Syuichiro Yamamoto

Person

Chuo-ku, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Production method of electronic parts and water treatment apparatus
- Patent number 6,749,183
- Issue date Jun 15, 2004
- TDK Corporation
- Masashi Gotoh
- C02 - TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
Information Patent Grant
Circuit board having bonding areas to be joined with bumps by ultra...
- Patent number 6,730,858
- Issue date May 4, 2004
- TDK Corporation
- Masashi Gotoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Production method of electronic parts and water treatment apparatus
- Patent number 6,471,783
- Issue date Oct 29, 2002
- TDK Corporation
- Masashi Gotoh
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Electronic part and manufacturing method therefor
- Patent number 6,320,739
- Issue date Nov 20, 2001
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin package fabrication process
- Patent number 6,282,781
- Issue date Sep 4, 2001
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a substrate having electrode arcs for conne...
- Patent number 6,263,565
- Issue date Jul 24, 2001
- TDK Corporation
- Masashi Gotoh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and process for the production thereof
- Patent number 6,204,454
- Issue date Mar 20, 2001
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Production method of electronic parts and water treatment apparatus
- Publication number 20030006513
- Publication date Jan 9, 2003
- TDK Corporation
- Masashi Gotoh
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Electronic part and manufacturing method therefor
- Publication number 20020014687
- Publication date Feb 7, 2002
- TDK Corporation
- Masashi Gotoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD HAVING BONDING AREAS TO BE JOINED WITH BUMPS BY ULTRA...
- Publication number 20010018982
- Publication date Sep 6, 2001
- MASASHI GOTOH
- H01 - BASIC ELECTRIC ELEMENTS

Syuichiro Yamamoto

Person

Patents Grantslast 30 patents

Production method of electronic parts and water treatment apparatus

Circuit board having bonding areas to be joined with bumps by ultra...

Production method of electronic parts and water treatment apparatus

Electronic part and manufacturing method therefor

Resin package fabrication process

Method of manufacturing a substrate having electrode arcs for conne...

Wiring board and process for the production thereof

Patents Applicationslast 30 patents

Production method of electronic parts and water treatment apparatus

Electronic part and manufacturing method therefor

CIRCUIT BOARD HAVING BONDING AREAS TO BE JOINED WITH BUMPS BY ULTRA...