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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and semiconductor device array
Patent number
11,322,478
Issue date
May 3, 2022
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic part embedded substrate and method of producing an elect...
Patent number
10,134,680
Issue date
Nov 20, 2018
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Electronic part embedded substrate and method of producing an elect...
Patent number
9,768,122
Issue date
Sep 19, 2017
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, semiconductor package, method for manufacturi...
Patent number
9,564,364
Issue date
Feb 7, 2017
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip embedded substrate and method of producing the same
Patent number
9,451,702
Issue date
Sep 20, 2016
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method for manufacturing semiconductor device
Patent number
9,048,225
Issue date
Jun 2, 2015
Shinko Electric Industries Co., Ltd.
Sumihiro Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip embedded substrate and method of producing the same
Patent number
8,793,868
Issue date
Aug 5, 2014
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package having a silicon reinforcing member embedded...
Patent number
8,779,573
Issue date
Jul 15, 2014
Shinko Electric Industries Co., Ltd.
Syota Miki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device with reinforcement plate and method of forming...
Patent number
8,564,116
Issue date
Oct 22, 2013
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device having a multilayer structure
Patent number
8,415,796
Issue date
Apr 9, 2013
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing an electronic parts packaging structure
Patent number
8,402,644
Issue date
Mar 26, 2013
Shinko Electric Industries Co., Ltd.
Toshio Gomyo
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Manufacturing method of substrate with through electrode
Patent number
8,349,733
Issue date
Jan 8, 2013
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and method of manufacturing the same
Patent number
8,299,586
Issue date
Oct 30, 2012
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and stacked layer type semiconductor package
Patent number
8,253,229
Issue date
Aug 28, 2012
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor-device mounted board and method of manufacturing the...
Patent number
8,232,639
Issue date
Jul 31, 2012
Shinko Electric Industries Co., Ltd.
Toshio Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
8,211,754
Issue date
Jul 3, 2012
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method therefor
Patent number
8,193,617
Issue date
Jun 5, 2012
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wiring board and method of manufacturing the same
Patent number
8,183,469
Issue date
May 22, 2012
Shinko Electric Industries Co., Ltd.
Masahiro Sunohara
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method of preparing a substrate with forming and remo...
Patent number
8,129,259
Issue date
Mar 6, 2012
Shinko Electric Industries Co., Ltd.
Yoichi Harayama
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device manufacturing method and electronic device
Patent number
8,102,048
Issue date
Jan 24, 2012
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate with built-in electronic component and method for manufac...
Patent number
7,994,431
Issue date
Aug 9, 2011
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Chip embedded substrate and method of producing the same
Patent number
7,989,707
Issue date
Aug 2, 2011
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Manufacturing method for semiconductor device embedded substrate
Patent number
7,985,619
Issue date
Jul 26, 2011
Shinko Electric Industries Co., Ltd.
Toshio Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method for semiconductor device embedded substrate
Patent number
7,981,724
Issue date
Jul 19, 2011
Shinko Electric Industries Co., Ltd.
Toshio Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of manufacturing semiconductor device
Patent number
7,964,493
Issue date
Jun 21, 2011
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming wiring on insulating resin layer
Patent number
7,955,454
Issue date
Jun 7, 2011
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of manufacturing wiring board
Patent number
7,937,828
Issue date
May 10, 2011
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device and its manufacturing method
Patent number
7,919,843
Issue date
Apr 5, 2011
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Manufacturing method for semiconductor device embedded substrate
Patent number
7,915,078
Issue date
Mar 29, 2011
Shinko Electric Industries Co., Ltd.
Toshio Kobayashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and manufacturing method thereof
Patent number
7,906,833
Issue date
Mar 15, 2011
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ARRAY
Publication number
20200365556
Publication date
Nov 19, 2020
Shinko Electric Industries Co., Ltd.
Takaharu YAMANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
Publication number
20170365559
Publication date
Dec 21, 2017
Shinko Electric Industries Co., Ltd.
Takaharu YAMANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PART EMBEDDED SUBSTRATE AND METHOD OF PRODUCING AN ELECT...
Publication number
20160358858
Publication date
Dec 8, 2016
Shinko Electric Industries Co., Ltd.
Takaharu YAMANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
Publication number
20140313681
Publication date
Oct 23, 2014
Takaharu YAMANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20140239508
Publication date
Aug 28, 2014
Shinko Electric Industries Co., LTD.
Sumihiro Ichikawa
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURI...
Publication number
20130037943
Publication date
Feb 14, 2013
Shinko Electric Industries Co., LTD.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20120153507
Publication date
Jun 21, 2012
Shinko Electric Industries Co., Ltd.
Syota MIKI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGES AND A SEMICONDUCTOR...
Publication number
20110316152
Publication date
Dec 29, 2011
Shinko Electric Industries Co., Ltd.
Syota Miki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE
Publication number
20110309498
Publication date
Dec 22, 2011
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
Publication number
20110256662
Publication date
Oct 20, 2011
Shinko Electric Industries Co., Ltd.
Takaharu YAMANO
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
SEMICONDUCTOR-DEVICE MOUNTED BOARD AND METHOD OF MANUFACTURING THE...
Publication number
20110127656
Publication date
Jun 2, 2011
Shinko Electric Industries Co., Ltd.
Toshio KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20110095404
Publication date
Apr 28, 2011
Shinko Electric Industries Co., Ltd.
Takaharu YAMANO
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic parts packaging structure and method of manufacturing th...
Publication number
20110039370
Publication date
Feb 17, 2011
Shinko Electric Industries Co., Ltd.
Toshio Gomyo
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Publication number
20110003433
Publication date
Jan 6, 2011
Shinko Electric Industries Co., Ltd.
Yoichi HARAYAMA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE WITH REINFORCEMENT PLATE AND METHOD OF FORMING...
Publication number
20100320594
Publication date
Dec 23, 2010
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE
Publication number
20100112804
Publication date
May 6, 2010
Shinko Electric Industries Co., Ltd.
Toshio KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE
Publication number
20100112759
Publication date
May 6, 2010
Shinko Electric Industries Co., Ltd.
Toshio KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE EMBEDDED SUBSTRATE
Publication number
20100112802
Publication date
May 6, 2010
Shinko Electric Industries Co., Ltd.
Toshio KOBAYASHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20100041183
Publication date
Feb 18, 2010
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic apparatus and manufacturing method thereof
Publication number
20100022035
Publication date
Jan 28, 2010
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
Publication number
20090321896
Publication date
Dec 31, 2009
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
Publication number
20090302471
Publication date
Dec 10, 2009
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRING BOARD AND METHOD OF MANUFACTURING THE SAME
Publication number
20090183911
Publication date
Jul 23, 2009
Shinko Electric Industries Co., Ltd.
Masahiro SUNOHARA
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
Publication number
20090170307
Publication date
Jul 2, 2009
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
Publication number
20090127665
Publication date
May 21, 2009
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC APPARATUS AND MANUFACTURING METHOD THEREOF
Publication number
20090085222
Publication date
Apr 2, 2009
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP EMBEDDED SUBSTRATE AND METHOD OF PRODUCING THE SAME
Publication number
20090008765
Publication date
Jan 8, 2009
Takaharu Yamano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
Publication number
20090001570
Publication date
Jan 1, 2009
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
Publication number
20090001569
Publication date
Jan 1, 2009
Shinko Electric Industries Co., Ltd.
Yoshihiro Machida
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICE MANUFACTURING METHOD AND ELECTRONIC DEVICE
Publication number
20080315413
Publication date
Dec 25, 2008
Shinko Electric Industries Co., Ltd.
Takaharu Yamano
H01 - BASIC ELECTRIC ELEMENTS