TAEJE CHO

Person

YONGIN-SI, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 10,186,500
- Issue date Jan 22, 2019
- Samsung Electronics Co., Ltd.
- Seung-Kwan Ryu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 10,157,766
- Issue date Dec 18, 2018
- Samsung Electronics Co., Ltd.
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,121,731
- Issue date Nov 6, 2018
- Samsung Electronics Co., Ltd.
- Sang Cheon Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,905,550
- Issue date Feb 27, 2018
- Samsung Electronics Co., Ltd.
- Sang-Uk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having stacked chips and a heat dissipation p...
- Patent number 9,875,992
- Issue date Jan 23, 2018
- Samsung Electronics Co., Ltd.
- Junyeong Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices
- Patent number 9,793,165
- Issue date Oct 17, 2017
- Samsung Electronics Co., Ltd.
- Seyoung Jeong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,646,895
- Issue date May 9, 2017
- Samsung Electronics Co., Ltd.
- Seungduk Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor package, semiconductor package...
- Patent number 9,508,704
- Issue date Nov 29, 2016
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods for fabricating the same
- Patent number 9,461,029
- Issue date Oct 4, 2016
- Samsung Electronics Co., Ltd.
- Hye-young Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having through-electrodes and methods for fab...
- Patent number 9,355,961
- Issue date May 31, 2016
- Samsung Electronics Co., Ltd.
- Chajea Jo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device substrate with crystal...
- Patent number 9,275,903
- Issue date Mar 1, 2016
- Samsung Electronics Co., Ltd.
- Byoung-Soo Kwak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages having through electrodes and methods for fa...
- Patent number 9,245,771
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Hyunsoo Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of fabricating the same
- Patent number 9,177,942
- Issue date Nov 3, 2015
- Samsung Electronics Co., Ltd.
- Wonkeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 9,024,434
- Issue date May 5, 2015
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus having through vias configured to isolate p...
- Patent number 8,884,416
- Issue date Nov 11, 2014
- Samsung Electronics Co., Ltd.
- Go Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages, methods of manufacturing the same, and semi...
- Patent number 8,802,495
- Issue date Aug 12, 2014
- Samsung Electronics Co., Ltd.
- Ji Hwang Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for wafer level package and semiconductor device fabricated...
- Patent number 8,558,371
- Issue date Oct 15, 2013
- Samsung Electronics Co., Ltd.
- JiSun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including conductive vias, conductive caps...
- Patent number 8,399,987
- Issue date Mar 19, 2013
- Samsung Electronics Co., Ltd.
- Woonseong Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20190164942
- Publication date May 30, 2019
- Samsung Electronics Co., Ltd.
- SEUNG-KWAN RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20170170154
- Publication date Jun 15, 2017
- SEUNG-KWAN RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170110388
- Publication date Apr 20, 2017
- Samsung Electronics Co., Ltd.
- Sang Cheon PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
- Publication number 20170004990
- Publication date Jan 5, 2017
- Un-Byoung Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
- Publication number 20160372447
- Publication date Dec 22, 2016
- Samsung Electronics Co., Ltd.
- Hye-young JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE TREATING APPARATUS AND A METHOD FOR TREATING A SUBSTRATE
- Publication number 20160314996
- Publication date Oct 27, 2016
- Samsung Electronics Co., Ltd.
- IL HWAN KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME
- Publication number 20160148888
- Publication date May 26, 2016
- Seung-Kwan RYU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING HEAT DISSIPATION
- Publication number 20160133613
- Publication date May 12, 2016
- SUNKYOUNG SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20160093541
- Publication date Mar 31, 2016
- Samsung Electronics Co., Ltd.
- Seungduk BAEK
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20160079208
- Publication date Mar 17, 2016
- Junyeong HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20160013174
- Publication date Jan 14, 2016
- Sang-Uk HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME
- Publication number 20150380394
- Publication date Dec 31, 2015
- Hye-young JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE...
- Publication number 20150318261
- Publication date Nov 5, 2015
- Samsung Electronics Co., Ltd.
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150171028
- Publication date Jun 18, 2015
- CHAJEA JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20150140785
- Publication date May 21, 2015
- Samsung Electronics Co., Ltd.
- Byoung-Soo KWAK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH-ELECTRODES AND METHODS FOR FAB...
- Publication number 20150123284
- Publication date May 7, 2015
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20150069635
- Publication date Mar 12, 2015
- Samsung Electronics Co., Ltd.
- Wonkeun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES HAVING THROUGH ELECTRODES AND METHODS FOR FA...
- Publication number 20140377909
- Publication date Dec 25, 2014
- Hyunsoo CHUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING THROUGH-VIA AND METHODS OF FABRICATING...
- Publication number 20140141569
- Publication date May 22, 2014
- Samsung Electronics Co., Ltd.
- Chajea JO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING THE SAME, AND SEMI...
- Publication number 20140038353
- Publication date Feb 6, 2014
- Samsung Electronics Co., Ltd.
- Ji Hwang KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF TREATING A DEVICE-SUBSTRATE AND SUPPORT-SUBSTRATES USED...
- Publication number 20130330925
- Publication date Dec 12, 2013
- Samsung Electronics Co., Ltd.
- Tae Hong MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20120280382
- Publication date Nov 8, 2012
- Samsung Electronics Co., Ltd.
- Yunhyeok IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME
- Publication number 20120214302
- Publication date Aug 23, 2012
- SEYOUNG JEONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20120175782
- Publication date Jul 12, 2012
- Samsung Electronics Co., Ltd.
- Yunhyeok Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20120119346
- Publication date May 17, 2012
- YUNHYEOK IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR APPARATUS HAVING THROUGH VIAS
- Publication number 20120018885
- Publication date Jan 26, 2012
- Go Eun Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Wafer Level Package and Semiconductor Device Fabricated...
- Publication number 20110233706
- Publication date Sep 29, 2011
- Samsung Electronics Co., Ltd.
- JiSun Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE VIAS, CONDUCTIVE CAPS...
- Publication number 20110133333
- Publication date Jun 9, 2011
- SAMSUNG ELECTRONICS CO., LTD.
- Woonseong Kwon
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor package and method of fabricating the same

Method of fabricating a semiconductor device

Semiconductor device

Semiconductor package and method of fabricating the same

Semiconductor package having stacked chips and a heat dissipation p...

Methods of fabricating semiconductor devices

Semiconductor package and manufacturing method thereof

Method of fabricating semiconductor package, semiconductor package...

Semiconductor packages and methods for fabricating the same

Semiconductor devices having through-electrodes and methods for fab...

Method of manufacturing semiconductor device substrate with crystal...

Semiconductor packages having through electrodes and methods for fa...

Semiconductor package and method of fabricating the same

Semiconductor packages

Semiconductor apparatus having through vias configured to isolate p...

Semiconductor packages, methods of manufacturing the same, and semi...

Method for wafer level package and semiconductor device fabricated...

Microelectronic devices including conductive vias, conductive caps...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME

SUBSTRATE TREATING APPARATUS AND A METHOD FOR TREATING A SUBSTRATE

SEMICONDUCTOR DEVICES AND METHODS FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE HAVING HEAT DISSIPATION

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICES HAVING THROUGH-ELECTRODES AND METHODS FOR FAB...

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGES HAVING THROUGH ELECTRODES AND METHODS FOR FA...

SEMICONDUCTOR DEVICES HAVING THROUGH-VIA AND METHODS OF FABRICATING...

SEMICONDUCTOR PACKAGES, METHODS OF MANUFACTURING THE SAME, AND SEMI...

METHODS OF TREATING A DEVICE-SUBSTRATE AND SUPPORT-SUBSTRATES USED...

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR APPARATUS HAVING THROUGH VIAS

Method For Wafer Level Package and Semiconductor Device Fabricated...

MICROELECTRONIC DEVICES INCLUDING CONDUCTIVE VIAS, CONDUCTIVE CAPS...