Takashi Akiguchi

Person

Osaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package manufacturing method and semiconductor...
- Patent number 7,090,482
- Issue date Aug 15, 2006
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package of semiconductor device and method of manufacture thereof
- Patent number 6,780,668
- Issue date Aug 24, 2004
- Matsushita Electric Industrial Co., Ltd.
- Norihito Tsukahara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing article having electronic circuit
- Patent number 6,708,401
- Issue date Mar 23, 2004
- Matsushita Electric Industrial Co., Ltd.
- Hidenori Miyakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for mounting parts and making an IC card
- Patent number 6,357,106
- Issue date Mar 19, 2002
- Matsushita Electric Industrial Co., Ltd.
- Mitsumasa Oku
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for connecting electrodes of plasma display panel
- Patent number 6,086,441
- Issue date Jul 11, 2000
- Matsushita Electric Industrial Co., Ltd.
- Takashi Akiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging electronic chip component and method of bonding...
- Patent number 5,744,382
- Issue date Apr 28, 1998
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Kitayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic chip component with passivation film and organic protect...
- Patent number 5,646,439
- Issue date Jul 8, 1997
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Kitayama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for mounting electronic parts on a printed circuit board by...
- Patent number 5,427,642
- Issue date Jun 27, 1995
- Matsushita Electric Industrial Co., Ltd.
- Takashi Akiguchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for packaging electronic parts and adhesive for use in said...
- Patent number 5,137,936
- Issue date Aug 11, 1992
- Matsushita Electric Industrial Co., Ltd.
- Takashi Akiguchi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor device package manufacturing method and semiconductor...
- Publication number 20040130024
- Publication date Jul 8, 2004
- Norihito Tsukahara
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Article with electronic circuit formed and method of manufacturing...
- Publication number 20040078965
- Publication date Apr 29, 2004
- Hidenori Miyakawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Article with electronic circuit formed and method of manufacturing...
- Publication number 20020036898
- Publication date Mar 28, 2002
- Hidenori Miyakawa
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Method for mounting parts, and IC card and manufacturing method the...
- Publication number 20020026703
- Publication date Mar 7, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Mitsumasa Oku
- G06 - COMPUTING CALCULATING COUNTING

Takashi Akiguchi

Person

Patents Grantslast 30 patents

Semiconductor device package manufacturing method and semiconductor...

Package of semiconductor device and method of manufacture thereof

Method of manufacturing article having electronic circuit

Method for mounting parts and making an IC card

Method for connecting electrodes of plasma display panel

Method of packaging electronic chip component and method of bonding...

Electronic chip component with passivation film and organic protect...

Method for mounting electronic parts on a printed circuit board by...

Method for packaging electronic parts and adhesive for use in said...

Patents Applicationslast 30 patents

Semiconductor device package manufacturing method and semiconductor...

Article with electronic circuit formed and method of manufacturing...

Article with electronic circuit formed and method of manufacturing...

Method for mounting parts, and IC card and manufacturing method the...