Tadashi IIJIMA

Person

Oita, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 12,080,745
- Issue date Sep 3, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takatoshi Kameshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 12,057,462
- Issue date Aug 6, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hiroshi Horikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 12,027,558
- Issue date Jul 2, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takatoshi Kameshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light detecting device with multiple substrates
- Patent number 12,002,833
- Issue date Jun 4, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hideto Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,955,500
- Issue date Apr 9, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Reijiroh Shohji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic device including coupling...
- Patent number 11,948,961
- Issue date Apr 2, 2024
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hideto Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,804,507
- Issue date Oct 31, 2023
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Ikue Mitsuhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,594,567
- Issue date Feb 28, 2023
- Sony Group Corporation
- Tadashi Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device with multiple substrates
- Patent number 11,476,294
- Issue date Oct 18, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hideto Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,411,036
- Issue date Aug 9, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takatoshi Kameshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus including coupl...
- Patent number 11,411,037
- Issue date Aug 9, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hideto Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,289,526
- Issue date Mar 29, 2022
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Reijiroh Shohji
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,201,185
- Issue date Dec 14, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Ikue Mitsuhashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,152,418
- Issue date Oct 19, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Takatoshi Kameshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device and electronic apparatus
- Patent number 11,101,313
- Issue date Aug 24, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hiroshi Horikoshi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid-state imaging device having an electric coupling structure
- Patent number 10,998,369
- Issue date May 4, 2021
- SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Hideto Hashiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor apparatus and semiconductor a...
- Patent number 8,569,181
- Issue date Oct 29, 2013
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 8,546,174
- Issue date Oct 1, 2013
- Kabushiki Kaisha Toshiba
- Tadashi Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing same
- Patent number 8,372,682
- Issue date Feb 12, 2013
- Kabushiki Kaisha Toshiba
- Tadashi Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device and semiconductor device
- Patent number 8,314,491
- Issue date Nov 20, 2012
- Kabushiki Kaisha Toshiba
- Soichi Yamashita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Crystal structure of a solder bump of flip chip semiconductor device
- Patent number 8,242,597
- Issue date Aug 14, 2012
- Kabushiki Kaisha Toshiba
- Tadashi Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor apparatus and semiconductor a...
- Patent number 8,063,487
- Issue date Nov 22, 2011
- Kabushiki Kaisha Toshiba
- Tatsuo Migita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for fabricating a metal wiring and metal contact in a semic...
- Patent number 6,794,286
- Issue date Sep 21, 2004
- Kabushiki Kaisha Toshiba
- Hisako Aoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device having buried metal wi...
- Patent number 6,787,462
- Issue date Sep 7, 2004
- Kabushiki Kaisha Toshiba
- Tadashi Iijima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a plating film, and device for forming the same
- Patent number 6,750,143
- Issue date Jun 15, 2004
- Kabushiki Kaisha Toshiba
- Tadashi Iijima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 6,368,951
- Issue date Apr 9, 2002
- Kabushiki Kaisha Toshiba
- Kazuyuki Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a copper interconnect
- Patent number 6,348,402
- Issue date Feb 19, 2002
- Kabushiki Kaisha Toshiba
- Takashi Kawanoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device manufacturing method and semiconductor device
- Patent number 6,291,891
- Issue date Sep 18, 2001
- Kabushiki Kaisha Toshiba
- Kazuyuki Higashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming barrier layer for copper metallization
- Patent number 6,150,270
- Issue date Nov 21, 2000
- Kabushiki Kaisha Toshiba
- Tetsuo Matsuda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 6,100,193
- Issue date Aug 8, 2000
- Kabushiki Kaisha Toshiba
- Shintaro Suehiro
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20240423001
- Publication date Dec 19, 2024
- Sony Semiconductor Solutions Corporation
- TADASHI IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTODETECTOR AND ELECTRONIC APPARATUS
- Publication number 20240387583
- Publication date Nov 21, 2024
- Sony Semiconductor Solutions Corporation
- Kazuya FURUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240304649
- Publication date Sep 12, 2024
- Sony Semiconductor Solutions Corporation
- TAKATOSHI KAMESHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240274641
- Publication date Aug 15, 2024
- Sony Semiconductor Solutions Corporation
- REIJIROH SHOHJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT DETECTING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20240274630
- Publication date Aug 15, 2024
- Sony Semiconductor Solutions Corporation
- Tadashi IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING DEVICE
- Publication number 20240204014
- Publication date Jun 20, 2024
- Sony Semiconductor Solutions Corporation
- Michiko SAKAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE INCLUDING COUPLING...
- Publication number 20240194718
- Publication date Jun 13, 2024
- Sony Semiconductor Solutions Corporation
- HIDETO HASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGING ELEMENT AND IMAGING DEVICE
- Publication number 20240186357
- Publication date Jun 6, 2024
- Sony Semiconductor Solutions Corporation
- Hiroshi TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20230020137
- Publication date Jan 19, 2023
- Sony Semiconductor Solutions Corporation
- HIDETO HASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20220359603
- Publication date Nov 10, 2022
- Sony Semiconductor Solutions Corporation
- TAKATOSHI KAMESHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...
- Publication number 20220359599
- Publication date Nov 10, 2022
- Sony Semiconductor Solutions Corporation
- TADASHI IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE INCLUDING COUPLING...
- Publication number 20220359605
- Publication date Nov 10, 2022
- Sony Semiconductor Solutions Corporation
- HIDETO HASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...
- Publication number 20220352226
- Publication date Nov 3, 2022
- Sony Semiconductor Solutions Corporation
- TOSHIHIKO MIYAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATION TYPE SOLID-STATE IMAGING DEVICE, MANUFACTURIN...
- Publication number 20220310680
- Publication date Sep 29, 2022
- Sony Semiconductor Solutions Corporation
- Taizo TAKACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20220157877
- Publication date May 19, 2022
- Sony Semiconductor Solutions Corporation
- REIJIROH SHOHJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20220085093
- Publication date Mar 17, 2022
- Sony Semiconductor Solutions Corporation
- IKUE MITSUHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20210391372
- Publication date Dec 16, 2021
- Sony Semiconductor Solutions Corporation
- TAKATOSHI KAMESHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20210366973
- Publication date Nov 25, 2021
- Sony Semiconductor Solutions Corporation
- HIROSHI HORIKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20210217797
- Publication date Jul 15, 2021
- Sony Semiconductor Solutions Corporation
- HIDETO HASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20210104571
- Publication date Apr 8, 2021
- Sony Semiconductor Solutions Corporation
- REIJIROH SHOHJI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20210104570
- Publication date Apr 8, 2021
- Sony Semiconductor Solutions Corporation
- IKUE MITSUHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20210104572
- Publication date Apr 8, 2021
- Sony Semiconductor Solutions Corporation
- TAKATOSHI KAMESHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE ILLUMINATION TYPE SOLID-STATE IMAGING DEVICE, MANUFACTURIN...
- Publication number 20200258924
- Publication date Aug 13, 2020
- Sony Semiconductor Solutions Corporation
- Taizo TAKACHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20200243591
- Publication date Jul 30, 2020
- Sony Semiconductor Solutions Corporation
- TADASHI IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20200105813
- Publication date Apr 2, 2020
- Sony Semiconductor Solutions Corporation
- HIDETO HASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20200105814
- Publication date Apr 2, 2020
- Sony Semiconductor Solutions Corporation
- HIDETO HASHIGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20200098815
- Publication date Mar 26, 2020
- Sony Semiconductor Solutions Corporation
- TAKATOSHI KAMESHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS
- Publication number 20200091217
- Publication date Mar 19, 2020
- Sony Semiconductor Solutions Corporation
- HIROSHI HORIKOSHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20160027840
- Publication date Jan 28, 2016
- KABUSHIKI KAISHA TOSHIBA
- Tadashi IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID-STATE IMAGING DEVICE
- Publication number 20150048468
- Publication date Feb 19, 2015
- KABUSHIKI KAISHA TOSHIBA
- Tadashi IIJIMA
- H01 - BASIC ELECTRIC ELEMENTS

Tadashi IIJIMA

Person

Patents Grantslast 30 patents

Solid-state imaging device and electronic apparatus

Solid-state imaging device and electronic apparatus

Solid-state imaging device and electronic apparatus

Light detecting device with multiple substrates

Solid-state imaging device and electronic apparatus

Solid-state imaging device and electronic device including coupling...

Solid-state imaging device and electronic apparatus

Solid-state imaging device and electronic apparatus

Solid-state imaging device with multiple substrates

Solid-state imaging device and electronic apparatus

Solid-state imaging device and electronic apparatus including coupl...

Solid-state imaging device and electronic apparatus

Solid-state imaging device and electronic apparatus

Solid-state imaging device and electronic apparatus

Solid-state imaging device and electronic apparatus

Solid-state imaging device having an electric coupling structure

Manufacturing method of semiconductor apparatus and semiconductor a...

Method for manufacturing semiconductor device

Semiconductor device and method for manufacturing same

Manufacturing method of semiconductor device and semiconductor device

Crystal structure of a solder bump of flip chip semiconductor device

Manufacturing method of semiconductor apparatus and semiconductor a...

Process for fabricating a metal wiring and metal contact in a semic...

Method of manufacturing semiconductor device having buried metal wi...

Method for forming a plating film, and device for forming the same

Semiconductor device manufacturing method and semiconductor device

Method of manufacturing a copper interconnect

Semiconductor device manufacturing method and semiconductor device

Method for forming barrier layer for copper metallization

Method of manufacturing a semiconductor device

Patents Applicationslast 30 patents

SOLID-STATE IMAGING DEVICE

PHOTODETECTOR AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

LIGHT DETECTING DEVICE AND ELECTRONIC APPARATUS

IMAGING DEVICE

SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE INCLUDING COUPLING...

IMAGING ELEMENT AND IMAGING DEVICE

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...

SOLID-STATE IMAGING DEVICE AND ELECTRONIC DEVICE INCLUDING COUPLING...

SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING M...

BACKSIDE ILLUMINATION TYPE SOLID-STATE IMAGING DEVICE, MANUFACTURIN...

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

BACKSIDE ILLUMINATION TYPE SOLID-STATE IMAGING DEVICE, MANUFACTURIN...

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS

SOLID-STATE IMAGING DEVICE

SOLID-STATE IMAGING DEVICE