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Tadao Sakakibara
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Yukawa, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Plated material and method of manufacturing the same, terminal memb...
Patent number
7,029,760
Issue date
Apr 18, 2006
Mitsubishi Shindoh Co., Ltd.
Akihito Mori
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper based alloy for electrical and electronic parts excellent in...
Patent number
5,508,001
Issue date
Apr 16, 1996
Mitsubishi Sindoh Co., Ltd.
Takeshi Suzuki
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Copper-based alloy connector for electrical devices
Patent number
4,971,758
Issue date
Nov 20, 1990
Mitsubishi Shindoh Co., Ltd.
Takeshi Suzuki
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Copper alloy lead frame material for semiconductor devices
Patent number
4,877,577
Issue date
Oct 31, 1989
Mitsubishi Shindoh Co., Ltd.
Rensei Futatsuka
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Copper base lead material for leads of semiconductor devices
Patent number
4,750,029
Issue date
Jun 7, 1988
Mitsubishi Shindoh Co., Ltd.
Rensei Futatsuka
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Copper base alloy for leads of integrated circuit
Patent number
4,249,941
Issue date
Feb 10, 1981
Tamagawa Kikai Kinzoku Kabushiki Kaisha
Rensei Futatsuka
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Patents Applications
last 30 patents
Information
Patent Application
Plated material and method of manufacturing the same, terminal memb...
Publication number
20040229077
Publication date
Nov 18, 2004
Akihito Mori
B32 - LAYERED PRODUCTS
Information
Patent Application
Connector terminal
Publication number
20030186597
Publication date
Oct 2, 2003
Takeshi Suzuki
H01 - BASIC ELECTRIC ELEMENTS