Takaishi Kazushige

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epitaxial silicon wafer and production method thereof
- Patent number 9,190,267
- Issue date Nov 17, 2015
- SUMCO Corporation
- Takayuki Kihara
- B24 - GRINDING POLISHING
Information Patent Grant
Wafer polishing method
- Patent number 8,900,033
- Issue date Dec 2, 2014
- Sumco Corporation
- Kazushige Takaishi
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing epitaxial wafer
- Patent number 8,759,229
- Issue date Jun 24, 2014
- Sumco Corporation
- Sakae Koyata
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method for producing epitaxial silicon wafer
- Patent number 8,728,942
- Issue date May 20, 2014
- Sumico Corporation
- Shinichi Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for etching single wafer
- Patent number 8,466,071
- Issue date Jun 18, 2013
- Sumco Corporation
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of polishing silicon wafer
- Patent number 8,147,295
- Issue date Apr 3, 2012
- Sumco Corporation
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial silicon wafer and production method thereof
- Patent number 8,080,106
- Issue date Dec 20, 2011
- SUMCO Corporation
- Takayuki Kihara
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for etching wafer by single-wafer process and single wafe...
- Patent number 8,066,896
- Issue date Nov 29, 2011
- Sumco Corporation
- Sakae Koyata
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing epitaxial wafer
- Patent number 7,998,867
- Issue date Aug 16, 2011
- Sumco Corporation
- Kazushige Takaishi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for smoothing wafer surface and apparatus used therefor
- Patent number 7,955,982
- Issue date Jun 7, 2011
- Sumco Corporation
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning silicon wafer and apparatus for cleaning the si...
- Patent number 7,955,440
- Issue date Jun 7, 2011
- Sumco Corporation
- Shigeru Okuuchi
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Single wafer etching method
- Patent number 7,906,438
- Issue date Mar 15, 2011
- Sumco Corporation
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Alkaline etchant for controlling surface roughness of semiconductor...
- Patent number 7,851,375
- Issue date Dec 14, 2010
- Sumco Corporation
- Sakae Koyata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Wafer polishing apparatus and method for polishing wafers
- Patent number 7,717,768
- Issue date May 18, 2010
- Sumco Corporation
- Tomohiro Hashii
- B24 - GRINDING POLISHING
Information Patent Grant
Process for producing silicon wafer
- Patent number 7,648,890
- Issue date Jan 19, 2010
- Sumco Corporation
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of silicon wafer
- Patent number 7,645,702
- Issue date Jan 12, 2010
- Sumco Corporation
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of processing silicon wafer
- Patent number 7,601,642
- Issue date Oct 13, 2009
- Sumco Corporation
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing silicon wafers
- Patent number 7,601,644
- Issue date Oct 13, 2009
- Sumco Corporation
- Sakae Koyata
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for etching wafer by single-wafer process
- Patent number 7,488,400
- Issue date Feb 10, 2009
- Sumco Corporation
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a silicon wafer
- Patent number 7,456,106
- Issue date Nov 25, 2008
- Sumitomo Mitsubishi Silicon Corporation
- Sakae Koyata
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing single-side mirror surface wafer
- Patent number 7,338,904
- Issue date Mar 4, 2008
- Sumco Corporation
- Sakae Koyata
- B24 - GRINDING POLISHING
Information Patent Grant
Method for producing a silicon wafer
- Patent number 7,226,864
- Issue date Jun 5, 2007
- Sumitomo Mitsubishi Silicon Corporation
- Sakae Koyata
- B24 - GRINDING POLISHING
Information Patent Grant
Washing solution of semiconductor substrate and washing method usin...
- Patent number 6,296,714
- Issue date Oct 2, 2001
- Mitsubishi Materials Silicon Corporation
- Chizuko Matsuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment method for semiconductor substrates
- Patent number 6,146,467
- Issue date Nov 14, 2000
- Mitsubishi Materials Silicon Corporation
- Kazushige Takaishi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF DOUBLE-SIDE POLISHING WORK, METHOD OF PRODUCING WORK, AND...
- Publication number 20230201993
- Publication date Jun 29, 2023
- SUMCO CORPORATION
- Kazushige TAKAISHI
- B24 - GRINDING POLISHING
Information Patent Application
WAFER POLISHING METHOD
- Publication number 20130017763
- Publication date Jan 17, 2013
- Kazushige Takaishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING EPITAXIAL SILICON WAFER
- Publication number 20120156878
- Publication date Jun 21, 2012
- SUMCO CORPORATION
- Shinichi Ogata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SILICON WAFER AND PRODUCTION METHOD THEREOF
- Publication number 20120056307
- Publication date Mar 8, 2012
- SUMCO CORPORATION
- Takayuki Kihara
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR MANUFACTURING EPITAXIAL WAFER
- Publication number 20100261341
- Publication date Oct 14, 2010
- SUMCO CORPORATION
- Kazushige Takaishi
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR CLEANING SILICON WAFER AND APPARATUS FOR CLEANING THE SI...
- Publication number 20100252070
- Publication date Oct 7, 2010
- SUMCO CORPORATION
- Shigeru Okuuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL WAFER
- Publication number 20100237470
- Publication date Sep 23, 2010
- SUMCO CORPORATION
- Kazushige Takaishi
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR SMOOTHING WAFER SURFACE AND APPARATUS USED THEREFOR
- Publication number 20100151597
- Publication date Jun 17, 2010
- SUMCO CORPORATION
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SILICON WAFER AND PRODUCTION METHOD THEREOF
- Publication number 20100032806
- Publication date Feb 11, 2010
- Sumco Corporation
- Takayuki Kihara
- B24 - GRINDING POLISHING
Information Patent Application
WAFER MANUFACTURING METHOD AND WAFER OBTAINED THROUGH THE METHOD
- Publication number 20100021688
- Publication date Jan 28, 2010
- SUMCO CORPORATION
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING SEMICONDUCTOR WAFER
- Publication number 20100006982
- Publication date Jan 14, 2010
- SUMCO CORPORATION
- Tomohiro Hashii
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR WAFER AND PRODUCTION METHOD THEREOF
- Publication number 20100009155
- Publication date Jan 14, 2010
- SUMCO CORPORATION
- Tomohiro Hashii
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR WAFER
- Publication number 20090311460
- Publication date Dec 17, 2009
- SUMCO CORPORATION
- Tomohiro HASHII
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR HOLDING SILICON WAFER
- Publication number 20090304490
- Publication date Dec 10, 2009
- Takayuki Kihara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL SILICON WAFER AND METHOD FOR PRODUCING THE SAME
- Publication number 20090304975
- Publication date Dec 10, 2009
- SUMCO CORPORATION
- Seiji SUGIMOTO
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD OF GRINDING SEMICONDUCTOR WAFERS AND DEVICE FOR GRINDING BOT...
- Publication number 20090298397
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Yasunori YAMADA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF POLISHING SILICON WAFER
- Publication number 20090298394
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON WAFER
- Publication number 20090294910
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo KATOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR THIN FILM-ATTACHED SUBSTRATE AND PRODUCTION METHOD TH...
- Publication number 20090297867
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo KATOH
- B32 - LAYERED PRODUCTS
Information Patent Application
SEMICONDUCTOR WAFER
- Publication number 20090294918
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo KATOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON WAFER
- Publication number 20090297426
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo KATOH
- C30 - CRYSTAL GROWTH
Information Patent Application
METHOD FOR CLEANING SEMICONDUCTOR WAFER
- Publication number 20090293919
- Publication date Dec 3, 2009
- SUMCO CORPORATION
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SLURRY FOR WIRE SAW
- Publication number 20090211167
- Publication date Aug 27, 2009
- SUMCO CORPORATION
- Satoshi MATAGAWA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SINGLE WAFER ETCHING APPARATUS
- Publication number 20090186488
- Publication date Jul 23, 2009
- KATOH Takeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single-Wafer Etching Method for Wafer and Etching Apparatus Thereof
- Publication number 20090181546
- Publication date Jul 16, 2009
- Takeo Katoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etching Method of Single Wafer
- Publication number 20090117749
- Publication date May 7, 2009
- SUMCO CORPORATION
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Epitaxial Wafer
- Publication number 20090053894
- Publication date Feb 26, 2009
- Sakae Koyata
- C30 - CRYSTAL GROWTH
Information Patent Application
ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL AND METHOD FOR MANU...
- Publication number 20090042390
- Publication date Feb 12, 2009
- Sakae Koyata
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for Etching Single Wafer
- Publication number 20090004876
- Publication date Jan 1, 2009
- Sakae Koyata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SILICON WAFER
- Publication number 20080214094
- Publication date Sep 4, 2008
- Takeo KATOH
- B24 - GRINDING POLISHING

Takaishi Kazushige

Person

Patents Grantslast 30 patents

Epitaxial silicon wafer and production method thereof

Wafer polishing method

Method for manufacturing epitaxial wafer

Method for producing epitaxial silicon wafer

Method for etching single wafer

Method of polishing silicon wafer

Epitaxial silicon wafer and production method thereof

Apparatus for etching wafer by single-wafer process and single wafe...

Method for manufacturing epitaxial wafer

Method for smoothing wafer surface and apparatus used therefor

Method for cleaning silicon wafer and apparatus for cleaning the si...

Single wafer etching method

Alkaline etchant for controlling surface roughness of semiconductor...

Wafer polishing apparatus and method for polishing wafers

Process for producing silicon wafer

Manufacturing method of silicon wafer

Method of processing silicon wafer

Method for manufacturing silicon wafers

Apparatus for etching wafer by single-wafer process

Method for producing a silicon wafer

Method for manufacturing single-side mirror surface wafer

Method for producing a silicon wafer

Washing solution of semiconductor substrate and washing method usin...

Treatment method for semiconductor substrates

Patents Applicationslast 30 patents

METHOD OF DOUBLE-SIDE POLISHING WORK, METHOD OF PRODUCING WORK, AND...

WAFER POLISHING METHOD

METHOD FOR PRODUCING EPITAXIAL SILICON WAFER

EPITAXIAL SILICON WAFER AND PRODUCTION METHOD THEREOF

METHOD FOR MANUFACTURING EPITAXIAL WAFER

METHOD FOR CLEANING SILICON WAFER AND APPARATUS FOR CLEANING THE SI...

EPITAXIAL WAFER

METHOD FOR SMOOTHING WAFER SURFACE AND APPARATUS USED THEREFOR

EPITAXIAL SILICON WAFER AND PRODUCTION METHOD THEREOF

WAFER MANUFACTURING METHOD AND WAFER OBTAINED THROUGH THE METHOD

METHOD OF PRODUCING SEMICONDUCTOR WAFER

SEMICONDUCTOR WAFER AND PRODUCTION METHOD THEREOF

SEMICONDUCTOR WAFER

METHOD FOR HOLDING SILICON WAFER

EPITAXIAL SILICON WAFER AND METHOD FOR PRODUCING THE SAME

METHOD OF GRINDING SEMICONDUCTOR WAFERS AND DEVICE FOR GRINDING BOT...

METHOD OF POLISHING SILICON WAFER

SILICON WAFER

SEMICONDUCTOR THIN FILM-ATTACHED SUBSTRATE AND PRODUCTION METHOD TH...

SEMICONDUCTOR WAFER

SILICON WAFER

METHOD FOR CLEANING SEMICONDUCTOR WAFER

SLURRY FOR WIRE SAW

SINGLE WAFER ETCHING APPARATUS

Single-Wafer Etching Method for Wafer and Etching Apparatus Thereof

Etching Method of Single Wafer

Method for Manufacturing Epitaxial Wafer

ETCHANT FOR SILICON WAFER SURFACE SHAPE CONTROL AND METHOD FOR MANU...

Method for Etching Single Wafer

METHOD FOR MANUFACTURING SILICON WAFER