Takashi Kariya

Person

Ibi-gun, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Printed wiring board for package-on-package
- Patent number 9,935,029
- Issue date Apr 3, 2018
- Ibiden Co., Ltd.
- Takashi Kariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring board having wiring structure for mounting multip...
- Patent number 9,893,016
- Issue date Feb 13, 2018
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, method for manufacturing the same and semicon...
- Patent number 9,706,663
- Issue date Jul 11, 2017
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,693,458
- Issue date Jun 27, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,578,745
- Issue date Feb 21, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board, method for manufacturing printed wiring board...
- Patent number 9,572,256
- Issue date Feb 14, 2017
- Ibiden Co., Ltd.
- Kazuhiro Yoshikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,532,468
- Issue date Dec 27, 2016
- Ibiden Co., Ltd.
- Masatoshi Kunieda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed wiring board
- Patent number 9,497,849
- Issue date Nov 15, 2016
- Ibiden Co., Ltd.
- Takashi Kariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flex-rigid wiring board and method for manufacturing flex-rigid wir...
- Patent number 9,480,173
- Issue date Oct 25, 2016
- Ibiden Co., Ltd.
- Teruyuki Ishihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board and method for manufacturing printed wiring board
- Patent number 9,307,645
- Issue date Apr 5, 2016
- Ibiden Co., Ltd.
- Yasuhiko Mano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board, inductor component, and method for manufactur...
- Patent number 9,287,034
- Issue date Mar 15, 2016
- Ibiden Co., Ltd.
- Yasuhiko Mano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inductor component and printed wiring board incorporating inductor...
- Patent number 9,265,158
- Issue date Feb 16, 2016
- Ibiden Co., Ltd.
- Yasuhiko Mano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,119,322
- Issue date Aug 25, 2015
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 9,066,435
- Issue date Jun 23, 2015
- Ibiden Co., Ltd.
- Makoto Terui
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,971,053
- Issue date Mar 3, 2015
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,908,387
- Issue date Dec 9, 2014
- Ibiden Co., Ltd.
- Yukinobu Mikado
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-dielectric sheet, a printed circuit board having the high-diel...
- Patent number 8,837,160
- Issue date Sep 16, 2014
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,829,355
- Issue date Sep 9, 2014
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with capacitor
- Patent number 8,730,647
- Issue date May 20, 2014
- Ibiden Co., Ltd.
- Yasuhiko Mano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High-dielectric sheet, a printed circuit board having the high-diel...
- Patent number 8,707,552
- Issue date Apr 29, 2014
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board and method for manufacturing the same
- Patent number 8,654,538
- Issue date Feb 18, 2014
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board with crossing wiring pattern
- Patent number 8,629,550
- Issue date Jan 14, 2014
- Ibiden Co., Ltd.
- Naohiro Hirose
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed wiring board
- Patent number 8,563,420
- Issue date Oct 22, 2013
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat resistant substrate incorporated circuit wiring board
- Patent number 8,541,691
- Issue date Sep 24, 2013
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat resistant substrate incorporated circuit wiring board
- Patent number 8,507,806
- Issue date Aug 13, 2013
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed circuit board manufacturing method
- Patent number 8,453,323
- Issue date Jun 4, 2013
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer printed circuit board and multilayer printed circuit boa...
- Patent number 8,438,727
- Issue date May 14, 2013
- Ibiden Co., Ltd.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic component and method for manufacturing the same
- Patent number 8,415,781
- Issue date Apr 9, 2013
- Ibiden Co., Ltd.
- Takashi Kariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing printed wiring board with component mountin...
- Patent number 8,409,461
- Issue date Apr 2, 2013
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate for mounting semiconductor element and method for manufac...
- Patent number 8,395,054
- Issue date Mar 12, 2013
- Ibiden Co., Ltd.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD FOR PACKAGE-ON-PACKAGE
- Publication number 20160268188
- Publication date Sep 15, 2016
- IBIDEN CO., LTD.
- Takashi KARIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR COMPONENT AND PRINTED WIRING BOARD
- Publication number 20160217911
- Publication date Jul 28, 2016
- IBIDEN CO., LTD.
- Yasuhiko MANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20160105960
- Publication date Apr 14, 2016
- IBIDEN CO., LTD.
- Hajime SAKAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICON...
- Publication number 20160066422
- Publication date Mar 3, 2016
- IBIDEN CO., LTD.
- Hajime Sakamoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20160042861
- Publication date Feb 11, 2016
- IBIDEN CO., LTD.
- Yasuhiko MANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CIRCUIT APPARATUS AND METHOD FOR MANUFACTURING ELECTRONI...
- Publication number 20150366102
- Publication date Dec 17, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150264817
- Publication date Sep 17, 2015
- IBIDEN CO., LTD.
- Makoto TERUI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...
- Publication number 20150250054
- Publication date Sep 3, 2015
- IBIDEN CO., LTD.
- Kazuhiro YOSHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150245485
- Publication date Aug 27, 2015
- IBIDEN CO., LTD.
- Nobuya TAKAHASHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20150213946
- Publication date Jul 30, 2015
- IBIDEN CO., LTD.
- Yasuhiko MANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20150136459
- Publication date May 21, 2015
- IBIDEN CO., LTD.
- Masatoshi KUNIEDA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIR...
- Publication number 20150114689
- Publication date Apr 30, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIR...
- Publication number 20150114690
- Publication date Apr 30, 2015
- IBIDEN CO., LTD.
- Teruyuki ISHIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...
- Publication number 20150098204
- Publication date Apr 9, 2015
- IBIDEN CO., LTD.
- Kazuhiro YOSHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...
- Publication number 20150092357
- Publication date Apr 2, 2015
- IBIDEN CO., LTD.
- Kazuhiro YOSHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...
- Publication number 20150092356
- Publication date Apr 2, 2015
- IBIDEN CO., LTD.
- Kazuhiro YOSHIKAWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150060124
- Publication date Mar 5, 2015
- IBIDEN CO., LTD.
- Makoto TERUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150060127
- Publication date Mar 5, 2015
- IBIDEN CO., LTD.
- Makoto TERUI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20150026975
- Publication date Jan 29, 2015
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150022982
- Publication date Jan 22, 2015
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140347837
- Publication date Nov 27, 2014
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND PRINTED WIR...
- Publication number 20140159851
- Publication date Jun 12, 2014
- IBIDEN CO., LTD.
- Yasuhiko MANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140133119
- Publication date May 15, 2014
- IBIDEN CO., LTD.
- Takashi Kariya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140102768
- Publication date Apr 17, 2014
- IBIDEN CO., LTD.
- Yoshinori SHIZUNO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD
- Publication number 20140020940
- Publication date Jan 23, 2014
- Yasuhiko MANO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20140014399
- Publication date Jan 16, 2014
- IBIDEN CO., LTD.
- Takashi KARIYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130258625
- Publication date Oct 3, 2013
- IBIDEN CO., LTD.
- Makoto Terui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED WIRING BOARD, INDUCTOR COMPONENT, AND METHOD FOR MANUFACTUR...
- Publication number 20130223033
- Publication date Aug 29, 2013
- IBIDEN CO., LTD.
- Yasuhiko MANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20130194764
- Publication date Aug 1, 2013
- IBIDEN CO., LTD.
- Yukinobu MIKADO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER PRINTED WIRING BOARD
- Publication number 20120302010
- Publication date Nov 29, 2012
- IBIDEN CO., LTD.
- Takashi Kariya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Takashi Kariya

Person

Patents Grantslast 30 patents

Printed wiring board for package-on-package

Multilayer wiring board having wiring structure for mounting multip...

Printed wiring board, method for manufacturing the same and semicon...

Printed wiring board, method for manufacturing printed wiring board...

Printed wiring board, method for manufacturing printed wiring board...

Printed wiring board, method for manufacturing printed wiring board...

Printed wiring board and method for manufacturing printed wiring board

Printed wiring board

Flex-rigid wiring board and method for manufacturing flex-rigid wir...

Printed wiring board and method for manufacturing printed wiring board

Printed wiring board, inductor component, and method for manufactur...

Inductor component and printed wiring board incorporating inductor...

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

Wiring board and method for manufacturing the same

High-dielectric sheet, a printed circuit board having the high-diel...

Multilayer printed wiring board

Printed wiring board with capacitor

High-dielectric sheet, a printed circuit board having the high-diel...

Wiring board and method for manufacturing the same

Printed wiring board with crossing wiring pattern

Multilayer printed wiring board

Heat resistant substrate incorporated circuit wiring board

Heat resistant substrate incorporated circuit wiring board

Printed circuit board manufacturing method

Multilayer printed circuit board and multilayer printed circuit boa...

Electronic component and method for manufacturing the same

Method of manufacturing printed wiring board with component mountin...

Substrate for mounting semiconductor element and method for manufac...

Patents Applicationslast 30 patents

PRINTED WIRING BOARD FOR PACKAGE-ON-PACKAGE

INDUCTOR COMPONENT AND PRINTED WIRING BOARD

MULTILAYER WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING THE SAME AND SEMICON...

PRINTED WIRING BOARD

ELECTRONIC CIRCUIT APPARATUS AND METHOD FOR MANUFACTURING ELECTRONI...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIR...

FLEX-RIGID WIRING BOARD AND METHOD FOR MANUFACTURING FLEX-RIGID WIR...

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...

PRINTED WIRING BOARD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD...

COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

COMBINED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

INDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, AND PRINTED WIR...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PRINTED WIRING BOARD

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

PRINTED WIRING BOARD, INDUCTOR COMPONENT, AND METHOD FOR MANUFACTUR...

WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

MULTILAYER PRINTED WIRING BOARD