10. The conductive resin composition according to claim 1, wherein an average volume particle diameter of the metal fine particles ranges from 1 μm to 30 μm.

11. An electric connection method between electrodes using a conductive resin composition in which metal particles are dispersed in a flowing medium, the connection method comprising:preparing the conductive resin composition in which the flowing medium comprises a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other;supplying the conductive resin composition between a plurality of electrodes that are arranged so as to face each other;disposing the first flowing medium in which the metal particles are dispersed between the plurality of the electrodes by utilizing the wettability between the electrodes and the first flowing medium;disposing the second flowing medium in other region; andself-aggregating the metal particles between the electrodes so as to achieve an electric connection selectively.

12. The connection method between electrodes according to claim 11, further comprising melting the metal particles after the self-aggregation.

13. The connection method between electrodes according to claim 11, further comprising forming an organic layer for decreasing the wettability in a part except for a part between the electrodes.

14. The connection method between electrodes according to claim 13, wherein the organic layer for decreasing the wettability is a water-repellent or oil-repellent organic layer that is made of a silicone-acrylic copolymer or a fluorine-acrylic copolymer.

15. An electric connection method between an electronic component and a circuit substrate for disposing a semiconductor chip having a plurality of electrode terminals so as to face the circuit substrate having a plurality of connection terminals, and electrically connecting the connection terminal of the circuit substrate and the electrode terminal of the semiconductor chip via a conductive resin composition, the electric connection method comprising:a first step of supplying the conductive resin composition in which a first flowing medium that has relatively high wettability with the metal particles and a second flowing medium that has relatively low wettability with the metal particles are included, and the first flowing medium and the second flowing medium are dispersed in a state of being incompatible with each other, and disposing the semiconductor chip on the circuit substrate to which the conductive resin composition is supplied so as to face each other at a predetermined gap, at a desired position of the connection terminal of the circuit substrate or the electrode terminal of the semiconductor chip;a second step of holding such that the first flowing medium in which the metal particles are dispersed is formed to be self-aggregated by an interfacial tension between the plurality of the electrode terminals and the plurality of the connection terminals that are arranged so as to face each other, and the second flowing medium is present in a region except for the plurality of the electrode terminals and the plurality of the connection terminals that are arranged so as to face each other, in a stationary state where the semiconductor chip and the circuit substrate face each other; anda third step of curing the conductive resin composition that is supplied between the circuit substrate and the semiconductor chip,wherein the connection terminal of the circuit substrate and the electrode terminal of the semiconductor chip are connected electrically by an aggregation of the metal particles contained in the self-aggregated first flowing medium.

16. The electric connection method between an electronic component and a circuit substrate according to claim 15, wherein the aggregation of the metal particles constitute the conductive resin composition by contacting the metal particles each other.

17. The electric connection method between an electronic component and a circuit substrate according to claim 15, further comprising a step of heating the conductive resin composition containing the aggregation of the metal particles that are self-aggregated between the connection terminal of the circuit substrate and the electrode terminal of the semiconductor chip so as to melt the metal particles that are contained in the first flowing medium, between the second step and the third step.

18. The electric connection method between an electronic component and a circuit substrate according to claim 15, wherein the first step is a step of arranging the connection terminal of the circuit substrate and the electrode terminal of the semiconductor chip so as to face each other at a desired gap, and supplying the conductive resin composition in which metal particles are contained in a flowing medium into a gap between the semiconductor chip and the circuit substrate.

19. The electric connection method between an electronic component and a circuit substrate according to claim 15, wherein, in the first step, a surface of the circuit substrate except for the connection terminal is subjected to water-repellent treatment or oil-repellent treatment in advance.