Takako SATO

Person

Nagaokakyo-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer substrate and electric element
- Patent number 11,064,606
- Issue date Jul 13, 2021
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board
- Patent number 10,980,112
- Issue date Apr 13, 2021
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor element
- Patent number 9,424,981
- Issue date Aug 23, 2016
- Murata Manufacturing Co., Ltd.
- Tomoya Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer substrate
- Patent number 9,204,545
- Issue date Dec 1, 2015
- Murata Manufacturing Co., Ltd.
- Shigetoshi Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laminated inductor element and manufacturing method thereof
- Patent number 9,129,733
- Issue date Sep 8, 2015
- Murata Manufacturing Co., Ltd.
- Takako Sato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated inductor element and manufacturing method thereof
- Patent number 8,810,352
- Issue date Aug 19, 2014
- Murata Manufacturing Co., Ltd.
- Tomoya Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for smoothing a surface of an electrode
- Patent number 8,756,775
- Issue date Jun 24, 2014
- Murata Manufacturing Co., Ltd.
- Akiyoshi Kawamura
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing ceramic substrate and ceramic substrate
- Patent number 8,293,358
- Issue date Oct 23, 2012
- Murata Manufacturing Co., Ltd.
- Akiyoshi Kawamura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Method for manufacturing ceramic substrate and ceramic substrate
- Patent number 7,799,156
- Issue date Sep 21, 2010
- Murata Manufacturing Co., Ltd.
- Akiyoshi Kawamura
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
High-frequency module and communication apparatus
- Patent number 7,356,349
- Issue date Apr 8, 2008
- Murata Manufacturing Co., Ltd.
- Koji Furutani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER RESIN SUBSTRATE AND ELECTRONIC COMPONENT
- Publication number 20220046793
- Publication date Feb 10, 2022
- Murata Manufacturing Co., Ltd.
- Takako SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE AND ELECTRIC ELEMENT
- Publication number 20200315010
- Publication date Oct 1, 2020
- Murata Manufacturing Co., Ltd.
- Takako SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER WIR...
- Publication number 20200113050
- Publication date Apr 9, 2020
- Murata Manufacturing Co., Ltd.
- Takako SATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER SUBSTRATE
- Publication number 20150053467
- Publication date Feb 26, 2015
- MURATA MANUFACTURING CO., LTD.
- Shigetoshi Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR ELEMENT
- Publication number 20150022307
- Publication date Jan 22, 2015
- MURATA MANUFACTURING CO., LTD.
- Tomoya Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED INDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF
- Publication number 20130314190
- Publication date Nov 28, 2013
- Murata Manufacturing Co., Ltd.
- Tomoya YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED INDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF
- Publication number 20130314194
- Publication date Nov 28, 2013
- Murata Manufacturing Co., Ltd.
- Takako SATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED INDUCTOR ELEMENT
- Publication number 20130293216
- Publication date Nov 7, 2013
- Tomoya YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE
- Publication number 20100304125
- Publication date Dec 2, 2010
- Murata Manufacturing Co., Ltd.
- Akiyoshi Kawamura
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE
- Publication number 20090305865
- Publication date Dec 10, 2009
- Murata Manufacturing Co., Ltd.
- Akiyoshi Kawamura
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR SMOOTHING ELECTRODE, METHOD FOR MANUFACTURING CERAMIC SU...
- Publication number 20090301764
- Publication date Dec 10, 2009
- Murata Manufacturing Co., Ltd.
- Akiyoshi Kawamura
- B24 - GRINDING POLISHING
Information Patent Application
High-frequency module and communication apparatus
- Publication number 20040248539
- Publication date Dec 9, 2004
- Murata Manufacturing Co., Ltd.
- Koji Furutani
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Takako SATO

Person

Patents Grantslast 30 patents

Multilayer substrate and electric element

Multilayer wiring board

Inductor element

Multilayer substrate

Laminated inductor element and manufacturing method thereof

Laminated inductor element and manufacturing method thereof

Method for smoothing a surface of an electrode

Method for manufacturing ceramic substrate and ceramic substrate

Method for manufacturing ceramic substrate and ceramic substrate

High-frequency module and communication apparatus

Patents Applicationslast 30 patents

MULTILAYER RESIN SUBSTRATE AND ELECTRONIC COMPONENT

MULTILAYER SUBSTRATE AND ELECTRIC ELEMENT

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER WIR...

MULTILAYER SUBSTRATE

INDUCTOR ELEMENT

LAMINATED INDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF

LAMINATED INDUCTOR ELEMENT AND MANUFACTURING METHOD THEREOF

LAMINATED INDUCTOR ELEMENT

METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE

METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE

METHOD FOR SMOOTHING ELECTRODE, METHOD FOR MANUFACTURING CERAMIC SU...

High-frequency module and communication apparatus