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Takahiro Iijima
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Nagano-shi, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Multilayer wiring substrate for providing a capacitor structure ins...
Patent number
7,352,060
Issue date
Apr 1, 2008
Shinko Electric Industries Co., Ltd.
Noriyoshi Shimizu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device package and method of production and semicondu...
Patent number
7,335,531
Issue date
Feb 26, 2008
Shinko Electric Industries, Co., Ltd.
Takahiro Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package, method of production of same, and semiconduc...
Patent number
7,314,780
Issue date
Jan 1, 2008
Shinko Electric Industries Co., Ltd.
Noriyoshi Shimizu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayered circuit substrate, semiconductor device and method of...
Patent number
7,250,355
Issue date
Jul 31, 2007
Shinko Electric Industries Co., Ltd.
Akio Rokugawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of production of semiconductor package
Patent number
7,033,934
Issue date
Apr 25, 2006
Shinko Electric Industries Co., Ltd.
Takahiro Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayered circuit substrate, semiconductor device and method of...
Patent number
7,019,404
Issue date
Mar 28, 2006
Shinko Electric Industries Co., Ltd.
Akio Rokugawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package, method of production of same, and semiconduc...
Patent number
6,921,977
Issue date
Jul 26, 2005
Shinko Electric Industries Co., Ltd.
Noriyoshi Shimizu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor device package and method of production and semicondu...
Patent number
6,914,322
Issue date
Jul 5, 2005
Shinko Electric Industries Co., Ltd.
Takahiro Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer circuit board and semiconductor device using the same
Patent number
6,891,732
Issue date
May 10, 2005
Shinko Electric Industries Co., Ltd.
Akihito Takano
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of fabricating substrate utilizing an electrophoretic deposi...
Patent number
6,828,224
Issue date
Dec 7, 2004
Shinko Electric Industries Co. Ltd.
Takahiro Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interconnection substrate having metal columns covered by a resin f...
Patent number
6,828,669
Issue date
Dec 7, 2004
Shinko Electric Industries Co., Ltd.
Takahiro Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for manufacturing a wiring board
Patent number
6,783,652
Issue date
Aug 31, 2004
Shinko Electric Industries Co., Ltd.
Takahiro Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Semiconductor package, method of manufacturing the same, and semico...
Patent number
6,764,931
Issue date
Jul 20, 2004
Shinko Electric Industries Co., Ltd.
Takahiro Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Build-up board package for semiconductor devices
Patent number
6,340,841
Issue date
Jan 22, 2002
Shinko Electric Industries Co., Ltd.
Takahiro Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame and method for manufacturing same
Patent number
5,909,053
Issue date
Jun 1, 1999
Shinko Electric Industries Co. Ltd.
Katsuya Fukase
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame and method for manufacturing same
Patent number
5,656,855
Issue date
Aug 12, 1997
Shinko Electric Industries Co., Ltd.
Katsuya Fukase
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Lead frame and method for manufacturing same
Patent number
5,643,433
Issue date
Jul 1, 1997
Shinko Electric Industries Co., Ltd.
Katsuya Fukase
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Circuit board and process for manufacturing same
Patent number
5,153,384
Issue date
Oct 6, 1992
Shinko Electric Industries, Co., Ltd.
Takahiro Iijima
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Multilayered circuit substrate, semiconductor device and method of...
Publication number
20060110838
Publication date
May 25, 2006
Shinko Electric Industries Co., Ltd.
Akio Rokugawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor package, method of production of same, and semiconduc...
Publication number
20050263874
Publication date
Dec 1, 2005
Shinko Electric Industries Co., Ltd.
Noriyoshi Shimizu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer wiring substrate and method of manufacturing multilayer...
Publication number
20050253248
Publication date
Nov 17, 2005
Noriyoshi Shimizu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor device package and method of production and semicondu...
Publication number
20050208705
Publication date
Sep 22, 2005
Shinko Electric Industries, Co., Ltd.
Takahiro Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Wiring substrate manufacturing method
Publication number
20040265482
Publication date
Dec 30, 2004
Shinko Electric Industries Co., Ltd.
Yasuyoshi Horikawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor package and method of production thereof
Publication number
20040238949
Publication date
Dec 2, 2004
Takahiro Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor package, method of production of same, and semiconduc...
Publication number
20040041270
Publication date
Mar 4, 2004
Shinko Electric Industries Co., Ltd.
Noriyoshi Shimizu
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayered circuit substrate, semiconductor device and method of...
Publication number
20030138992
Publication date
Jul 24, 2003
Shinko Electric Industries Co., Ltd.
Akio Rokugawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor device package and method of production and semicondu...
Publication number
20030116843
Publication date
Jun 26, 2003
Takahiro Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Semiconductor device and method for manufacturing same
Publication number
20030094686
Publication date
May 22, 2003
Shinko Electric Industries Co., Ltd.
Takahiro Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package and method of production thereof
Publication number
20030085471
Publication date
May 8, 2003
Takahiro Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multilayer circuit board and semiconductor device using the same
Publication number
20030058630
Publication date
Mar 27, 2003
Akihito Takano
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package, method of manufacturing the same, and semico...
Publication number
20030049885
Publication date
Mar 13, 2003
Takahiro Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor package, method of manufacturing the same, and semico...
Publication number
20030011070
Publication date
Jan 16, 2003
Shinko Electric Industries Co., Ltd.
Takahiro Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Process for producing multilayer circuit board
Publication number
20020083586
Publication date
Jul 4, 2002
Takahiro Iijima
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Process for manufacturing a wiring board
Publication number
20020066672
Publication date
Jun 6, 2002
Takahiro Iijima
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Package for semiconductor devices
Publication number
20010035570
Publication date
Nov 1, 2001
Takahiro Iijima
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Interconnection substrate having metal columns covered by a resin f...
Publication number
20010008309
Publication date
Jul 19, 2001
Takahiro Iijima
H01 - BASIC ELECTRIC ELEMENTS