Tadahide Hoshi

Follow

Person

Yokohama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor substrate and inspection meth...
- Patent number 5,951,755
- Issue date Sep 14, 1999
- Kabushiki Kaisha Toshiba
- Moriya Miyashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor substrate
- Patent number 5,352,625
- Issue date Oct 4, 1994
- Kabushiki Kaisha Toshiba
- Tadahide Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for bonding semiconductor substrates
- Patent number 5,273,553
- Issue date Dec 28, 1993
- Kabushiki Kaisha Toshiba
- Tadahide Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded semiconductor body
- Patent number 5,196,375
- Issue date Mar 23, 1993
- Kabushiki Kaisha Toshiba
- Tadahide Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for bonding semiconductor substrates
- Patent number 5,129,827
- Issue date Jul 14, 1992
- Kabushiki Kaisha Toshiba
- Tadahide Hoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 5,068,704
- Issue date Nov 26, 1991
- Kabushiki Kaisha Toshiba
- Akio Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including substrate bo...
- Patent number 4,935,386
- Issue date Jun 19, 1990
- Kabushiki Kaisha Toshiba
- Akio Nakagawa
- H01 - BASIC ELECTRIC ELEMENTS