Takashi Hisada

Person

Ritto-cho, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Injection molded solder head with improved sealing performance
- Patent number 12,166,008
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 12,142,603
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection between chips by bridge chip
- Patent number 12,094,825
- Issue date Sep 17, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of dripping of material for material injection
- Patent number 11,969,828
- Issue date Apr 30, 2024
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon handler with laser-release layers
- Patent number 11,908,723
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection between chips by bridge chip
- Patent number 11,848,272
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding of bridge to multiple semiconductor chips
- Patent number 11,735,575
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of dripping of material for material injection
- Patent number 11,684,988
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Forming of bump structure
- Patent number 11,329,018
- Issue date May 10, 2022
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of dripping of material for material injection
- Patent number 11,298,769
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,181,704
- Issue date Nov 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resist structure for forming bumps
- Patent number 11,164,845
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Eiji Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 11,112,570
- Issue date Sep 7, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembling of chips by stacking with rotation
- Patent number 10,991,685
- Issue date Apr 27, 2021
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,930,609
- Issue date Feb 23, 2021
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,840,202
- Issue date Nov 17, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,833,035
- Issue date Nov 10, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,797,011
- Issue date Oct 6, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,741,514
- Issue date Aug 11, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,692,829
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder bumping
- Patent number 10,615,143
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,607,956
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of high aspect ratio solder bumping with stud bu...
- Patent number 10,598,874
- Issue date Mar 24, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- G02 - OPTICS
Information Patent Grant
Reduction of stress in via structure
- Patent number 10,593,616
- Issue date Mar 17, 2020
- Tessera, Inc.
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,566,302
- Issue date Feb 18, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a solder bump structure
- Patent number 10,553,553
- Issue date Feb 4, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of stress in via structure
- Patent number 10,325,839
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming solder bumps
- Patent number 10,115,692
- Issue date Oct 30, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of solder balls with injection molded solder
- Patent number 10,103,118
- Issue date Oct 16, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded solder bumping
- Patent number 10,037,967
- Issue date Jul 31, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SOLDER VOLUME FOR FLIP-CHIP BONDING
- Publication number 20240282735
- Publication date Aug 22, 2024
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240112965
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Chinami Marushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INTERCONNECT STRUCTURE
- Publication number 20240006371
- Publication date Jan 4, 2024
- International Business Machines Corporation
- Keiji Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP
- Publication number 20230343713
- Publication date Oct 26, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINE-PITCH JOINING PAD STRUCTURE
- Publication number 20230317652
- Publication date Oct 5, 2023
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP INTERCONNECT PACKAGE
- Publication number 20230307307
- Publication date Sep 28, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP INTERCONNECT PACKAGE FINE JET UNDERFILL
- Publication number 20230307372
- Publication date Sep 28, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20230299067
- Publication date Sep 21, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE RESIST STRUCTURE FOR ELECTRODEPOSITION BONDING
- Publication number 20230245997
- Publication date Aug 3, 2023
- International Business Machines Corporation
- KOKI NAKAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF DRIPPING OF MATERIAL FOR MATERIAL INJECTION
- Publication number 20230241700
- Publication date Aug 3, 2023
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON HANDLER WITH LASER-RELEASE LAYERS
- Publication number 20230178404
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDERFILL VACUUM PROCESS
- Publication number 20230178445
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20230154887
- Publication date May 18, 2023
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP
- Publication number 20230051337
- Publication date Feb 16, 2023
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS
- Publication number 20220384412
- Publication date Dec 1, 2022
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF DRIPPING OF MATERIAL FOR MATERIAL INJECTION
- Publication number 20220193805
- Publication date Jun 23, 2022
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIST STRUCTURE FOR FORMING BUMPS
- Publication number 20210242164
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Eiji Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING OF BUMP STRUCTURE
- Publication number 20210125950
- Publication date Apr 29, 2021
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREVENTION OF DRIPPING OF MATERIAL FOR MATERIAL INJECTION
- Publication number 20200361013
- Publication date Nov 19, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ASSEMBLING OF CHIPS BY STACKING WITH ROTATION
- Publication number 20200227400
- Publication date Jul 16, 2020
- International Business Machines Corporation
- Takashi Hisada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
- Publication number 20200150361
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
- Publication number 20200150362
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200152590
- Publication date May 14, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER
- Publication number 20200075522
- Publication date Mar 5, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A SOLDER BUMP STRUCTURE
- Publication number 20200058612
- Publication date Feb 20, 2020
- International Business Machines Corporation
- Toyohiro Aoki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
REDUCTION OF STRESS IN VIA STRUCTURE
- Publication number 20190214339
- Publication date Jul 11, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...
- Publication number 20190131266
- Publication date May 2, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING SOLDER BUMPS
- Publication number 20180374812
- Publication date Dec 27, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF STRESS IN VIA STRUCTURE
- Publication number 20180294214
- Publication date Oct 11, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF STRESS IN VIA STRUCTURE
- Publication number 20180294213
- Publication date Oct 11, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS

Takashi Hisada

Person

Patents Grantslast 30 patents

Injection molded solder head with improved sealing performance

Bonding of bridge to multiple semiconductor chips

Interconnection between chips by bridge chip

Prevention of dripping of material for material injection

Silicon handler with laser-release layers

Interconnection between chips by bridge chip

Bonding of bridge to multiple semiconductor chips

Prevention of dripping of material for material injection

Forming of bump structure

Prevention of dripping of material for material injection

Fabrication method of high aspect ratio solder bumping with stud bu...

Resist structure for forming bumps

Fabrication method of high aspect ratio solder bumping with stud bu...

Assembling of chips by stacking with rotation

Method of forming a solder bump structure

Method of forming solder bumps

Method of forming solder bumps

Method of forming solder bumps

Fabrication of solder balls with injection molded solder

Method of forming a solder bump structure

Injection molded solder bumping

Method of forming a solder bump structure

Fabrication method of high aspect ratio solder bumping with stud bu...

Reduction of stress in via structure

Fabrication of solder balls with injection molded solder

Method of forming a solder bump structure

Reduction of stress in via structure

Method of forming solder bumps

Fabrication of solder balls with injection molded solder

Injection molded solder bumping

Patents Applicationslast 30 patents

SOLDER VOLUME FOR FLIP-CHIP BONDING

TRENCH STRUCTURE FOR SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INTERCONNECT STRUCTURE

INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP

FINE-PITCH JOINING PAD STRUCTURE

MULTICHIP INTERCONNECT PACKAGE

MULTICHIP INTERCONNECT PACKAGE FINE JET UNDERFILL

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

DOUBLE RESIST STRUCTURE FOR ELECTRODEPOSITION BONDING

PREVENTION OF DRIPPING OF MATERIAL FOR MATERIAL INJECTION

SILICON HANDLER WITH LASER-RELEASE LAYERS

UNDERFILL VACUUM PROCESS

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

INTERCONNECTION BETWEEN CHIPS BY BRIDGE CHIP

BONDING OF BRIDGE TO MULTIPLE SEMICONDUCTOR CHIPS

PREVENTION OF DRIPPING OF MATERIAL FOR MATERIAL INJECTION

RESIST STRUCTURE FOR FORMING BUMPS

FORMING OF BUMP STRUCTURE

PREVENTION OF DRIPPING OF MATERIAL FOR MATERIAL INJECTION

ASSEMBLING OF CHIPS BY STACKING WITH ROTATION

FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...

FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...

METHOD OF FORMING A SOLDER BUMP STRUCTURE

FABRICATION OF SOLDER BALLS WITH INJECTION MOLDED SOLDER

METHOD OF FORMING A SOLDER BUMP STRUCTURE

REDUCTION OF STRESS IN VIA STRUCTURE

FABRICATION METHOD OF HIGH ASPECT RATIO SOLDER BUMPING WITH STUD BU...

METHOD OF FORMING SOLDER BUMPS

REDUCTION OF STRESS IN VIA STRUCTURE

REDUCTION OF STRESS IN VIA STRUCTURE