Takao Yamazaki

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Infrared ray sensor package, infrared ray sensor module, and electr...
- Patent number 9,157,805
- Issue date Oct 13, 2015
- NEC Corporation
- Takao Yamazaki
- G01 - MEASURING TESTING
Information Patent Grant
Method of manufacturing a three-dimensional packaging semiconductor...
- Patent number 8,956,915
- Issue date Feb 17, 2015
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Infrared sensor package and electronic device equipped therewith
- Patent number 8,785,853
- Issue date Jul 22, 2014
- NEC Corporation
- Takao Yamazaki
- G01 - MEASURING TESTING
Information Patent Grant
Encapsulating package, printed circuit board, electronic device and...
- Patent number 8,525,323
- Issue date Sep 3, 2013
- NEC Corporation
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device package, module, and electronic device
- Patent number 8,411,450
- Issue date Apr 2, 2013
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,338,940
- Issue date Dec 25, 2012
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,236,616
- Issue date Aug 7, 2012
- NEC Corporation
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure of semiconductor device and electronic apparatus...
- Patent number 8,130,503
- Issue date Mar 6, 2012
- NEC Corporation
- Shinji Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device having electronic components mounted therein and method for...
- Patent number 8,120,921
- Issue date Feb 21, 2012
- NEC Corporation
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting structure of semiconductor device and electronic apparatus...
- Patent number 8,093,706
- Issue date Jan 10, 2012
- NEC Corporation
- Shinji Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 8,093,709
- Issue date Jan 10, 2012
- NEC Corporation
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 7,928,556
- Issue date Apr 19, 2011
- NEC Corporation
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package device, module, and electronic apparatus
- Patent number 7,812,440
- Issue date Oct 12, 2010
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum package and manufacturing process thereof
- Patent number 7,795,585
- Issue date Sep 14, 2010
- NEC Corporation
- Yoshimichi Sogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same, circuit...
- Patent number 7,594,644
- Issue date Sep 29, 2009
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical unit featuring both photoelectric conversion chip and semic...
- Patent number 7,504,701
- Issue date Mar 17, 2009
- NEC Electronics Corporation
- Shigeru Moribayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and laminated semiconductor package
- Patent number 7,230,328
- Issue date Jun 12, 2007
- NEC Corporation
- Ichiro Hazeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same, circuit...
- Patent number 6,998,704
- Issue date Feb 14, 2006
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with decoupling capacitors mounted on conductors
- Patent number 6,949,815
- Issue date Sep 27, 2005
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for packaging same
- Patent number 6,703,705
- Issue date Mar 9, 2004
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device, and thin film capacitor
- Patent number 6,524,905
- Issue date Feb 25, 2003
- NEC Corporation
- Shintaro Yamamichi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor, capacitor mounting structure, method for manufacturing s...
- Patent number 6,515,324
- Issue date Feb 4, 2003
- NEC Corporation
- Akinobu Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional semiconductor device and method of manufacturing...
- Patent number 6,486,540
- Issue date Nov 26, 2002
- NEC Corporation
- Naoji Senba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
VACUUM SEALED PACKAGE, PRINTED CIRCUIT BOARD HAVING VACUUM SEALED P...
- Publication number 20140022718
- Publication date Jan 23, 2014
- NEC Corporation
- TAKAO YAMAZAKI
- G01 - MEASURING TESTING
Information Patent Application
INFRARED RAY SENSOR PACKAGE, INFRARED RAY SENSOR MODULE, AND ELECTR...
- Publication number 20130306868
- Publication date Nov 21, 2013
- NEC Corporation
- Takao YAMAZAKI
- G01 - MEASURING TESTING
Information Patent Application
ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND...
- Publication number 20130291380
- Publication date Nov 7, 2013
- NEC Corporation
- TAKAO YAMAZAKI
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME, WIRING BOARD...
- Publication number 20130234295
- Publication date Sep 12, 2013
- RENESAS ELECTRONICS CORPORATION
- Yoshimichi Sogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130078764
- Publication date Mar 28, 2013
- NEC AccessTechnica, Ltd.
- Takao YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONALLY INTEGRATED SEMICONDUCTOR DEVICE AND ELECTRONIC...
- Publication number 20120181683
- Publication date Jul 19, 2012
- TAKAO YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INFRARED SENSOR PACKAGE AND ELECTRONIC DEVICE EQUIPPED THEREWITH
- Publication number 20120138803
- Publication date Jun 7, 2012
- TAKAO YAMAZAKI
- G01 - MEASURING TESTING
Information Patent Application
VACUUM SEALED PACKAGE, PRINTED CIRCUIT BOARD HAVING VACUUM SEALED P...
- Publication number 20120106085
- Publication date May 3, 2012
- Takao Yamazaki
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20120028419
- Publication date Feb 2, 2012
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, WIRING BOARD...
- Publication number 20110304029
- Publication date Dec 15, 2011
- Yoshimichi Sogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20110140264
- Publication date Jun 16, 2011
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND...
- Publication number 20110114840
- Publication date May 19, 2011
- Takao Yamazaki
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, PR...
- Publication number 20110031610
- Publication date Feb 10, 2011
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE, MODULE, AND ELECTRONIC DEVICE
- Publication number 20100246144
- Publication date Sep 30, 2010
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE HAVING ELECTRONIC COMPONENTS MOUNTED THEREIN AND METHOD FOR...
- Publication number 20100188821
- Publication date Jul 29, 2010
- NEC Corporation
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20100025844
- Publication date Feb 4, 2010
- Takao Yamazaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS...
- Publication number 20090243075
- Publication date Oct 1, 2009
- NEC Corporation
- Shinji WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS...
- Publication number 20090244860
- Publication date Oct 1, 2009
- NEC Corporation
- Shinji WATANABE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE
- Publication number 20090174052
- Publication date Jul 9, 2009
- NEC Corporation
- Yoshimichi Sogawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
VACUUM PACKAGE AND MANUFACTURING PROCESS THEREOF
- Publication number 20090140146
- Publication date Jun 4, 2009
- NEC Corporation
- Yoshimichi SOGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Package Device, Module, and Electronic Apparatus
- Publication number 20090065921
- Publication date Mar 12, 2009
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical transceiver module and method for manufacturing same
- Publication number 20090010296
- Publication date Jan 8, 2009
- NEC Electronics Corporation
- Yasuhei Shimada
- G02 - OPTICS
Information Patent Application
Semiconductor Device and Method of Manufacturing Same, Wiring Board...
- Publication number 20080224271
- Publication date Sep 18, 2008
- NEC Corporation
- Yoshimichi Sogawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method Thereof, Semiconducto...
- Publication number 20080001288
- Publication date Jan 3, 2008
- Yoshimichi Sogawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Optical unit featuring both photoelectric conversion chip and semic...
- Publication number 20070210400
- Publication date Sep 13, 2007
- NEC Electronics Corporation
- Shigeru Moribayashi
- G02 - OPTICS
Information Patent Application
Semiconductor device and method for manufacturing the same, circuit...
- Publication number 20060055053
- Publication date Mar 16, 2006
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and laminated semiconductor package
- Publication number 20060049495
- Publication date Mar 9, 2006
- NEC Corporation
- Ichiro Hazeyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for packaging same
- Publication number 20040135264
- Publication date Jul 15, 2004
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same, circuit...
- Publication number 20040115920
- Publication date Jun 17, 2004
- NEC Corporation
- Takao Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked capacitor and method of forming the same as well as semicon...
- Publication number 20020088977
- Publication date Jul 11, 2002
- Toru Mori
- H01 - BASIC ELECTRIC ELEMENTS

Takao Yamazaki

Person

Patents Grantslast 30 patents

Infrared ray sensor package, infrared ray sensor module, and electr...

Method of manufacturing a three-dimensional packaging semiconductor...

Infrared sensor package and electronic device equipped therewith

Encapsulating package, printed circuit board, electronic device and...

Electronic device package, module, and electronic device

Semiconductor device

Semiconductor device and manufacturing method thereof

Mounting structure of semiconductor device and electronic apparatus...

Device having electronic components mounted therein and method for...

Mounting structure of semiconductor device and electronic apparatus...

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Electronic package device, module, and electronic apparatus

Vacuum package and manufacturing process thereof

Semiconductor device and method for manufacturing the same, circuit...

Optical unit featuring both photoelectric conversion chip and semic...

Semiconductor package and laminated semiconductor package

Semiconductor device and method for manufacturing the same, circuit...

Semiconductor device with decoupling capacitors mounted on conductors

Semiconductor device and method for packaging same

Semiconductor device, and thin film capacitor

Capacitor, capacitor mounting structure, method for manufacturing s...

Three-dimensional semiconductor device and method of manufacturing...

Patents Applicationslast 30 patents

VACUUM SEALED PACKAGE, PRINTED CIRCUIT BOARD HAVING VACUUM SEALED P...

INFRARED RAY SENSOR PACKAGE, INFRARED RAY SENSOR MODULE, AND ELECTR...

ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND...

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME, WIRING BOARD...

SEMICONDUCTOR DEVICE

THREE-DIMENSIONALLY INTEGRATED SEMICONDUCTOR DEVICE AND ELECTRONIC...

INFRARED SENSOR PACKAGE AND ELECTRONIC DEVICE EQUIPPED THEREWITH

VACUUM SEALED PACKAGE, PRINTED CIRCUIT BOARD HAVING VACUUM SEALED P...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF, WIRING BOARD...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

ENCAPSULATING PACKAGE, PRINTED CIRCUIT BOARD, ELECTRONIC DEVICE AND...

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, PR...

ELECTRONIC DEVICE PACKAGE, MODULE, AND ELECTRONIC DEVICE

DEVICE HAVING ELECTRONIC COMPONENTS MOUNTED THEREIN AND METHOD FOR...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS...

MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS...

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

VACUUM PACKAGE AND MANUFACTURING PROCESS THEREOF

Electronic Package Device, Module, and Electronic Apparatus

Optical transceiver module and method for manufacturing same

Semiconductor Device and Method of Manufacturing Same, Wiring Board...

Semiconductor Device and Manufacturing Method Thereof, Semiconducto...

Optical unit featuring both photoelectric conversion chip and semic...

Semiconductor device and method for manufacturing the same, circuit...

Semiconductor package and laminated semiconductor package

Semiconductor device and method for packaging same

Semiconductor device and method for manufacturing the same, circuit...

Stacked capacitor and method of forming the same as well as semicon...