Membership
Tour
Register
Log in
Sven Albers
Follow
Person
Regensburg, DE
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor die package with more than one hanging die
Patent number
10,854,590
Issue date
Dec 1, 2020
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packages including an optical redistribution layer
Patent number
10,816,742
Issue date
Oct 27, 2020
Intel IP Corporation
Georg Seidemann
G02 - OPTICS
Information
Patent Grant
Electronic components having three-dimensional capacitors in a meta...
Patent number
10,741,486
Issue date
Aug 11, 2020
Intel Corporation
Klaus Reingruber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level package structure with internal conductive layer
Patent number
10,672,731
Issue date
Jun 2, 2020
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a variable redistribution layer thickness
Patent number
10,553,538
Issue date
Feb 4, 2020
Intel Corporation
Klaus Jürgen Reingruber
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Microelectronic package having a passive microelectronic device dis...
Patent number
10,522,454
Issue date
Dec 31, 2019
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electrical device and a method for forming an electrical device
Patent number
10,522,485
Issue date
Dec 31, 2019
Intel IP Corporation
Christian Geissler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Vertical wire connections for integrated circuit package
Patent number
10,490,527
Issue date
Nov 26, 2019
Intel IP Corporation
Christian Geissler
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Microelectronic package with illuminated backside exterior
Patent number
10,411,000
Issue date
Sep 10, 2019
Intel IP Corporation
Marc Stephan Dittes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
System-in-package devices and methods for forming system-in-package...
Patent number
10,403,609
Issue date
Sep 3, 2019
Intel IP Corporation
Christian Geissler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package configurations to reduce stiffness
Patent number
10,373,844
Issue date
Aug 6, 2019
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexible band wearable electronic device
Patent number
10,228,725
Issue date
Mar 12, 2019
Intel IP Corporation
Sven Albers
A44 - HABERDASHERY JEWELLERY
Information
Patent Grant
Integrated circuit packages including an optical redistribution layer
Patent number
10,209,466
Issue date
Feb 19, 2019
Intel IP Corporation
Georg Seidemann
G02 - OPTICS
Information
Patent Grant
Embedded die flip-chip package assembly
Patent number
10,128,205
Issue date
Nov 13, 2018
Intel Corporation
Thorsten Meyer
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Cooler for semiconductor devices
Patent number
10,121,726
Issue date
Nov 6, 2018
Intel IP Corporation
Sven Albers
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor package having a variable redistribution layer thickness
Patent number
10,115,668
Issue date
Oct 30, 2018
Intel IP Corporation
Klaus Jürgen Reingruber
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Microelectronic package having a passive microelectronic device dis...
Patent number
9,997,444
Issue date
Jun 12, 2018
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package-in-package
Patent number
9,985,005
Issue date
May 29, 2018
INTEL DEUTSCHLAND GMBH
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wearable computing device
Patent number
9,921,694
Issue date
Mar 20, 2018
Intel Corporation
Sven Albers
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Passive electrical devices with a polymer carrier
Patent number
9,888,577
Issue date
Feb 6, 2018
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package with coil formed on core
Patent number
9,865,387
Issue date
Jan 9, 2018
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flow diversion devices
Patent number
9,818,672
Issue date
Nov 14, 2017
Intel IP Corporation
Michael P. Skinner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layer lines
Patent number
9,741,651
Issue date
Aug 22, 2017
Intel IP Corportaion
Klaus Reingruber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional structures within mold compound
Patent number
9,711,492
Issue date
Jul 18, 2017
Intel Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Three dimensional structures within mold compound
Patent number
9,653,439
Issue date
May 16, 2017
Intel Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package configurations to reduce stiffness
Patent number
9,653,324
Issue date
May 16, 2017
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetic contacts
Patent number
9,601,468
Issue date
Mar 21, 2017
Intel Corporation
Michael P. Skinner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of forming stacked microelectronic dice embedded in a micro...
Patent number
9,564,400
Issue date
Feb 7, 2017
Intel Corporation
Reinhard Mahnkopf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Flexibly-wrapped integrated circuit die
Patent number
9,515,049
Issue date
Dec 6, 2016
Intel Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package configurations to reduce stiffness
Patent number
9,397,019
Issue date
Jul 19, 2016
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
WAFER LEVEL PACKAGE STRUCTURE WITH INTERNAL CONDUCTIVE LAYER
Publication number
20200273832
Publication date
Aug 27, 2020
Intel IP Corporation
Sven ALBERS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE WITH MORE THAN ONE HANGING DIE
Publication number
20200176436
Publication date
Jun 4, 2020
Intel IP Corporation
Sven ALBERS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EPLB/EWLB BASED POP FOR HBM OR CUSTOMIZED PACKAGE STACK
Publication number
20190206833
Publication date
Jul 4, 2019
Intel IP Corporation
Thorsten MEYER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL FIBER CONNECTION ON PACKAGE EDGE
Publication number
20190121041
Publication date
Apr 25, 2019
Intel IP Corporation
Sven Albers
G02 - OPTICS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING AN OPTICAL REDISTRIBUTION LAYER
Publication number
20190072732
Publication date
Mar 7, 2019
Intel IP Corporation
Georg Seidemann
G02 - OPTICS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING A VARIABLE REDISTRIBUTION LAYER THICKNESS
Publication number
20190043800
Publication date
Feb 7, 2019
Intel IP Corporation
Klaus Jürgen REINGRUBER
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
VERTICAL WIRE CONNECTIONS FOR INTEGRATED CIRCUIT PACKAGE
Publication number
20180374819
Publication date
Dec 27, 2018
Christian Geissler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WAFER LEVEL PACKAGE STRUCTURE WITH INTERNAL CONDUCTIVE LAYER
Publication number
20180358317
Publication date
Dec 13, 2018
Sven ALBERS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
System-in-Package Devices and Methods for Forming System-in-Package...
Publication number
20180331080
Publication date
Nov 15, 2018
Intel IP Corporation
Christian GEISSLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electrical device and a method for forming an electrical device
Publication number
20180331053
Publication date
Nov 15, 2018
Intel IP Corporation
Christian GEISSLER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STACKING USING CHIP TO WAFER BONDING
Publication number
20180331070
Publication date
Nov 15, 2018
Intel IP Corporation
Georg SEIDEMANN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DIS...
Publication number
20180286799
Publication date
Oct 4, 2018
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE WITH COIL FORMED ON CORE
Publication number
20180226185
Publication date
Aug 9, 2018
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WEARABLE COMPUTING DEVICE
Publication number
20180150156
Publication date
May 31, 2018
Intel Corporation
Sven Albers
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
FLEXIBLE BAND WEARABLE ELECTRONIC DEVICE
Publication number
20180092443
Publication date
Apr 5, 2018
Sven Albers
G01 - MEASURING TESTING
Information
Patent Application
FLEXIBLE BAND WEARABLE ELECTRONIC DEVICE
Publication number
20180095426
Publication date
Apr 5, 2018
Sven Albers
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
REDISTRIBUTION LAYER LINES
Publication number
20180068939
Publication date
Mar 8, 2018
Intel IP Corporation
Klaus Reingruber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE CONFIGURATIONS TO REDUCE STIFFNESS
Publication number
20170345678
Publication date
Nov 30, 2017
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES INCLUDING AN OPTICAL REDISTRIBUTION LAYER
Publication number
20170285280
Publication date
Oct 5, 2017
Intel IP Corporation
Georg Seidemann
G02 - OPTICS
Information
Patent Application
Microelectronic Package with Illuminated Backside Exterior
Publication number
20170284636
Publication date
Oct 5, 2017
Intel IP Corporation
Marc Stephan Dittes
F21 - LIGHTING
Information
Patent Application
MICROELECTRONIC INTERCONNECT ADAPTOR
Publication number
20170278778
Publication date
Sep 28, 2017
Intel Corporation
Christian Geissler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC COMPONENTS HAVING THREE-DIMENSIONAL CAPACITORS IN A META...
Publication number
20170256480
Publication date
Sep 7, 2017
Intel IP Corporation
Klaus Reingruber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDISTRIBUTION LAYER LINES
Publication number
20170243815
Publication date
Aug 24, 2017
Intel IP Corporation
Klaus Reingruber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING A VARIABLE REDISTRIBUTION LAYER THICKNESS
Publication number
20170170111
Publication date
Jun 15, 2017
Intel IP Corporation
Klaus Jürgen REINGRUBER
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
ELECTRONIC PACKAGE WITH COIL FORMED ON CORE
Publication number
20170162314
Publication date
Jun 8, 2017
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COOLER FOR SEMICONDUCTOR DEVICES
Publication number
20170062306
Publication date
Mar 2, 2017
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DIS...
Publication number
20160358848
Publication date
Dec 8, 2016
Intel Corporation
Thorsten Meyer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THREE DIMENSIONAL STRUCTURES WITHIN MOLD COMPOUND
Publication number
20160358897
Publication date
Dec 8, 2016
Intel Corporation
Sven ALBERS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE CONFIGURATIONS TO REDUCE STIFFNESS
Publication number
20160293453
Publication date
Oct 6, 2016
Intel IP Corporation
Sven Albers
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAGNETIC CONTACTS
Publication number
20160247785
Publication date
Aug 25, 2016
Intel Corporation
Michael P. Skinner
H01 - BASIC ELECTRIC ELEMENTS