Szu-Wei Lu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure including stacked pillar portions and method for...
- Patent number 12,368,123
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jung-Hua Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device bonding apparatus and method of manufacturing a package usin...
- Patent number 12,368,128
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,368,084
- Issue date Jul 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including a package lid having an inner foot and m...
- Patent number 12,362,245
- Issue date Jul 15, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic package and method of manufacture
- Patent number 12,353,011
- Issue date Jul 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Tsung-Fu Tsai
- G02 - OPTICS
Information Patent Grant
Inspection apparatus, manufacturing method of integrated circuit, a...
- Patent number 12,347,708
- Issue date Jul 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method thereof
- Patent number 12,315,806
- Issue date May 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive and thermal interface material on a plurality of dies cove...
- Patent number 12,300,574
- Issue date May 13, 2025
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coplanar control for film-type thermal interface
- Patent number 12,278,162
- Issue date Apr 15, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,272,568
- Issue date Apr 8, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of forming the same
- Patent number 12,266,633
- Issue date Apr 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with stacked semiconductor dies
- Patent number 12,255,155
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 12,255,079
- Issue date Mar 18, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method
- Patent number 12,237,238
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,230,605
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ying-Ching Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 12,230,609
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming package structure and package structure therefrom
- Patent number 12,218,117
- Issue date Feb 4, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package using jig
- Patent number 12,211,818
- Issue date Jan 28, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating package structure
- Patent number 12,176,261
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming package structure
- Patent number 12,170,236
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 12,165,978
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shih-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming integrated fan-out packages with built-in heat sink
- Patent number 12,148,661
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Wei Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pickup apparatus and method of using the same
- Patent number 12,142,499
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,142,579
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacture
- Patent number 12,132,004
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for detecting end point
- Patent number 12,131,965
- Issue date Oct 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 12,119,324
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High efficiency heat dissipation using thermal interface material film
- Patent number 12,100,640
- Issue date Sep 24, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Underfill structure for semiconductor packages and methods of formi...
- Patent number 12,080,617
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package structure
- Patent number 12,074,119
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE
- Publication number 20250210455
- Publication date Jun 26, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yu-Hsun Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED FIBER ARRAY UNIT STRUCTURE INCLUDING EMBEDDED PASSIVE OP...
- Publication number 20250199251
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Jen WANG
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20250201770
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20250201583
- Publication date Jun 19, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250172769
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES
- Publication number 20250174578
- Publication date May 29, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chao Mao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20250157870
- Publication date May 15, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jing-Cheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRO-OPTICAL DEVICE
- Publication number 20250138345
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin Liang
- G02 - OPTICS
Information Patent Application
METHOD OF FORMING PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREFROM
- Publication number 20250140768
- Publication date May 1, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Chien Pan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-ON-INSULATOR SUBSTRATE INCLUDING A PRE-NOTCHED FILM AND METHOD...
- Publication number 20250096035
- Publication date Mar 20, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Chiang Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE AND METHOD OF MANUFACTURE
- Publication number 20250076594
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
INTERPOSER WITH PLANAR SIDEWALL SURFACE FOR OPTICAL COUPLING AND ME...
- Publication number 20250076599
- Publication date Mar 6, 2025
- Taiwan Semiconductor Manufacturing Company Limited
- Tsung-Fu Tsai
- G02 - OPTICS
Information Patent Application
OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20250044517
- Publication date Feb 6, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chao-Jen Wang
- G02 - OPTICS
Information Patent Application
OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...
- Publication number 20240427091
- Publication date Dec 26, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
- Publication number 20240395727
- Publication date Nov 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240387197
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jiun-Ting Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Devices and Methods of Manufacture
- Publication number 20240385388
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
Photonic Package and Method of Manufacture
- Publication number 20240385378
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tsung-Fu Tsai
- G02 - OPTICS
Information Patent Application
Semiconductor Package and Method of Manufacturing the Same
- Publication number 20240387330
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20240387469
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chin-Fu Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Manufacturing The Same
- Publication number 20240387196
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chin-Chuan Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method
- Publication number 20240387198
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shih Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PICKUP APPARATUS AND METHOD OF USING THE SAME
- Publication number 20240387206
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...
- Publication number 20240387432
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tsung-Fu Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE
- Publication number 20240387446
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES
- Publication number 20240379602
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Chih Chiou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM
- Publication number 20240371725
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES
- Publication number 20240371724
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Pu Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240371821
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kung-Chen Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363365
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Li-Hui Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package structure including stacked pillar portions and method for...

Device bonding apparatus and method of manufacturing a package usin...

Package structure and manufacturing method thereof

Package assembly including a package lid having an inner foot and m...

Photonic package and method of manufacture

Inspection apparatus, manufacturing method of integrated circuit, a...

Electronic device and manufacturing method thereof

Adhesive and thermal interface material on a plurality of dies cove...

Coplanar control for film-type thermal interface

Semiconductor package and manufacturing method thereof

Semiconductor structure and method of forming the same

Package structure with stacked semiconductor dies

Semiconductor package and method of manufacturing the same

Package structure and method

Semiconductor package and manufacturing method thereof

Semiconductor packages

Method of forming package structure and package structure therefrom

Manufacturing method of semiconductor package using jig

Method of fabricating package structure

Method for forming package structure

Package structure and method of manufacturing the same

Method of forming integrated fan-out packages with built-in heat sink

Pickup apparatus and method of using the same

Package structure and manufacturing method thereof

Semiconductor devices and methods of manufacture

Apparatus for detecting end point

Package structure

High efficiency heat dissipation using thermal interface material film

Underfill structure for semiconductor packages and methods of formi...

Chip package structure

Patents Applicationslast 30 patents

COPLANAR CONTROL FOR FILM-TYPE THERMAL INTERFACE

INTEGRATED FIBER ARRAY UNIT STRUCTURE INCLUDING EMBEDDED PASSIVE OP...

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

OPTICAL DEVICE AND METHOD OF MANUFACTURE

PACKAGE STRUCTURE WITH STACKED SEMICONDUCTOR DIES

PACKAGE STRUCTURES

ELECTRO-OPTICAL DEVICE

METHOD OF FORMING PACKAGE STRUCTURE AND PACKAGE STRUCTURE THEREFROM

FILM-ON-INSULATOR SUBSTRATE INCLUDING A PRE-NOTCHED FILM AND METHOD...

OPTICAL DEVICE AND METHOD OF MANUFACTURE

INTERPOSER WITH PLANAR SIDEWALL SURFACE FOR OPTICAL COUPLING AND ME...

OPTICAL COUPLING STRUCTURE FOR SEMICONDUCTOR DEVICE

OPTICAL CONNECTION STRUCTURES FOR A PHOTONIC ASSEMBLY AND METHODS F...

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Optical Devices and Methods of Manufacture

Photonic Package and Method of Manufacture

Semiconductor Package and Method of Manufacturing the Same

SEMICONDUCTOR PACKAGES

Semiconductor Package and Method of Manufacturing The Same

Integrated Circuit Package and Method

PICKUP APPARATUS AND METHOD OF USING THE SAME

SEMICONDUCTOR DEVICE, PACKAGE STRUCTURE AND METHOD OF FABRICATING T...

JIG FOR MANUFACTURING SEMICONDUCTOR PACKAGE

METHODS OF FORMING INTEGRATED CIRCUIT PACKAGES

HIGH EFFICIENCY HEAT DISSIPATION USING THERMAL INTERFACE MATERIAL FILM

PACKAGE STRUCTURES

PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF