Syota MIKI

Person

Nagano, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pad structure and mounted structure
- Patent number 9,392,703
- Issue date Jul 12, 2016
- Shinko Electric Industries Co., Ltd.
- Masaki Sanada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device, semiconductor package, and method for manufac...
- Patent number 8,987,902
- Issue date Mar 24, 2015
- Shinko Electric Industries Co., Ltd.
- Syota Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a silicon reinforcing member embedded...
- Patent number 8,779,573
- Issue date Jul 15, 2014
- Shinko Electric Industries Co., Ltd.
- Syota Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,330,279
- Issue date Dec 11, 2012
- Shinko Electric Industries Co., Ltd.
- Syota Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 8,299,586
- Issue date Oct 30, 2012
- Shinko Electric Industries Co., Ltd.
- Takaharu Yamano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component mounting package
- Patent number 8,143,531
- Issue date Mar 27, 2012
- Shinko Electric Industries Co., Ltd.
- Syota Miki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 8,008,123
- Issue date Aug 30, 2011
- Shinko Electric Industries Co., Ltd.
- Syota Miki
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PAD STRUCTURE AND MOUNTED STRUCTURE
- Publication number 20140374149
- Publication date Dec 25, 2014
- Masaki SANADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...
- Publication number 20130161813
- Publication date Jun 27, 2013
- Shinko Electric Industries Co., LTD.
- Syota Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20120153507
- Publication date Jun 21, 2012
- Shinko Electric Industries Co., Ltd.
- Syota MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGES AND A SEMICONDUCTOR...
- Publication number 20110316152
- Publication date Dec 29, 2011
- Shinko Electric Industries Co., Ltd.
- Syota Miki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110260339
- Publication date Oct 27, 2011
- Shinko Electric Industries Co., Ltd.
- Syota MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
- Publication number 20110151645
- Publication date Jun 23, 2011
- Shinko Electric Industries Co., Ltd.
- Syota MIKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110095404
- Publication date Apr 28, 2011
- Shinko Electric Industries Co., Ltd.
- Takaharu YAMANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT MOUNTING PACKAGE
- Publication number 20090145636
- Publication date Jun 11, 2009
- Shinko Electric Industries Co., Ltd.
- Syota MIKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Pad structure and mounted structure

Semiconductor device, semiconductor package, and method for manufac...

Semiconductor package having a silicon reinforcing member embedded...

Semiconductor device

Semiconductor device and method of manufacturing the same

Electronic component mounting package

Manufacturing method of semiconductor device

Patents Applicationslast 30 patents

PAD STRUCTURE AND MOUNTED STRUCTURE

SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND METHOD FOR MANUFAC...

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGES AND A SEMICONDUCTOR...

SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC COMPONENT MOUNTING PACKAGE