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Takao Fukatami
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Aizuwakamatsu, JP
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last 30 patents
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Patent Grant
Lead frame material and lead frame for semiconductor device
Patent number
5,510,197
Issue date
Apr 23, 1996
Mitsubishi Shindoh Co., Ltd.
Shunji Takahashi
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Grant
Copper based alloy for electrical and electronic parts excellent in...
Patent number
5,508,001
Issue date
Apr 16, 1996
Mitsubishi Sindoh Co., Ltd.
Takeshi Suzuki
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information
Patent Grant
Copper-based alloy connector for electrical devices
Patent number
4,971,758
Issue date
Nov 20, 1990
Mitsubishi Shindoh Co., Ltd.
Takeshi Suzuki
C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...