Taichi Nakamura

Person

Nagoya-Shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding structure and semiconductor device manufacturing apparatus
- Patent number 8,480,806
- Issue date Jul 9, 2013
- NGK Insulators, Ltd.
- Taichi Nakamura
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding structure and semiconductor device manufacturing apparatus
- Patent number 8,414,704
- Issue date Apr 9, 2013
- NGK Insulators, Ltd.
- Tomoyuki Fujii
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Bonding structure for a terminal of a susceptor of a semiconductor...
- Patent number 8,193,629
- Issue date Jun 5, 2012
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Shaft portion of an apparatus for holding and heating semiconductor...
- Patent number D647549
- Issue date Oct 25, 2011
- NGK Insulators, Ltd.
- Taichi Nakamura
- D15 - Machines not elsewhere specified
Information Patent Grant
Shaft portion of an apparatus for holding and heating semiconductor...
- Patent number D645889
- Issue date Sep 27, 2011
- NGK Insulators, Ltd.
- Taichi Nakamura
- D15 - Machines not elsewhere specified
Information Patent Grant
Shaft portion of an apparatus for holding and heating semiconductor...
- Patent number D641030
- Issue date Jul 5, 2011
- NGK Insulators, Ltd.
- Taichi Nakamura
- D15 - Machines not elsewhere specified
Information Patent Grant
Shaft portion of an apparatus for holding and heating semiconductor...
- Patent number D641031
- Issue date Jul 5, 2011
- NGK Insulators, Ltd.
- Taichi Nakamura
- D15 - Machines not elsewhere specified
Information Patent Grant
Shaft portion of an apparatus for holding and heating semiconductor...
- Patent number D630657
- Issue date Jan 11, 2011
- NGK Insulators, Ltd.
- Taichi Nakamura
- D15 - Machines not elsewhere specified

Patents Applicationslast 30 patents

Information Patent Application
BONDING STRUCTURE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS
- Publication number 20090173449
- Publication date Jul 9, 2009
- NGK Insulators, Ltd.
- Taichi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS
- Publication number 20090173448
- Publication date Jul 9, 2009
- NGK Insulators, Ltd.
- Tomoyuki FUJII
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BONDING STRUCTURE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS
- Publication number 20090176065
- Publication date Jul 9, 2009
- NGK Insulators, Ltd.
- Hiroshi Takebayashi
- H01 - BASIC ELECTRIC ELEMENTS

Taichi Nakamura

Person

Patents Grantslast 30 patents

Bonding structure and semiconductor device manufacturing apparatus

Bonding structure and semiconductor device manufacturing apparatus

Bonding structure for a terminal of a susceptor of a semiconductor...

Shaft portion of an apparatus for holding and heating semiconductor...

Shaft portion of an apparatus for holding and heating semiconductor...

Shaft portion of an apparatus for holding and heating semiconductor...

Shaft portion of an apparatus for holding and heating semiconductor...

Shaft portion of an apparatus for holding and heating semiconductor...

Patents Applicationslast 30 patents

BONDING STRUCTURE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS

BONDING STRUCTURE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS

BONDING STRUCTURE AND SEMICONDUCTOR DEVICE MANUFACTURING APPARATUS