Tadashi Atoji

Person

Yokohama-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid ejection head and its method of manufacture
- Patent number 8,029,685
- Issue date Oct 4, 2011
- Canon Kabushiki Kaisha
- Hirokazu Komuro
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of manufacturing bonded substrate stack
- Patent number 7,642,112
- Issue date Jan 5, 2010
- Canon Kabushiki Kaisha
- Tadashi Atoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate having a stepped profile
- Patent number 7,245,002
- Issue date Jul 17, 2007
- Canon Kabushiki Kaisha
- Yutaka Akino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate and method of manufacturing the same
- Patent number 6,417,108
- Issue date Jul 9, 2002
- Canon Kabushiki Kaisha
- Yutaka Akino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for production of SOI substrate by pasting and SOI substrate
- Patent number 6,156,624
- Issue date Dec 5, 2000
- Canon Kabushiki Kaisha
- Kenji Yamagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process for a SOI substrate
- Patent number 6,103,009
- Issue date Aug 15, 2000
- Canon Kabushiki Kaisha
- Tadashi Atoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor article
- Patent number 6,054,363
- Issue date Apr 25, 2000
- Canon Kabushiki Kaisha
- Kiyofumi Sakaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process and fabrication apparatus of SOI substrate
- Patent number 5,876,497
- Issue date Mar 2, 1999
- Canon Kabushiki Kaisha
- Tadashi Atoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film semiconductor device and photoelectric conversion device...
- Patent number 5,686,734
- Issue date Nov 11, 1997
- Canon Kabushiki Kaisha
- Yoshihiro Hamakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for forming a silicon carbide film
- Patent number 5,445,992
- Issue date Aug 29, 1995
- Canon Kabushiki Kaisha
- Hiroyuki Tokunaga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A LIQUID EJECTION HEAD AND LIQUID EJECTION...
- Publication number 20080076197
- Publication date Mar 27, 2008
- Canon Kabushiki Kaisha
- Hirokazu Komuro
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MANUFACTURING METHOD OF LIQUID DISCHARGE HEAD
- Publication number 20070243330
- Publication date Oct 18, 2007
- Canon Kabushiki Kaisha
- Hirokazu Komuro
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20070114609
- Publication date May 24, 2007
- Yutaka Akino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing bonded substrate stack
- Publication number 20060073644
- Publication date Apr 6, 2006
- Tadashi Atoji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate and method of manufacturing the same
- Publication number 20020132451
- Publication date Sep 19, 2002
- Yutaka Akino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOI SUBSTRATE AND METHOD AND SYSTEM FOR MANUFACTURING THE SAME
- Publication number 20020004286
- Publication date Jan 10, 2002
- CANON KABUSHIKI KAISHA
- TADASHI ATOJI
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL

Tadashi Atoji

Person

Patents Grantslast 30 patents

Liquid ejection head and its method of manufacture

Method of manufacturing bonded substrate stack

Semiconductor substrate having a stepped profile

Semiconductor substrate and method of manufacturing the same

Method for production of SOI substrate by pasting and SOI substrate

Fabrication process for a SOI substrate

Method of manufacturing semiconductor article

Fabrication process and fabrication apparatus of SOI substrate

Thin film semiconductor device and photoelectric conversion device...

Process for forming a silicon carbide film

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A LIQUID EJECTION HEAD AND LIQUID EJECTION...

MANUFACTURING METHOD OF LIQUID DISCHARGE HEAD

SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

Method of manufacturing bonded substrate stack

Semiconductor substrate and method of manufacturing the same

SOI SUBSTRATE AND METHOD AND SYSTEM FOR MANUFACTURING THE SAME