Takanori Teshima

Person

Okazaki-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 10,079,226
- Issue date Sep 18, 2018
- Denso Corporation
- Kuniaki Mamitsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with surface electrodes
- Patent number 8,963,315
- Issue date Feb 24, 2015
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor chip and metal plate
- Patent number 8,441,122
- Issue date May 14, 2013
- Denso Corporation
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,125,781
- Issue date Feb 28, 2012
- Denso Corporation
- Kuniaki Mamitsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor module molded by resin with heat radiation plate open...
- Patent number 7,944,045
- Issue date May 17, 2011
- Denso Corporation
- Chikage Noritake
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing mold type semiconductor device
- Patent number 7,468,318
- Issue date Dec 23, 2008
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold type semiconductor device
- Patent number 7,193,326
- Issue date Mar 20, 2007
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer-molded power device and method for manufacturing transfer-...
- Patent number 7,145,254
- Issue date Dec 5, 2006
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a pair of heat sinks and method for man...
- Patent number 7,049,688
- Issue date May 23, 2006
- Denso Corporation
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided cooling type semiconductor module
- Patent number 7,019,395
- Issue date Mar 28, 2006
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with heat radiation structure for removing...
- Patent number 7,009,284
- Issue date Mar 7, 2006
- Denso Corporation
- Yoshimi Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package type semiconductor device
- Patent number 7,009,292
- Issue date Mar 7, 2006
- Denso Corporation
- Shoji Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 6,963,133
- Issue date Nov 8, 2005
- Denso Corporation
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having heat conducting plate
- Patent number 6,946,730
- Issue date Sep 20, 2005
- Denso Corporation
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor power device having heat sinks exposed on one...
- Patent number 6,917,103
- Issue date Jul 12, 2005
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor power device having heat sinks exposed on one...
- Patent number 6,787,898
- Issue date Sep 7, 2004
- Denso Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having radiation structure and method for manu...
- Patent number 6,693,350
- Issue date Feb 17, 2004
- Denso Corporation
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor apparatus with heat radiation structure for removing...
- Patent number 6,538,308
- Issue date Mar 25, 2003
- Denso Corporation
- Yoshimi Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulated gate bipolar transistor
- Patent number 6,384,431
- Issue date May 7, 2002
- Denso Corporation
- Shigeki Takahashi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120119347
- Publication date May 17, 2012
- DENSO CORPORATION
- Kuniaki Mamitsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20110186981
- Publication date Aug 4, 2011
- DENSO CORPORATION
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having semiconductor chip and metal plate and...
- Publication number 20110042741
- Publication date Feb 24, 2011
- DENSO CORPORATION
- Daisuke Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20090224398
- Publication date Sep 10, 2009
- DENSO CORPORATION
- Chikage NORITAKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing mold type semiconductor device
- Publication number 20070158850
- Publication date Jul 12, 2007
- DENSO CORPORATION
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device having a pair of heat...
- Publication number 20060145335
- Publication date Jul 6, 2006
- DENSO CORPORATION
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20060096299
- Publication date May 11, 2006
- Denso Corporation
- Kuniaki Mamitsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor equipment having a pair of heat radiation plates
- Publication number 20060055056
- Publication date Mar 16, 2006
- DENSO Corporation
- Shoji Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package type semiconductor device
- Publication number 20050077599
- Publication date Apr 14, 2005
- DENSO Corporation
- Shoji Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having heat conducting plates
- Publication number 20050073043
- Publication date Apr 7, 2005
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20050073042
- Publication date Apr 7, 2005
- DENSO Corporation
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having a pair of heat sinks and method for man...
- Publication number 20050056927
- Publication date Mar 17, 2005
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mold type semiconductor device and method for manufacturing the same
- Publication number 20040256730
- Publication date Dec 23, 2004
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having radiation structure and method for manu...
- Publication number 20030132530
- Publication date Jul 17, 2003
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor power device
- Publication number 20030122232
- Publication date Jul 3, 2003
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor apparatus with heat radiation structure for removing...
- Publication number 20030075784
- Publication date Apr 24, 2003
- Yoshimi Nakase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transfer-molded power device and method for manufacturing transfer-...
- Publication number 20030022464
- Publication date Jan 30, 2003
- Naohiko Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing semiconductor device
- Publication number 20020158333
- Publication date Oct 31, 2002
- Takanori Teshima
- H01 - BASIC ELECTRIC ELEMENTS

Takanori Teshima

Person

Patents Grantslast 30 patents

Semiconductor device

Semiconductor device with surface electrodes

Semiconductor device having semiconductor chip and metal plate

Semiconductor device

Semiconductor module molded by resin with heat radiation plate open...

Method for manufacturing mold type semiconductor device

Mold type semiconductor device

Transfer-molded power device and method for manufacturing transfer-...

Semiconductor device having a pair of heat sinks and method for man...

Double-sided cooling type semiconductor module

Semiconductor apparatus with heat radiation structure for removing...

Package type semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device having heat conducting plate

Molded semiconductor power device having heat sinks exposed on one...

Molded semiconductor power device having heat sinks exposed on one...

Semiconductor device having radiation structure and method for manu...

Semiconductor apparatus with heat radiation structure for removing...

Insulated gate bipolar transistor

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device having semiconductor chip and metal plate and...

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

Method for manufacturing mold type semiconductor device

Method for manufacturing semiconductor device having a pair of heat...

Semiconductor device

Semiconductor equipment having a pair of heat radiation plates

Package type semiconductor device

Semiconductor device having heat conducting plates

Semiconductor device

Semiconductor device having a pair of heat sinks and method for man...

Mold type semiconductor device and method for manufacturing the same

Semiconductor device having radiation structure and method for manu...

Semiconductor power device

Semiconductor apparatus with heat radiation structure for removing...

Transfer-molded power device and method for manufacturing transfer-...

Semiconductor device and method for manufacturing semiconductor device