Takahiro Kumakawa

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Solid electrolytic capacitor including an exterior body that covers...
- Patent number 11,742,150
- Issue date Aug 29, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Renki Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid electrolytic capacitor having a metal film formed on a portio...
- Patent number 11,715,606
- Issue date Aug 1, 2023
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takahiro Kumakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid electrolytic capacitor including anode body penetrating into...
- Patent number 11,295,902
- Issue date Apr 5, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Renki Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solid electrolytic capacitor including a plurality of capacitor ele...
- Patent number 11,227,725
- Issue date Jan 18, 2022
- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Takahiro Kumakawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer and a method of separating the same
- Patent number 8,299,580
- Issue date Oct 30, 2012
- Panasonic Corporation
- Takahiro Kumakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer, method of manufacturing the same and semicondu...
- Patent number 7,964,475
- Issue date Jun 21, 2011
- Panasonic Corporation
- Yukiko Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate
- Patent number 7,859,084
- Issue date Dec 28, 2010
- Panasonic Corporation
- Masaki Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating semiconductor device
- Patent number 7,838,323
- Issue date Nov 23, 2010
- Panasonic Corporation
- Masaki Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate, and semiconductor device and method of man...
- Patent number 7,808,059
- Issue date Oct 5, 2010
- Panasonic Corporation
- Takahiro Kumakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor substrate, and semiconductor device and method of man...
- Patent number 7,754,584
- Issue date Jul 13, 2010
- Panasonic Corporation
- Takahiro Kumakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method for the fabrication thereof
- Patent number 6,924,173
- Issue date Aug 2, 2005
- Matsushita Electric Industrial Co., Ltd.
- Kazumi Watase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 6,852,616
- Issue date Feb 8, 2005
- Matsushita Electric Industrial Co., Ltd.
- Ryuichi Sahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,812,573
- Issue date Nov 2, 2004
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for the fabrication thereof
- Patent number 6,559,528
- Issue date May 6, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kazumi Watase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for producing the same
- Patent number 6,512,298
- Issue date Jan 28, 2003
- Matsushita Electric Industrial Co., Ltd.
- Ryuichi Sahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,313,532
- Issue date Nov 6, 2001
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD
- Publication number 20240387444
- Publication date Nov 21, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAHIRO KUMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING METAL FILM, METHOD OF MANUFACTURING SOLID E...
- Publication number 20240234039
- Publication date Jul 11, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takahiro KUMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING METAL FILM, METHOD OF MANUFACTURING SOLID E...
- Publication number 20240136124
- Publication date Apr 25, 2024
- Panasonic Intellectual Property Management Co., Ltd.
- Takahiro KUMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230352247
- Publication date Nov 2, 2023
- Panasonic Intellectual Property Management Co., Ltd.
- Renki YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLYTIC CAPACITOR
- Publication number 20220399168
- Publication date Dec 15, 2022
- Panasonic Intellectual Property Management Co., Ltd.
- Shinya SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING METAL FILM, METHOD OF MANUFACTURING SOLID E...
- Publication number 20210383981
- Publication date Dec 9, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Takahiro KUMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210383982
- Publication date Dec 9, 2021
- Panasonic Intellectual Property Management Co., Ltd.
- Renki YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINED STRUCTURE, JOINING METHOD, AND JOINING MATERIAL
- Publication number 20200373269
- Publication date Nov 26, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAHIRO KUMAKAWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR PRODUCING THE SAME
- Publication number 20200335284
- Publication date Oct 22, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Renki YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR PRODUCING THE SAME
- Publication number 20200194187
- Publication date Jun 18, 2020
- Panasonic Intellectual Property Management Co., Ltd.
- Takahiro KUMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINED STRUCTURE, JOINING METHOD, AND JOINING MATERIAL
- Publication number 20190172810
- Publication date Jun 6, 2019
- Panasonic Intellectual Property Management Co., Ltd.
- TAKAHIRO KUMAKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor substrate, semiconductor device and method of manufac...
- Publication number 20110108957
- Publication date May 12, 2011
- Panasonic Corporation
- Masaki Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20110039365
- Publication date Feb 17, 2011
- PANASONIC CORPORATION
- Masaki UTSUMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110024882
- Publication date Feb 3, 2011
- Panasonic Corp.
- Koji TAKEMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER AND A METHOD OF SEPARATING THE SAME
- Publication number 20100148315
- Publication date Jun 17, 2010
- PANASONIC CORPORATION
- Takahiro KUMAKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20100022046
- Publication date Jan 28, 2010
- PANASONIC CORPORATION
- Masaki UTSUMI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE AND METHOD OF MAN...
- Publication number 20100015781
- Publication date Jan 21, 2010
- Panasonic Corporation
- Takahiro Kumakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFAC...
- Publication number 20090218660
- Publication date Sep 3, 2009
- Panasonic Corporation
- Masaki Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090108410
- Publication date Apr 30, 2009
- Koji Takemura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer with division guide pattern
- Publication number 20080203538
- Publication date Aug 28, 2008
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Kumakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR WAFER, METHOD OF MANUFACTURING THE SAME AND SEMICONDU...
- Publication number 20080135975
- Publication date Jun 12, 2008
- Matsushita Electric Industrial Co., Ltd.
- Yukiko Haraguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating semiconductor device
- Publication number 20070287215
- Publication date Dec 13, 2007
- Masaki Utsumi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor substrate, and semiconductor device and method of man...
- Publication number 20070264803
- Publication date Nov 15, 2007
- Matsushita Electric Industrial Co., Ltd.
- Takahiro Kumakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor wafer, semiconductor device manufacturing method, and...
- Publication number 20060163699
- Publication date Jul 27, 2006
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takahiro Kumakawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20050006749
- Publication date Jan 13, 2005
- Matsushita Electric Industrial Co., Ltd.
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for the fabrication thereof
- Publication number 20030194834
- Publication date Oct 16, 2003
- Matsushita Electric Industrial Co., Ltd.
- Kazumi Watase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20020151104
- Publication date Oct 17, 2002
- Matsushita Electric Industrial Co., Ltd.
- Ryuichi Sahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for producing the same
- Publication number 20020063340
- Publication date May 30, 2002
- Ryuichi Sahara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20020000655
- Publication date Jan 3, 2002
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20010033021
- Publication date Oct 25, 2001
- Nozomi Shimoishizaka
- H01 - BASIC ELECTRIC ELEMENTS

Takahiro Kumakawa

Person

Patents Grantslast 30 patents

Solid electrolytic capacitor including an exterior body that covers...

Solid electrolytic capacitor having a metal film formed on a portio...

Solid electrolytic capacitor including anode body penetrating into...

Solid electrolytic capacitor including a plurality of capacitor ele...

Semiconductor wafer and a method of separating the same

Semiconductor wafer, method of manufacturing the same and semicondu...

Semiconductor substrate

Method for fabricating semiconductor device

Semiconductor substrate, and semiconductor device and method of man...

Semiconductor substrate, and semiconductor device and method of man...

Semiconductor device and method for the fabrication thereof

Semiconductor device and method for producing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for the fabrication thereof

Semiconductor device and method for producing the same

Semiconductor device and method for manufacturing the same

Patents Applicationslast 30 patents

FLIP-CHIP MOUNTING STRUCTURE AND FLIP-CHIP MOUNTING METHOD

METHOD OF MANUFACTURING METAL FILM, METHOD OF MANUFACTURING SOLID E...

METHOD OF MANUFACTURING METAL FILM, METHOD OF MANUFACTURING SOLID E...

SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

ELECTROLYTIC CAPACITOR

METHOD OF MANUFACTURING METAL FILM, METHOD OF MANUFACTURING SOLID E...

SOLID ELECTROLYTIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME

JOINED STRUCTURE, JOINING METHOD, AND JOINING MATERIAL

SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR PRODUCING THE SAME

SOLID ELECTROLYTIC CAPACITOR AND METHOD FOR PRODUCING THE SAME

JOINED STRUCTURE, JOINING METHOD, AND JOINING MATERIAL

Semiconductor substrate, semiconductor device and method of manufac...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR WAFER AND A METHOD OF SEPARATING THE SAME

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

SEMICONDUCTOR SUBSTRATE, AND SEMICONDUCTOR DEVICE AND METHOD OF MAN...

SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFAC...

SEMICONDUCTOR DEVICE

Semiconductor wafer with division guide pattern

SEMICONDUCTOR WAFER, METHOD OF MANUFACTURING THE SAME AND SEMICONDU...

Method for fabricating semiconductor device

Semiconductor substrate, and semiconductor device and method of man...

Semiconductor wafer, semiconductor device manufacturing method, and...

Semiconductor device and method for manufacturing the same

Semiconductor device and method for the fabrication thereof

Semiconductor device and method for producing the same

Semiconductor device and method for producing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same