Sven Schmidbauer

Person

Dresden, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a layer stack, semiconductor arrangemen...
- Patent number 12,159,854
- Issue date Dec 3, 2024
- Infineon Technologies Austria AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, semiconductor arrangement and method for prod...
- Patent number 11,887,961
- Issue date Jan 30, 2024
- Infineon Technologies Austria AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device having a power metal...
- Patent number 10,978,395
- Issue date Apr 13, 2021
- Infineon Technologies Austria AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power metallization structure for semiconductor devices
- Patent number 10,734,320
- Issue date Aug 4, 2020
- Infineon Technologies Austria AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode, an electronic device, and a method for manufacturing an...
- Patent number 10,044,005
- Issue date Aug 7, 2018
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrode, an electronic device, and a method for manufacturing an...
- Patent number 9,419,181
- Issue date Aug 16, 2016
- Infineon Technologies Dresden GmbH
- Dirk Meinhold
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods for fabricating integrated circuits with narrow, metal fill...
- Patent number 8,652,890
- Issue date Feb 18, 2014
- GLOBALFOUNDRIES, INC.
- Sven Schmidbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit comprising an amorphous region and method of man...
- Patent number 7,825,013
- Issue date Nov 2, 2010
- Qimonda AG
- Matthias Goldbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an integrated circuit including a transistor
- Patent number 7,718,475
- Issue date May 18, 2010
- Qimonda AG
- Matthias Goldbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for controlling a thickness of a first layer and method for...
- Patent number 7,341,950
- Issue date Mar 11, 2008
- Infineon Technologies AG
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing aluminum-filled contact holes
- Patent number 7,214,610
- Issue date May 8, 2007
- Infineon Technologies AG
- Jens Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making contact with a doping region of a semiconductor c...
- Patent number 6,855,630
- Issue date Feb 15, 2005
- Infineon Technologies AG
- Alexander Ruf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating an interconnect for contact holes
- Patent number 6,602,788
- Issue date Aug 5, 2003
- Infineon Technologies AG
- Axel Bürke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for depositing a two-layer diffusion barrier
- Patent number 6,579,786
- Issue date Jun 17, 2003
- Infineon Technologies AG
- Sven Schmidbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing metal-containing layers
- Patent number 6,403,473
- Issue date Jun 11, 2002
- Infineon Technologies AG
- Sven Schmidbauer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for fabricating a contact layer
- Patent number 6,365,510
- Issue date Apr 2, 2002
- Infineon Technologies AG
- Sven Schmidbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a microelectronic structure
- Patent number 6,221,757
- Issue date Apr 24, 2001
- Infineon Technologies AG
- Sven Schmidbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal line deposition process
- Patent number 6,136,709
- Issue date Oct 24, 2000
- Infineon Technologies North America Corp.
- Sven Schmidbauer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Having a Layer Stack, Semiconductor Arrangemen...
- Publication number 20240128226
- Publication date Apr 18, 2024
- Infineon Technologies Austria AG
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device, Semiconductor Arrangement and Method for Prod...
- Publication number 20220285307
- Publication date Sep 8, 2022
- Paul Frank
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device Having a Power Metal...
- Publication number 20200335448
- Publication date Oct 22, 2020
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Metallization Structure for Semiconductor Devices
- Publication number 20200035610
- Publication date Jan 30, 2020
- Infineon Technologies Austria AG
- Ravi Keshav Joshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE, AN ELECTRONIC DEVICE, AND A METHOD FOR MANUFACTURING AN...
- Publication number 20160322610
- Publication date Nov 3, 2016
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRODE, AN ELECTRONIC DEVICE, AND A METHOD FOR MANUFACTURING AN...
- Publication number 20140332759
- Publication date Nov 13, 2014
- INFINEON TECHNOLOGIES DRESDEN GMBH
- Dirk Meinhold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH NARROW, METAL FILL...
- Publication number 20130224927
- Publication date Aug 29, 2013
- GLOBALFOUNDRIES INC.
- Sven Schmidbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System Including Memory with Resistivity Changing Material and Meth...
- Publication number 20090050873
- Publication date Feb 26, 2009
- QIMONDA AG
- Ulrich Baier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Comprising an Amorphous Region and Method of Man...
- Publication number 20080283832
- Publication date Nov 20, 2008
- Matthias Goldbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a transistor
- Publication number 20080251815
- Publication date Oct 16, 2008
- Matthias Goldbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication method for an integrated circuit structure
- Publication number 20080124920
- Publication date May 29, 2008
- Clemens Fitz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20080116494
- Publication date May 22, 2008
- Matthias Goldbach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for controlling a thickness of a first layer and method for...
- Publication number 20070125748
- Publication date Jun 7, 2007
- Infineon Technologies AG
- Yi-Jen Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor device
- Publication number 20060228876
- Publication date Oct 12, 2006
- Infineon Technologies AG
- Olaf Storbeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gate structure for a transistor and method for fabricating the gate...
- Publication number 20050202617
- Publication date Sep 15, 2005
- Jens Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for producing aluminum-filled contact holes
- Publication number 20040242007
- Publication date Dec 2, 2004
- Jens Hahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for depositing a two-layer diffusion barrier
- Publication number 20020086527
- Publication date Jul 4, 2002
- Sven Schmidbauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for fabricating an interconnect for contact holes
- Publication number 20020006720
- Publication date Jan 17, 2002
- Axel Burke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a contact layer
- Publication number 20010027012
- Publication date Oct 4, 2001
- Sven Schmidbauer
- H01 - BASIC ELECTRIC ELEMENTS

Sven Schmidbauer

Person

Patents Grantslast 30 patents

Semiconductor device having a layer stack, semiconductor arrangemen...

Semiconductor device, semiconductor arrangement and method for prod...

Method of manufacturing a semiconductor device having a power metal...

Power metallization structure for semiconductor devices

Electrode, an electronic device, and a method for manufacturing an...

Electrode, an electronic device, and a method for manufacturing an...

Methods for fabricating integrated circuits with narrow, metal fill...

Integrated circuit comprising an amorphous region and method of man...

Method for manufacturing an integrated circuit including a transistor

Method for controlling a thickness of a first layer and method for...

Process for producing aluminum-filled contact holes

Method for making contact with a doping region of a semiconductor c...

Process for fabricating an interconnect for contact holes

Method for depositing a two-layer diffusion barrier

Process for producing metal-containing layers

Method for fabricating a contact layer

Method of making a microelectronic structure

Metal line deposition process

Patents Applicationslast 30 patents

Semiconductor Device Having a Layer Stack, Semiconductor Arrangemen...

Semiconductor Device, Semiconductor Arrangement and Method for Prod...

Method of Manufacturing a Semiconductor Device Having a Power Metal...

Power Metallization Structure for Semiconductor Devices

ELECTRODE, AN ELECTRONIC DEVICE, AND A METHOD FOR MANUFACTURING AN...

ELECTRODE, AN ELECTRONIC DEVICE, AND A METHOD FOR MANUFACTURING AN...

METHODS FOR FABRICATING INTEGRATED CIRCUITS WITH NARROW, METAL FILL...

System Including Memory with Resistivity Changing Material and Meth...

Integrated Circuit Comprising an Amorphous Region and Method of Man...

Method for manufacturing a transistor

Fabrication method for an integrated circuit structure

Method for manufacturing a semiconductor device

Method for controlling a thickness of a first layer and method for...

Method of manufacturing a semiconductor device

Gate structure for a transistor and method for fabricating the gate...

Process for producing aluminum-filled contact holes

Method for depositing a two-layer diffusion barrier

Process for fabricating an interconnect for contact holes

Method for fabricating a contact layer