Tadahiro Kato

Person

Nishishirakawa-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece
- Patent number 10,011,046
- Issue date Jul 3, 2018
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chamfering apparatus and method for manufacturing notchless wafer
- Patent number 10,002,753
- Issue date Jun 19, 2018
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Outer periphery polishing apparatus for disc-shaped workpiece
- Patent number 9,358,655
- Issue date Jun 7, 2016
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 8,603,897
- Issue date Dec 10, 2013
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-disc grinding apparatus and method for producing wafer
- Patent number 8,562,390
- Issue date Oct 22, 2013
- Shin-Etsu Handotai Co., Ltd.
- Kenji Kobayashi
- B24 - GRINDING POLISHING
Information Patent Grant
Chamfering apparatus for silicon wafer, method for producing silico...
- Patent number 8,454,852
- Issue date Jun 4, 2013
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer production method
- Patent number 8,231,430
- Issue date Jul 31, 2012
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Method for slicing workpiece by using wire saw and wire saw
- Patent number 8,037,878
- Issue date Oct 18, 2011
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B24 - GRINDING POLISHING
Information Patent Grant
Workpiece double-disc grinding apparatus and workpiece double-disc...
- Patent number 8,029,339
- Issue date Oct 4, 2011
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of improving nanotopography of surface of wafer and wire saw...
- Patent number 7,997,262
- Issue date Aug 16, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for producing semiconductor wafer and semiconductor wafer
- Patent number 7,507,146
- Issue date Mar 24, 2009
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Method for processing semiconductor wafer and semiconductor wafer
- Patent number 7,332,437
- Issue date Feb 19, 2008
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and device for semiconductor device manufacturi...
- Patent number 6,787,797
- Issue date Sep 7, 2004
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Demizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for grinding double sides of thin disk work
- Patent number 6,726,525
- Issue date Apr 27, 2004
- Shin-Estu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Double-sided simultaneous grinding method, double-sided simultaneou...
- Patent number 6,652,358
- Issue date Nov 25, 2003
- Shin-Etsu Handotai Co., Ltd.
- Shunichi Ikeda
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer and production method therefor
- Patent number 6,491,836
- Issue date Dec 10, 2002
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer processing method and semiconductor wafers prod...
- Patent number 6,432,837
- Issue date Aug 13, 2002
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processing method for a wafer
- Patent number 6,358,117
- Issue date Mar 19, 2002
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor wafer processing method and semiconductor wafers prod...
- Patent number 6,346,485
- Issue date Feb 12, 2002
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process for semiconductor wafer
- Patent number 6,284,658
- Issue date Sep 4, 2001
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafers processing method and semiconductor wafers pro...
- Patent number 6,239,039
- Issue date May 29, 2001
- Shin-Etsu Handotai Co., Ltd.
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface grinding method and apparatus for thin plate work
- Patent number 6,220,928
- Issue date Apr 24, 2001
- Shin-Etsu Handotai Co., Ltd.
- Keiichi Okabe
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for surface-grinding of workpiece
- Patent number 6,077,149
- Issue date Jun 20, 2000
- Shin-Etsu Handotai Co., Ltd.
- Sadayuki Ohkuni
- B24 - GRINDING POLISHING
Information Patent Grant
Surface grinding device and method of surface grinding a thin-plate...
- Patent number 6,050,880
- Issue date Apr 18, 2000
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of polishing semiconductor wafers
- Patent number 5,951,374
- Issue date Sep 14, 1999
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor wafers
- Patent number 5,942,445
- Issue date Aug 24, 1999
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of manufacturing semiconductor wafers
- Patent number 5,800,725
- Issue date Sep 1, 1998
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for production of silicon wafer and apparatus therefor
- Patent number 5,679,212
- Issue date Oct 21, 1997
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Grant
Method of making semiconductor wafers
- Patent number 5,494,862
- Issue date Feb 27, 1996
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for high-flatness etching of wafer
- Patent number 5,474,644
- Issue date Dec 12, 1995
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FIXED-ABRASIVE-GRAIN WIRE, WIRE SAW, AND METHOD FOR SLICING WORKPIECE
- Publication number 20170072594
- Publication date Mar 16, 2017
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro KATO
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
CHAMFERING APPARATUS AND METHOD FOR MANUFACTURING NOTCHLESS WAFER
- Publication number 20160300708
- Publication date Oct 13, 2016
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro KATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OUTER PERIPHERY POLISHING APPARATUS FOR DISC-SHAPED WORKPIECE
- Publication number 20150283664
- Publication date Oct 8, 2015
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20120289025
- Publication date Nov 15, 2012
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CHAMFERING WAFER
- Publication number 20120100785
- Publication date Apr 26, 2012
- Shin-Etsu Handotai Co., Ltd.
- Yukio Ishimasa
- B24 - GRINDING POLISHING
Information Patent Application
WORKPIECE DOUBLE-DISC GRINDING APPARATUS AND WORKPIECE DOUBLE-DISC...
- Publication number 20110053470
- Publication date Mar 3, 2011
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Application
DOUBLE-DISC GRINDING APPARATUS AND METHOD FOR PRODUCING WAFER
- Publication number 20110039476
- Publication date Feb 17, 2011
- Shin-Etsu Handotai Co., Ltd.
- Kenji Kobayashi
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW
- Publication number 20100252017
- Publication date Oct 7, 2010
- Shin-Etsu Handotai Co., Ltd.
- Koji Kitagawa
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
Method of improving nanotopography of surface of wafer and wire saw...
- Publication number 20100180880
- Publication date Jul 22, 2010
- Shin-Etsu Handotai Co., Ltd.
- Hiroshi Oishi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chamfering Apparatus For Silicon Wafer, Method For Producing Silico...
- Publication number 20090324896
- Publication date Dec 31, 2009
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Application
Wafer Production Method
- Publication number 20090170406
- Publication date Jul 2, 2009
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor Wafer Fabricating Method and Semiconductor Wafer Mirr...
- Publication number 20080113510
- Publication date May 15, 2008
- Shin-Etsu Handotai Co., Ltd.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Application
Method for Producing Semiconductor Wafer and Semiconductor Wafer
- Publication number 20080096474
- Publication date Apr 24, 2008
- SHIN-ETSU HANDOTAI CO., LTD.
- Tadahiro Kato
- B24 - GRINDING POLISHING
Information Patent Application
Method for processing semiconductor wafer and semiconductor wafer
- Publication number 20030171075
- Publication date Sep 11, 2003
- Takashi Nihonmatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer and device for semiconductor device manufacturi...
- Publication number 20020167006
- Publication date Nov 14, 2002
- Kiyoshi Demizu
- H01 - BASIC ELECTRIC ELEMENTS

Tadahiro Kato

Person

Patents Grantslast 30 patents

Fixed-abrasive-grain wire, wire saw, and method for slicing workpiece

Chamfering apparatus and method for manufacturing notchless wafer

Outer periphery polishing apparatus for disc-shaped workpiece

Method for manufacturing bonded wafer

Double-disc grinding apparatus and method for producing wafer

Chamfering apparatus for silicon wafer, method for producing silico...

Wafer production method

Method for slicing workpiece by using wire saw and wire saw

Workpiece double-disc grinding apparatus and workpiece double-disc...

Method of improving nanotopography of surface of wafer and wire saw...

Method for producing semiconductor wafer and semiconductor wafer

Method for processing semiconductor wafer and semiconductor wafer

Semiconductor wafer and device for semiconductor device manufacturi...

Method and device for grinding double sides of thin disk work

Double-sided simultaneous grinding method, double-sided simultaneou...

Semiconductor wafer and production method therefor

Semiconductor wafer processing method and semiconductor wafers prod...

Processing method for a wafer

Semiconductor wafer processing method and semiconductor wafers prod...

Manufacturing process for semiconductor wafer

Semiconductor wafers processing method and semiconductor wafers pro...

Surface grinding method and apparatus for thin plate work

Method and apparatus for surface-grinding of workpiece

Surface grinding device and method of surface grinding a thin-plate...

Method of polishing semiconductor wafers

Method of manufacturing semiconductor wafers

Method of manufacturing semiconductor wafers

Method for production of silicon wafer and apparatus therefor

Method of making semiconductor wafers

Method and apparatus for high-flatness etching of wafer

Patents Applicationslast 30 patents

FIXED-ABRASIVE-GRAIN WIRE, WIRE SAW, AND METHOD FOR SLICING WORKPIECE

CHAMFERING APPARATUS AND METHOD FOR MANUFACTURING NOTCHLESS WAFER

OUTER PERIPHERY POLISHING APPARATUS FOR DISC-SHAPED WORKPIECE

METHOD FOR MANUFACTURING BONDED WAFER

METHOD FOR CHAMFERING WAFER

WORKPIECE DOUBLE-DISC GRINDING APPARATUS AND WORKPIECE DOUBLE-DISC...

DOUBLE-DISC GRINDING APPARATUS AND METHOD FOR PRODUCING WAFER

METHOD FOR SLICING WORKPIECE BY USING WIRE SAW AND WIRE SAW

Method of improving nanotopography of surface of wafer and wire saw...

Chamfering Apparatus For Silicon Wafer, Method For Producing Silico...

Wafer Production Method

Semiconductor Wafer Fabricating Method and Semiconductor Wafer Mirr...

Method for Producing Semiconductor Wafer and Semiconductor Wafer

Method for processing semiconductor wafer and semiconductor wafer

Semiconductor wafer and device for semiconductor device manufacturi...