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Tai-Heui Cho

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Patents Grantslast 30 patents

  • Information Patent Grant

    Coil component
    • Patent number 12,106,885
    • Issue date Oct 1, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Seung Mo Lim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 11,915,853
    • Issue date Feb 27, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Seung Mo Lim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil electronic component
    • Patent number 11,881,346
    • Issue date Jan 23, 2024
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • In Young Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 11,830,663
    • Issue date Nov 28, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Byung Soo Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 11,562,852
    • Issue date Jan 24, 2023
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • No Il Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 11,450,474
    • Issue date Sep 20, 2022
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Seung Mo Lim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 11,437,183
    • Issue date Sep 6, 2022
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Seung Hee Oh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 11,367,561
    • Issue date Jun 21, 2022
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Seung Mo Lim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 11,335,496
    • Issue date May 17, 2022
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Byung Soo Kang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 11,195,652
    • Issue date Dec 7, 2021
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Tai Yon Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Coil component
    • Patent number 11,152,147
    • Issue date Oct 19, 2021
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Tai Yon Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Magnetic sheet and electronic device
    • Patent number 10,692,638
    • Issue date Jun 23, 2020
    • SAMSUNG ELECTRO-MECHANICS CO., LTD.
    • Jung Young Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    System for controlling brightness flicker of parallax barrier LCD t...
    • Patent number 8,325,108
    • Issue date Dec 4, 2012
    • NDIS Corporation
    • Kwan-Sik Min
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Grant

    Semiconductor device having fuse pattern and methods of fabricating...
    • Patent number 7,556,989
    • Issue date Jul 7, 2009
    • Samsung Electronics Co., Ltd.
    • Tai-Heui Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Integrated circuit devices having corrosion resistant fuse regions...
    • Patent number 7,180,154
    • Issue date Feb 20, 2007
    • Samsung Electronics Co., Ltd.
    • Tai-Heui Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device having multilevel interconnections and method...
    • Patent number 7,074,712
    • Issue date Jul 11, 2006
    • Samsung Electronics Co., Ltd.
    • Tai-heui Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding pad structure of a semiconductor device
    • Patent number 6,984,895
    • Issue date Jan 10, 2006
    • Samsung Electronics Co., Ltd.
    • Tai-Heui Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Bonding pad structure of a semiconductor device and method for manu...
    • Patent number 6,867,070
    • Issue date Mar 15, 2005
    • Samsung Electronics Co., Ltd.
    • Tai-Heui Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device having multilevel interconnections and method...
    • Patent number 6,806,574
    • Issue date Oct 19, 2004
    • Samsung Electronics Co., Ltd.
    • Tai-heui Cho
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240347246
    • Publication date Oct 17, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • No Il Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240347260
    • Publication date Oct 17, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Ic Seob KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240234023
    • Publication date Jul 11, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Jong Pil LEE
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20240177909
    • Publication date May 30, 2024
    • Samsung Electro-Mechanics Co., Ltd.
    • Ic Seob KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20220399161
    • Publication date Dec 15, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Ju Hwan YANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20220392697
    • Publication date Dec 8, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Yoon Mi Cha
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20220384086
    • Publication date Dec 1, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Mo LIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20220157510
    • Publication date May 19, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • Ju Hwan Yang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20220148794
    • Publication date May 12, 2022
    • Samsung Electro-Mechanics Co., Ltd.
    • No Il PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20210383959
    • Publication date Dec 9, 2021
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Mo LIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20210350976
    • Publication date Nov 11, 2021
    • Samsung Electro-Mechanics Co., Ltd.
    • Byung Soo KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20200381170
    • Publication date Dec 3, 2020
    • Samsung Electro-Mechanics Co., Ltd.
    • No Il PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL ELECTRONIC COMPONENT
    • Publication number 20200350115
    • Publication date Nov 5, 2020
    • Samsung Electro-Mechanics Co., Ltd.
    • In Young KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20200118729
    • Publication date Apr 16, 2020
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Mo LIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20200035404
    • Publication date Jan 30, 2020
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Mo LIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20200020477
    • Publication date Jan 16, 2020
    • Samsung Electro-Mechanics Co., Ltd.
    • Byung Soo KANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20190304664
    • Publication date Oct 3, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Seung Hee OH
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20190259529
    • Publication date Aug 22, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Tai Yon CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    COIL COMPONENT
    • Publication number 20190259526
    • Publication date Aug 22, 2019
    • Samsung Electro-Mechanics Co., Ltd.
    • Tai Yon CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MAGNETIC SHEET AND ELECTRONIC DEVICE
    • Publication number 20180240582
    • Publication date Aug 23, 2018
    • Samsung Electro-Mechanics Co., Ltd.
    • Jung Young CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    • Publication number 20160307693
    • Publication date Oct 20, 2016
    • Samsung Electro-Mechanics Co., Ltd.
    • Tai Yon Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE HAVING CONTACT PLUG AND METHOD OF MANUFACTURIN...
    • Publication number 20140327056
    • Publication date Nov 6, 2014
    • Samsung Electronics Co., Ltd.
    • Jung-hwan Park
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TANTALUM CAPACITOR
    • Publication number 20130063870
    • Publication date Mar 14, 2013
    • Tai Yon CHO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    METHOD OF MANUFACTURING SOLID ELECTROLYTIC CAPACITOR
    • Publication number 20120084954
    • Publication date Apr 12, 2012
    • Samsung Electro-Mechanics CO., LTD.
    • Tai Yon Cho
    • C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
  • Information Patent Application

    SYSTEM FOR CONTROLLING BRIGHTNESS FLICKER OF PARALLAX BARRIER LCD T...
    • Publication number 20110006979
    • Publication date Jan 13, 2011
    • NDIS Corporation
    • Kwan-Sik Min
    • H04 - ELECTRIC COMMUNICATION TECHNIQUE
  • Information Patent Application

    SEMICONDUCTOR DEVICE HAVING FUSE PATTERN AND METHODS OF FABRICATING...
    • Publication number 20090236688
    • Publication date Sep 24, 2009
    • Samsung Electronics Co., Ltd.
    • Tai-Heui Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of fabricating a semiconductor device and semiconductor devi...
    • Publication number 20080029899
    • Publication date Feb 7, 2008
    • Du-heon Song
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Method of forming a pattern and method of manufacturing a semicondu...
    • Publication number 20070269979
    • Publication date Nov 22, 2007
    • Tai-Heui Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Integrated circuit devices having corrosion resistant fuse regions...
    • Publication number 20070114635
    • Publication date May 24, 2007
    • Tai-Heui Cho
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor device having fuse pattern and methods of fabricating...
    • Publication number 20060214260
    • Publication date Sep 28, 2006
    • Samsung Electronics Co., Ltd.
    • Tai-Heui Cho
    • H01 - BASIC ELECTRIC ELEMENTS