Tadashi NAGASAWA

Person

Yasu, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wiring board
- Patent number 12,177,971
- Issue date Dec 24, 2024
- Kyocera Corporation
- Tadashi Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated uncured sheet
- Patent number 11,426,970
- Issue date Aug 30, 2022
- Kyocera Corporation
- Tadashi Nagasawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Organic insulating body, metal-clad laminate and wiring board
- Patent number 10,806,031
- Issue date Oct 13, 2020
- Kyocera Corporation
- Tadashi Nagasawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Organic insulator, metal-clad laminate and wiring board
- Patent number 10,772,198
- Issue date Sep 8, 2020
- Kyocera Corporation
- Tadashi Nagasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board, mounting structure using same, and method of manufact...
- Patent number 9,693,451
- Issue date Jun 27, 2017
- KYOCERA Corporation
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, mounting structure, and method for manufacturing cir...
- Patent number 8,431,832
- Issue date Apr 30, 2013
- Kyocera Corporation
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit substrate and structure using the same
- Patent number 8,338,717
- Issue date Dec 25, 2012
- Kyocera Corporation
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin film, adhesive sheet, circuit board, and electronic apparatus
- Patent number 8,129,623
- Issue date Mar 6, 2012
- Kyocera Corporation
- Tadashi Nagasawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Multi-layer wiring substrate
- Patent number 6,663,946
- Issue date Dec 16, 2003
- Kyocera Corporation
- Takuji Seri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ORGANIC INSULATOR, METAL-CLAD LAMINATE SHEET, AND WIRING BOARD
- Publication number 20240215160
- Publication date Jun 27, 2024
- KYOCERA CORPORATION
- Chie CHIKARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC INSULATOR AND WIRING BOARD
- Publication number 20230209708
- Publication date Jun 29, 2023
- KYOCERA CORPORATION
- Chie CHIKARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD
- Publication number 20210400809
- Publication date Dec 23, 2021
- KYOCERA CORPORATION
- Tadashi NAGASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED UNCURED SHEET
- Publication number 20210260847
- Publication date Aug 26, 2021
- KYOCERA CORPORATION
- Tadashi NAGASAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
ORGANIC INSULATOR, METAL-CLAD LAMINATE AND WIRING BOARD
- Publication number 20200128667
- Publication date Apr 23, 2020
- KYOCERA CORPORATION
- Tadashi NAGASAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
ORGANIC INSULATING BODY, METAL-CLAD LAMINATE AND WIRING BOARD
- Publication number 20200077514
- Publication date Mar 5, 2020
- KYOCERA CORPORATION
- Tadashi NAGASAWA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
WIRING BOARD, MOUNTING STRUCTURE USING SAME, AND METHOD OF MANUFACT...
- Publication number 20150037611
- Publication date Feb 5, 2015
- KYOCERA CORPORATION
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Board, Mounting Structure, and Method for Manufacturing Cir...
- Publication number 20110051386
- Publication date Mar 3, 2011
- KYOCERA CORPORATION
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit Substrate and Structure Using the Same
- Publication number 20110024170
- Publication date Feb 3, 2011
- Kyocera Corporation
- Tadashi NAGASAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND SEMICONDUCTOR ELEMENT MOUNTED STRUCTURE USING THE...
- Publication number 20100065318
- Publication date Mar 18, 2010
- Kyocera Corporation
- Tadashi Nagasawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus
- Publication number 20090314526
- Publication date Dec 24, 2009
- KYOCERA CORPORATION
- Tadashi Nagasawa
- B32 - LAYERED PRODUCTS
Information Patent Application
Multi-layer wiring substrate
- Publication number 20020172021
- Publication date Nov 21, 2002
- Takuji Seri
- H01 - BASIC ELECTRIC ELEMENTS

Tadashi NAGASAWA

Person

Patents Grantslast 30 patents

Wiring board

Laminated uncured sheet

Organic insulating body, metal-clad laminate and wiring board

Organic insulator, metal-clad laminate and wiring board

Wiring board, mounting structure using same, and method of manufact...

Circuit board, mounting structure, and method for manufacturing cir...

Circuit substrate and structure using the same

Resin film, adhesive sheet, circuit board, and electronic apparatus

Multi-layer wiring substrate

Patents Applicationslast 30 patents

ORGANIC INSULATOR, METAL-CLAD LAMINATE SHEET, AND WIRING BOARD

ORGANIC INSULATOR AND WIRING BOARD

WIRING BOARD

LAMINATED UNCURED SHEET

ORGANIC INSULATOR, METAL-CLAD LAMINATE AND WIRING BOARD

ORGANIC INSULATING BODY, METAL-CLAD LAMINATE AND WIRING BOARD

WIRING BOARD, MOUNTING STRUCTURE USING SAME, AND METHOD OF MANUFACT...

Circuit Board, Mounting Structure, and Method for Manufacturing Cir...

Circuit Substrate and Structure Using the Same

CIRCUIT BOARD AND SEMICONDUCTOR ELEMENT MOUNTED STRUCTURE USING THE...

Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus

Multi-layer wiring substrate