Takahisa Yamaha

Person

Hamamatsu-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of forming a bonding pad structure
- Patent number 7,211,902
- Issue date May 1, 2007
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a bonding pad structure
- Patent number 7,067,928
- Issue date Jun 27, 2006
- Yamaha Corpoation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device
- Patent number 6,921,714
- Issue date Jul 26, 2005
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor device with small variation in...
- Patent number 6,888,183
- Issue date May 3, 2005
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer wiring structure of integrated circuit and manufacture...
- Patent number 6,555,465
- Issue date Apr 29, 2003
- Yamaha Corp.
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacture method for semiconductor with small variation in MOS th...
- Patent number 6,541,373
- Issue date Apr 1, 2003
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding pad structure of semiconductor device
- Patent number 6,297,563
- Issue date Oct 2, 2001
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 6,251,805
- Issue date Jun 26, 2001
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having manufacturing wiring structure with bur...
- Patent number 6,150,720
- Issue date Nov 21, 2000
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing wiring structure having buried plugs in sem...
- Patent number 6,146,998
- Issue date Nov 14, 2000
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device having a multi-layered...
- Patent number 6,080,652
- Issue date Jun 27, 2000
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming wiring layer
- Patent number 6,060,390
- Issue date May 9, 2000
- Yamaha Corporation
- Masaru Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 5,998,814
- Issue date Dec 7, 1999
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating multi-layered wiring
- Patent number 5,997,754
- Issue date Dec 7, 1999
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming wiring structure
- Patent number 5,904,576
- Issue date May 18, 1999
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip capable of suppressing cracks in the insulating...
- Patent number 5,885,857
- Issue date Mar 23, 1999
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming multi-layer wiring utilizing SOG
- Patent number 5,821,162
- Issue date Oct 13, 1998
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOS transistor with good hot carrier resistance and low interface s...
- Patent number 5,793,110
- Issue date Aug 11, 1998
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with moisture impervious film
- Patent number 5,786,638
- Issue date Jul 28, 1998
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture resistant semiconductor device
- Patent number 5,786,625
- Issue date Jul 28, 1998
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip capable of supressing cracks in insulating layer
- Patent number 5,763,936
- Issue date Jun 9, 1998
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming multi-layer wiring utilizing hydrogen silsesquiox...
- Patent number 5,750,403
- Issue date May 12, 1998
- Yamaha Corporation
- Yushi Inoue
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of making a semiconductor device with moisture impervious film
- Patent number 5,733,797
- Issue date Mar 31, 1998
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a wiring layer of a semiconductor device using re...
- Patent number 5,716,869
- Issue date Feb 10, 1998
- Yamaha Corporation
- Satoshi Hibino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing aluminum wiring at a substrate temperature...
- Patent number 5,705,429
- Issue date Jan 6, 1998
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor IC with multilayered Al wiring
- Patent number 5,641,993
- Issue date Jun 24, 1997
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of preventing humidity invasion
- Patent number 5,629,557
- Issue date May 13, 1997
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device capable of preventing humidity invasion
- Patent number 5,593,925
- Issue date Jan 14, 1997
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer wiring structure having continuous grain boundaries
- Patent number 5,428,251
- Issue date Jun 27, 1995
- Yamaha Corporation
- Masaru Naito
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a multi-level wiring structure
- Patent number 5,036,382
- Issue date Jul 30, 1991
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of forming a bonding pad structure
- Publication number 20060138662
- Publication date Jun 29, 2006
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming a bonding pad structure
- Publication number 20050146042
- Publication date Jul 7, 2005
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layer wiring structure of integrated circuit and manufacture...
- Publication number 20030003707
- Publication date Jan 2, 2003
- Yamaha Corp.
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacture method for semiconductor with small variation in MOS th...
- Publication number 20020045339
- Publication date Apr 18, 2002
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a semiconductor device
- Publication number 20020006717
- Publication date Jan 17, 2002
- Yamaha Corporation
- Takahisa Yamaha
- H01 - BASIC ELECTRIC ELEMENTS

Takahisa Yamaha

Person

Patents Grantslast 30 patents

Method of forming a bonding pad structure

Method of forming a bonding pad structure

Method for manufacturing a semiconductor device

Manufacture method for semiconductor device with small variation in...

Multi-layer wiring structure of integrated circuit and manufacture...

Manufacture method for semiconductor with small variation in MOS th...

Bonding pad structure of semiconductor device

Method of fabricating semiconductor device

Semiconductor device having manufacturing wiring structure with bur...

Method of manufacturing wiring structure having buried plugs in sem...

Method of fabricating a semiconductor device having a multi-layered...

Method of forming wiring layer

Semiconductor device and fabrication method thereof

Method of fabricating multi-layered wiring

Method of forming wiring structure

Semiconductor chip capable of suppressing cracks in the insulating...

Method of forming multi-layer wiring utilizing SOG

MOS transistor with good hot carrier resistance and low interface s...

Semiconductor device with moisture impervious film

Moisture resistant semiconductor device

Semiconductor chip capable of supressing cracks in insulating layer

Method of forming multi-layer wiring utilizing hydrogen silsesquiox...

Method of making a semiconductor device with moisture impervious film

Method of forming a wiring layer of a semiconductor device using re...

Method of manufacturing aluminum wiring at a substrate temperature...

Semiconductor IC with multilayered Al wiring

Semiconductor device capable of preventing humidity invasion

Semiconductor device capable of preventing humidity invasion

Multi-layer wiring structure having continuous grain boundaries

Semiconductor device having a multi-level wiring structure

Patents Applicationslast 30 patents

Method of forming a bonding pad structure

Method of forming a bonding pad structure

Multi-layer wiring structure of integrated circuit and manufacture...

Manufacture method for semiconductor with small variation in MOS th...

Method for manufacturing a semiconductor device