Taeho Kook

Person

Lower Macungie Township, Lehigh County, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Acoustic filtering circuitry including capacitor
- Patent number 10,476,481
- Issue date Nov 12, 2019
- Qorvo US, Inc.
- Alan S. Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High coupling, low loss saw filter and associated method
- Patent number 8,552,819
- Issue date Oct 8, 2013
- TriQuint Semiconductor, Inc.
- Benjamin P. Abbott
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Routing under bond pad for the replacement of an interconnect layer
- Patent number 8,319,343
- Issue date Nov 27, 2012
- Agere Systems LLC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic wave guide device and method for minimizing trimming effec...
- Patent number 8,294,331
- Issue date Oct 23, 2012
- TriQuint Semiconductor, Inc.
- Benjamin P. Abbott
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and process for reducing damaging breakdown in...
- Patent number 8,241,986
- Issue date Aug 14, 2012
- Agere Systems Inc.
- Taeho Kook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for reducing damaging breakdown in...
- Patent number 8,089,130
- Issue date Jan 3, 2012
- Agere Systems Inc.
- Taeho Kook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature compensated surface acoustic wave device and method hav...
- Patent number 8,044,553
- Issue date Oct 25, 2011
- Triquint Semiconductor, Inc.
- Alan S. Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Bonded wafer SAW filters and methods
- Patent number 8,035,464
- Issue date Oct 11, 2011
- Triquint Semiconductor, Inc.
- Benjamin P. Abbott
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Transistor fabrication method
- Patent number 8,030,199
- Issue date Oct 4, 2011
- Agere Systems Inc.
- Sailesh Chittipeddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal monitoring and management of integrated circuits
- Patent number 7,973,544
- Issue date Jul 5, 2011
- Agere Systems Inc.
- Vance D. Archer, III
- G01 - MEASURING TESTING
Information Patent Grant
Acoustic wave device employing reflective elements for confining el...
- Patent number 7,939,987
- Issue date May 10, 2011
- Triquint Semiconductor, Inc.
- Marc Solal
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Structure and method for fabricating flip chip devices
- Patent number 7,777,333
- Issue date Aug 17, 2010
- Agere Systems Inc.
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device incorporating metallurgical bond to enhan...
- Patent number 7,429,502
- Issue date Sep 30, 2008
- Agere Systems, INC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor with damage detection circuitry
- Patent number 7,397,103
- Issue date Jul 8, 2008
- Agere Systems, INC
- Vance D. Archer
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit device incorporating metallurigical bond to enha...
- Patent number 7,327,029
- Issue date Feb 5, 2008
- Agere Systems, INC
- Vance D. Archer, III
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced bond pad for a semiconductor device
- Patent number 7,301,231
- Issue date Nov 27, 2007
- Agere Systems, INC
- Joze E. Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structures for testing a semiconductor wafer prior to pe...
- Patent number 7,221,173
- Issue date May 22, 2007
- Agere Systems, INC
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reinforced bond pad for a semiconductor device
- Patent number 7,115,985
- Issue date Oct 3, 2006
- Agere Systems, INC
- Joze E. Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor fabrication method
- Patent number 6,498,080
- Issue date Dec 24, 2002
- Agere Systems Guardian Corp.
- Sailesh Chittipeddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for using a hardmask to form an opening in a semiconductor s...
- Patent number 6,008,123
- Issue date Dec 28, 1999
- Lucent Technologies Inc.
- Taeho Kook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit fabrication
- Patent number 5,945,355
- Issue date Aug 31, 1999
- Lucent Technologies Inc.
- Larry Bruce Fritzinger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistor fabrication method
- Patent number 5,891,784
- Issue date Apr 6, 1999
- Lucent Technologies, Inc.
- Wan Yee Cheung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned opaque regions for attenuating phase-shifting masks
- Patent number 5,589,303
- Issue date Dec 31, 1996
- Lucent Technologies Inc.
- John J. DeMarco
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method of fabricating semiconductor devices and integrated circuits...
- Patent number 5,573,965
- Issue date Nov 12, 1996
- Lucent Technologies Inc.
- Min-Liang Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for integrated circuit fabrication including linewidth contr...
- Patent number 5,326,727
- Issue date Jul 5, 1994
- AT&T Bell Laboratories
- Taeho Kook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compensation of lithographic and etch proximity effects
- Patent number 5,057,462
- Issue date Oct 15, 1991
- AT&T Bell Laboratories
- Juli H. Eisenberg
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
ACOUSTIC FILTERING CIRCUITRY INCLUDING CAPACITOR
- Publication number 20180041193
- Publication date Feb 8, 2018
- Qorvo US, Inc.
- Alan S. Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HIGH COUPLING, LOW LOSS SAW FILTER AND ASSOCIATED METHOD
- Publication number 20130106535
- Publication date May 2, 2013
- TriQuint Semiconductor, Inc.
- Benjamin P. Abbott
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
- Publication number 20130056868
- Publication date Mar 7, 2013
- AGERE SYSTEMS LLC
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Acoustic Wave Guide Device and Method for Minimizing Trimming Effec...
- Publication number 20120161577
- Publication date Jun 28, 2012
- TriQuint Semiconductor, Inc.
- Benjamin P. Abbott
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR REDUCING DAMAGING BREAKDOWN IN...
- Publication number 20120077323
- Publication date Mar 29, 2012
- Agere Systems Incorporated
- Taeho Kook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Temperature Compensated Surface Acoustic Wave Device and Method Hav...
- Publication number 20110204747
- Publication date Aug 25, 2011
- TRIQUINT SEMICONDUCTOR, INC.
- Alan S. Chen
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
TRANSISTOR FABRICATION METHOD
- Publication number 20100120216
- Publication date May 13, 2010
- Agere Systems Inc.
- Sailesh Chittipeddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL MONITORING AND MANAGEMENT OF INTEGRATED CIRCUITS
- Publication number 20100045326
- Publication date Feb 25, 2010
- Agere Systems Inc.
- Vance D. Archer, III
- G01 - MEASURING TESTING
Information Patent Application
Structure and Method for Fabricating Flip Chip Devices
- Publication number 20090072393
- Publication date Mar 19, 2009
- Agere Systems Inc.
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR FABRICATION METHOD
- Publication number 20080280403
- Publication date Nov 13, 2008
- Sailesh Chittipeddi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Device Incorporating Metallurgical Bond to Enhan...
- Publication number 20080026508
- Publication date Jan 31, 2008
- Agere Systems Inc.
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR REDUCING DAMAGING BREAKDOWN IN...
- Publication number 20070290278
- Publication date Dec 20, 2007
- Agere Systems Incorporated
- Taeho Kook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit device incorporating metallurigacal bond to enha...
- Publication number 20070069368
- Publication date Mar 29, 2007
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
- Publication number 20070063352
- Publication date Mar 22, 2007
- Agere Systems Inc.
- Vance D. Archer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reinforced bond pad for a semiconductor device
- Publication number 20060226535
- Publication date Oct 12, 2006
- Joze E. Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structures for testing a semiconductor wafer prior to pe...
- Publication number 20060066327
- Publication date Mar 30, 2006
- Mark Adam Bachman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reinforced bond pad for a semiconductor device
- Publication number 20060065969
- Publication date Mar 30, 2006
- Joze E. Antol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistor fabrication method
- Publication number 20020197838
- Publication date Dec 26, 2002
- Sailesh Chittipeddi
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Acoustic filtering circuitry including capacitor

High coupling, low loss saw filter and associated method

Routing under bond pad for the replacement of an interconnect layer

Acoustic wave guide device and method for minimizing trimming effec...

Semiconductor device and process for reducing damaging breakdown in...

Semiconductor device and process for reducing damaging breakdown in...

Temperature compensated surface acoustic wave device and method hav...

Bonded wafer SAW filters and methods

Transistor fabrication method

Thermal monitoring and management of integrated circuits

Acoustic wave device employing reflective elements for confining el...

Structure and method for fabricating flip chip devices

Integrated circuit device incorporating metallurgical bond to enhan...

Semiconductor with damage detection circuitry

Integrated circuit device incorporating metallurigical bond to enha...

Reinforced bond pad for a semiconductor device

Method and structures for testing a semiconductor wafer prior to pe...

Reinforced bond pad for a semiconductor device

Transistor fabrication method

Method for using a hardmask to form an opening in a semiconductor s...

Integrated circuit fabrication

Transistor fabrication method

Self-aligned opaque regions for attenuating phase-shifting masks

Method of fabricating semiconductor devices and integrated circuits...

Method for integrated circuit fabrication including linewidth contr...

Compensation of lithographic and etch proximity effects

Patents Applicationslast 30 patents

ACOUSTIC FILTERING CIRCUITRY INCLUDING CAPACITOR

HIGH COUPLING, LOW LOSS SAW FILTER AND ASSOCIATED METHOD

ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER

Acoustic Wave Guide Device and Method for Minimizing Trimming Effec...

SEMICONDUCTOR DEVICE AND PROCESS FOR REDUCING DAMAGING BREAKDOWN IN...

Temperature Compensated Surface Acoustic Wave Device and Method Hav...

TRANSISTOR FABRICATION METHOD

THERMAL MONITORING AND MANAGEMENT OF INTEGRATED CIRCUITS

Structure and Method for Fabricating Flip Chip Devices

TRANSISTOR FABRICATION METHOD

Integrated Circuit Device Incorporating Metallurgical Bond to Enhan...

SEMICONDUCTOR DEVICE AND PROCESS FOR REDUCING DAMAGING BREAKDOWN IN...

Integrated circuit device incorporating metallurigacal bond to enha...

ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER

Reinforced bond pad for a semiconductor device

Method and structures for testing a semiconductor wafer prior to pe...

Reinforced bond pad for a semiconductor device

Transistor fabrication method